Asia-Pacific Thin-Film Encapsulation Market, By Deposition Technologies (Inorganic Layers, Organic Layers), Flexible OLED Design (Cathode, Anode), Application (Flexible OLED Display, Flexible OLED Lighting, Thin-Film Photovoltaics, Others), Country (Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific) Industry Trends and Forecast to 2028.
Market Analysis and Insights : Asia-Pacific Thin-Film Encapsulation Market
The thin-film encapsulation market is expected to witness market growth at a rate of 26.10% in the forecast period of 2021 to 2028 and is further estimated to reach USD 91,609.31 million by 2028. Data Bridge Market Research report on thin-film encapsulation market provides analysis and insights regarding the various factors expected to be prevalent throughout the forecast period while providing their impacts on the market's growth. The rise in the popularity of thin-film encapsulation using inkjet printing technology is escalating the growth of thin-film encapsulation market.
Thin-film encapsulation can be referred to as a technology which confirms the protection of flexible devices from moisture, water and other contaminated element. It can be deposited through an organic layer and through an inorganic layer.
Major factors that are expected to boost the growth of the thin-film encapsulation market in the forecast period are the rise in the demand for thin-film barrier in flexible and organic devices. Furthermore, the growing demand for thin-film barrier in flexible and organic devices is further anticipated to propel the growth of the thin-film encapsulation market. On the other hand, the advancement of flexible glass is further projected to impede the growth of the thin-film encapsulation market in the timeline period.
In addition, the investments in OLED technology and manufacturing facilities will further provide potential opportunities for the growth of the thin-film encapsulation market in the coming years. However, the need for technical knowhow and protection of intellectual properties which might further challenge the thin-film encapsulation market in the near future.
This North America thin-film encapsulation market report provides details of new recent developments, trade regulations, import export analysis, production analysis, value chain optimization, market share, impact of domestic and localised market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographical expansions, technological innovations in the market. To gain more info on North America thin-film encapsulation market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Asia-Pacific Thin-Film Encapsulation Market Scope and Market Size
North America thin-film encapsulation market is segmented on the basis of deposition technologies, flexible OLED design and application. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target market.
- Based on deposition technologies, the thin-film encapsulation market is segmented into inorganic layers and organic layers. Inorganic layers have been further sub-segmented into plasma-enhanced chemical vapor deposition (PECVD) and atomic layer deposition (ALD). Organic layers have been further sub-segmented into inkjet printing and vacuum thermal printing.
- The thin-film encapsulation market on the basis of flexible OLED design is segmented into cathode and anode.
- Based on application, the thin-film encapsulation market is segmented into flexible OLED display, flexible OLED lighting, thin-film photovoltaics and others. Flexible OLED display has been further sub-segmented into smartphones, smart wearables, television and large format display.
Thin-Film Encapsulation Market Country Level Analysis
The thin-film encapsulation market is analysed and market size, volume information is provided by country, deposition technologies, flexible OLED design and application as referenced above.
The countries covered in the thin-film encapsulation market report are Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC).
The country section of the thin-film encapsulation market report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as consumption volumes, production sites and volumes, import export analysis, price trend analysis, cost of raw materials, down-stream and upstream value chain analysis are some of the major pointers used to forecast the market scenario for individual countries. Also, presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Thin-Film Encapsulation Market Share Analysis
The thin-film encapsulation market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to thin-film encapsulation market.
The major players covered in thin-film encapsulation market report are AMS Group, Glaston Corporation, Meyer Burger Technology AG, Beneq, Rolic Technologies AG, Veeco Instruments Inc., MBRAUN, SAES Getters S.p.A., Picosun Oy., Angstrom Engineering Inc., KANEKA CORPORATION, Kyoritsu Chemical & Co., Ltd., SNU PRECISION CO., LTD., SAMSUNG SDI CO. ,LTD., LG Chem., UNIVERSAL DISPLAY, Applied Materials, Inc., Kateeva and 3M, among others. DBMR analysts understand competitive strengths and provide competitive analysis for each competitor separately.
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