Global thin film encapsulation market is expected to grow at a healthy CAGR of 28.4% in the forecast period of 2019 to 2026.
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Drivers: Global Thin-Film Encapsulation Market
- Rapid increase in demand for smartphones and smart wearables
- Rising need for thin-film barrier in flexible and organic devices
Restraint
- Presence of substitute and alternate technology
Opportunity
- Increasing need and rising investment for OLED in smartphones and smart watch
Challenge
- Lack of professional skills for proper applicability
Market Trends
- On the basis of deposition technologies, the market is segmented into inorganic layers and organic layers.
- On the basis of flexible OLED design, the market is segmented into cathode and anode. The cathode segment is expected to grow at the highest CAGR in the forecast period of 2019 to 2026.
- On the basis of application, the market is segmented into flexible OLED display, flexible OLED lighting, thin-film photovoltaics and others.
Major Players: Global Thin-Film Encapsulation Market
Some of the prominent participants operating in this market are:
- BYSTRONIC GLASS
- Meyer Burger Technology AG
- AMS Technologies AG
- Beneq
- MBRAUN
- Veeco Instruments Inc.
- ROLIC technologies
- SAES Getters S.p.A.
- Picosun Oy.
- Angstrom Engineering Inc.
- KANEKA CORPORATION
- SNU Precision Co., Ltd.
- Kyoritsu Chemical & Co.,Ltd.
- SAMSUNG SDI CO.,LTD.
- LG Chem
- UNIVERSAL DISPLAY
- 3M
- Applied Materials, Inc.
- Kateeva
- Areesys Corporation