North America Potting and Encapsulating Compounds Market, By Type (Epoxy, Polyurethane, Silicone, Polyester System, Polyamide, Polyolefin and Others), Substrate Type (Glass, Metal, Ceramic, Others), Function (Electrical Insulation, Heat Dissipation, Corrosion Protection, Shock Resistance, Chemical Protection, Others), Curing Technique (Room Temperature Cured, High Temperature or Thermally Cured, UV Cured), Distribution Channel ( Offline, Online), Application (Electronics, Electrical) and End-User industry (Electronics, Automotive, Aerospace, Marine, Energy & Power, Telecommunication, Healthcare, Others), Country (U.S., Canada, Mexico), Industry Trends and Forecast to 2028.
Market Analysis and Insights: North America Potting and Encapsulating Compounds Market
North America potting and encapsulating compounds market is expected to gain market growth in the forecast period of 2021 to 2028. Data Bridge Market Research analyses that the market is growing at a CAGR of 4.1% in the forecast period of 2021 to 2028 and expected to reach USD 907,011.37 million by 2028.
Potting is the process of filling a complete electronic assembly with a solid or gelatinous compound such as acrylic, silicone, or resins and improves vibration and shock resistance, protecting against corrosive substances and dampness. On the other hand, encapsulation uses a reusable mold to build a frame around an item and fill the gap between the frame and the object with chemicals. Encapsulation's primary function is to build a protective shell around the electronic assembly.
Increased consumer spending throughout the world is accelerating the expansion of the electronics sector. Consumer demand for electronics rises in response to the growth of developing countries. Electronics-producing countries have large customer bases who can afford innovative electronic items, resulting to a growth of North America potting and encapsulating compounds market.
This potting and encapsulating compounds market report provides details of market share, new developments, and product pipeline analysis, impact of domestic and localised market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, product approvals, strategic decisions, product launches, geographic expansions, and technological innovations in the market. To understand the analysis and the market scenario contact us for an Analyst Brief, our team will help you create a revenue impact solution to achieve your desired goal.
North America Potting and Encapsulating Compounds Market Scope and Market Size
North America potting and encapsulating compounds market is segmented of the categorized into type, substrate type, function, curing technique, distribution channel, application, and end-user. The growth among segments helps you analyse niche pockets of growth and strategies to approach the market and determine your core application areas and the difference in your target markets.
- On the basis of type, North America potting and encapsulating compounds market are segmented into epoxy, polyurethane, silicone, polyester, polyamide, polyolefin and others. In North America, the demand for the epoxy segment is increasing as these products provide more durability for making potting compounds.
- On the basis of substrate type, North America potting and encapsulating compounds market is segmented into glass, metal, ceramic and others. In North America, metal substrate type is dominating as metal has an excellent strength to bear any environmental difficulties.
- On the basis of function, North America potting and encapsulating compounds market is segmented into electrical insulation, heat dissipation, corrosion protection, shock resistance, chemical protection and others. In North America, the electrical insulation segment is dominating the market due to an increase in the demand for more moisture-retentive potting compounds in the region.
- On the basis of curing technique, North America potting and encapsulating compounds market is segmented into room temperature cured, high temperature or thermally cured and UV cured. In North America, UV cured segment is dominating the market due to an increase in the demand for more corrosion retentive potting compounds in the region.
- On the basis of distribution channel, North America potting and encapsulating compounds market is segmented into offline and online. In North America, the offline segment is dominating the market due to an increased need to create awareness among the consumers in the region.
- On the basis of application, North America potting and encapsulating compounds market is segmented into electronics and electrical. In North America, the electrical segment is dominating the market due to the increased demand for more cost-effective potting compounds in the region.
- On the basis of end-use, North America potting and encapsulating compounds market is segmented into electronics, automotive, aerospace, marine, energy & power, telecommunication, healthcare, and others. In North America, the electronics sector is dominating the market due to an increase in the construction of railways in the region.
North America Potting and Encapsulating Compounds Market Country Level Analysis
North America potting and encapsulating compounds market is analysed and market size information is provided by country, type, substrate type, function, curing technique, distribution channel, application, and end-user.
The countries covered in North America potting and encapsulating compounds market report are U.S., Canada and Mexico.
- In North America, U.S. is expected to dominate due to the increased demand for more durable electronic devices which are used in most of the industries.
The country section of the report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as new sales, replacement sales, country demographics, regulatory acts and import-export tariffs are some of the major pointers used to forecast the market scenario for individual countries. Also, presence and availability of North America brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of sales channels are considered while providing forecast analysis of the country data.
Growth in Consumer Electronics Sector
Increased consumer spending throughout the world is accelerating the expansion of the electronics sector. Consumer demand for electronics rises in response to the growth of developing countries. Electronics-producing countries have large customer bases who can afford innovative electronic items, resulting to a growth of North America potting and encapsulating compounds market.
Competitive Landscape and Potting and Encapsulating Compounds Market Share Analysis
North America potting and encapsulating compounds market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, North America presence, production sites and facilities, company strengths and weaknesses, product launch, clinical trials pipelines, brand analysis, product approvals, patents, product width and breath, application dominance, technology lifeline curve. The above data points provided are only related to the company’s focus related to North America potting and encapsulating compounds market.
The major market players engaged in the global potting and encapsulating compounds market are Wacker Chemie AG, CHT Germany GmbH, Showa Denko Materials Co., Ltd. (A Subsidiary of Hitachi, Ltd.), 3M, Electrolube, Epoxies Etc., Dymax, Master Bond Inc., DELO, ALTANA, EFI POLYMERS, Epic Resins, MG Chemicals, Nagase America LLC., DuPont, Avantor, Inc., United Resin Corporation, Copps Industries, Aremco, Creative Materials Inc., Henkel AG & Co. KGaA, GS Polymers, RBC Industries, Inc, PARKER HANNIFIN CORP, Panacol-USA (A subsidiary of Dr. Hönle AG), Momentive, HERNON MANUFACTURING INC., and ITW Performance Polymers among others.
For instance,
- In May 2020, Electrolube revealed the success of its ER2221 resin, which is used to safeguard EV batteries in India's most popular two-wheeler cars. The product launch was implemented to assist their Indian customers to help them to improve thermal management issues.
- In October 2020, Epoxies Etc. formulated a new epoxy product, 20-3305, which was developed to withstand high-voltage electronic needs and protects electronic assemblies from heat cycling and stress. This product was launched to bring a variety to their product portfolio in terms of thermal shock resistance.
- In April 2021, Master Bond Inc. launched a new product, MasterSil 153AO, an adding cured two-part silicone with a self-priming property with a thermally conductive and electrically insulating structure. The product launch was made to bring variety to their existing product portfolio.
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