北美 SiC 功率半导体市场 – 行业趋势和 2031 年预测

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北美 SiC 功率半导体市场 – 行业趋势和 2031 年预测

  • Semiconductors and Electronics
  • Upcoming Report
  • Jun 2024
  • North America
  • 350 页面
  • 桌子數: 220
  • 图号: 60

North America Sic Power Semiconductor Market

市场规模(十亿美元)

CAGR :  % Diagram

Diagram Forecast Period
2024 –2031
Diagram Market Size (Base Year)
USD 258,525.40 Thousand
Diagram Market Size (Forecast Year)
USD 1,663,328.61 Thousand
Diagram CAGR
%
Diagram Major Markets Players
  • WOLFSPEED
  • STMicroelectronics
  • ROHM CO.
  • Fuji Electric Co.
  • Mitsubishi Electric Corporation

北美 SiC 功率半导体市场,按类型(MOSFET、混合模块、肖特基势垒二极管 (SBDS)、IGBT、双极结型晶体管 (BJT)、Pin 二极管、结型场效应晶体管 (JFET) 等)、电压范围(301-900 V、901-1700 V 及 1701 V 以上)、晶圆尺寸(6 英寸、4 英寸、2 英寸和 6 英寸以上)、晶圆类型(SiC 外延晶圆和空白 SiC 晶圆)、应用(电动汽车 (EV)、光伏、电源、工业电机驱动器、电动汽车充电基础设施、射频设备等)、垂直(汽车、公用事业和能源、工业、交通运输、IT 和电信、消费电子、航空航天和国防、商业等)– 行业趋势和预测到 2031 年。

北美 SiC 功率半导体市场

北美 SiC 功率半导体市场分析和规模

在电动汽车 (EV)中,碳化硅 (SiC) 功率半导体发挥着至关重要的作用,可显著提高逆变器、车载充电器和 DC-DC 转换器等电力电子系统的效率。与传统的硅基半导体相比,SiC 元件可实现更快的切换、更低的能量损耗和更好的热管理。这可增加行驶里程、减小电池尺寸并提高车辆的整体性能。电动汽车采用 SiC 技术是出于对更高效、更紧凑、更可靠的电源解决方案的需求,使其成为日益增长的电动汽车市场中的关键应用。

2023 年北美 SiC 功率半导体市场规模为 2,58,525.40 万美元,预计到 2031 年将达到 16,63,328.61 万美元,2024 年至 2031 年预测期内的复合年增长率为 26.2%。

除了对市场价值、增长率、细分、地理覆盖范围和主要参与者等市场情景的见解之外,Data Bridge Market Research 策划的市场报告还包括深入的专家分析、按地理位置表示的公司生产和产能、分销商和合作伙伴的网络布局、详细和更新的价格趋势分析以及供应链和需求的赤字分析。

报告范围和市场细分       

报告指标

细节

预测期

2024-2031

基准年

2023

历史岁月

2022 (可定制为 2016-2021)

定量单位

收入(单位:十亿美元)、销量(单位:台)、定价(美元)

涵盖的领域

类型(MOSFET、混合模块、肖特基势垒二极管 (SBDS)、IGBT、双极结型晶体管 (BJT)、Pin 二极管、结型场效应晶体管 (JFET) 等)、电压范围(301-900 V、901-1700 V 及 1701 V 以上)、晶圆尺寸(6 英寸、4 英寸、2 英寸和 6 英寸以上)、晶圆类型(SiC 外延晶圆和空白 SiC 晶圆)、应用(电动汽车 (EV)、光伏、电源、工业电机驱动器、电动汽车充电基础设施、射频设备等)、垂直(汽车、公用事业和能源、工业、交通运输、IT 和电信、消费电子、航空航天和国防、商业等)。

覆盖国家

美国、加拿大和墨西哥

涵盖的市场参与者

WOLFSPEED, INC.(美国)、意法半导体(瑞士)、罗姆株式会社(日本)、富士电机株式会社(日本)、三菱电机株式会社(日本)、德州仪器公司(美国)、英飞凌科技股份公司(德国)、西米控丹佛斯(德国)、瑞萨电子株式会社(日本)、东芝电子元件与存储株式会社(日本)、Microchip Technology Inc.(美国)、Semiconductor Components Industries, LLC (onsemi)(美国)、恩智浦半导体(荷兰)、UnitedSiC(美国)、SemiQ Inc.(美国)、Littelfuse, Inc.(美国)、Allegro MicroSystems, Inc.(美国)、日立功率半导体设备有限公司(日本)、GeneSiC Semiconductor Inc.(美国)等

市场机会

  • 工业4.0高度兴起
  • 全球化日益发展

市场定义

碳化硅 (SiC) 功率半导体是用碳化硅材料制成的先进电子元件。它们比传统的硅基半导体具有更优异的性能,包括更高的效率、更快的开关速度和更高的热导率。这些特性使 SiC 功率半导体成为电动汽车、可再生能源系统和工业设备等高功率和高温应用的理想选择。

SiC 功率半导体市场动态

驱动程序

  • 可再生能源不断进步

SiC 元件对于提高太阳能逆变器和风力涡轮机中电力转换系统的效率和可靠性至关重要。它们的性能优于传统的硅基半导体,可实现更高效的能源转换、更高的功率密度和更好的热管理。随着可再生能源系统的部署不断增加以满足全球可持续发展目标,对 SiC 半导体的需求也在增加,从而推动了市场增长并支持向更清洁能源的过渡。

  • 不断 改善的电网

SiC technology is crucial for enhancing the efficiency and reliability of power grid systems, particularly in high-voltage direct current (HVDC) applications and smart grids. SiC semiconductors enable more efficient power conversion, reduce energy losses, and improve thermal management compared to traditional silicon-based components. This results in more stable and efficient power distribution, supports the integration of renewable energy sources, and meets the growing demand for electricity in an environmentally sustainable manner. Consequently, the adoption of SiC technology in power grids is expanding, driving market growth.

Opportunities

  • Growing Adoption of Silicon Carbide (SiC) Power Semiconductors

Industries rely on efficient power electronics for various applications such as motor drives, power supplies, and inverters. SiC devices offer superior performance characteristics, including higher efficiency, faster switching speeds, and better thermal conductivity compared to traditional silicon-based semiconductors. This enables industrial equipment to operate more efficiently, resulting in energy savings, reduced maintenance costs, and enhanced reliability. As industries seek to improve productivity and sustainability, the demand for SiC power semiconductors in industrial applications continues to rise, driving market growth.

  • Growing Government Initiatives

Many governments worldwide are implementing policies and incentives to promote the adoption of electric vehicles (EVs) and renewable energy technologies. These initiatives include subsidies, tax incentives, and regulatory mandates aimed at reducing carbon emissions and promoting energy efficiency. Additionally, governments are investing in research and development programs to support the advancement of SiC technology, making it more accessible and cost-effective for various applications. Such support fosters innovation and accelerates the deployment of SiC power semiconductors across industries, thereby stimulating market growth.

Restraints/Challenges

  • High Initial Costs

Compared to traditional silicon-based semiconductors, the manufacturing processes and materials required for SiC technology incur higher upfront investments. These elevated costs can deter potential adopters, especially in industries with stringent budget constraints or where cost-effectiveness is paramount. Additionally, the higher cost of SiC devices may lengthen the return on investment period for end-users, impacting their willingness to transition to SiC technology.

  • High Integration Challenges

The transition from traditional silicon-based technologies to SiC requires modifications or redesigns of existing systems and infrastructure, which can be complex and costly. Integrating SiC devices may necessitate changes in circuit designs, thermal management systems, and control algorithms, adding complexity to the integration process. Compatibility issues with existing components and subsystems may also arise, requiring thorough testing and validation. Retrofitting SiC technology into legacy systems can be challenging due to differences in electrical characteristics and form factors, limiting its adoption in certain applications and industries.

This market,  report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the market, contact data bridge market research for an analyst brief, our team will help you take an informed market decision to achieve market growth.

Impact and Current Market Scenario of Raw Material Shortage and Shipping Delays

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Apart from the standard report, we also offer in-depth analysis of the procurement level from forecasted shipping delays, distributor mapping by region, commodity analysis, production analysis, price mapping trends, sourcing, category performance analysis, supply chain risk management solutions, advanced benchmarking, and other services for procurement and strategic support.

Expected Impact of Economic Slowdown on the Pricing and Availability of Products

When economic activity slows, industries begin to suffer. The forecasted effects of the economic downturn on the pricing and accessibility of the products are taken into account in the market insight reports and intelligence services provided by DBMR. With this, our clients can typically keep one step ahead of their competitors, project their sales and revenue, and estimate their profit and loss expenditures.

Recent Developments

  • In December 2022, STMicroelectronics and Soitec announced the next stage of their cooperation on Silicon Carbide (SiC) substrates, with ST planning to qualify Soitec's SiC substrate technology over the next 18 months. This collaboration aims for the adoption of Soitec's SmartSiC technology for ST's future 200mm substrate manufacturing, supporting its devices and modules manufacturing. The volume production is expected in the midterm, potentially boosting ST's financials and contributing to the growth of the North America SiC power semiconductor market
  • In July 2022, Semikron Danfoss and ROHM Semiconductor, after a decade-long collaboration, advanced their partnership with the qualification of ROHM's latest 4th generation SiC MOSFETs in SEMIKRON's eMPack modules for automotive applications. This collaboration serves global customer needs, enhances both companies' financials, and positively impacts the North America SiC power semiconductor market
  • In August 2022, Toshiba Corporation launched its 3rd generation 650V and 1200V silicon carbide MOSFETs, which achieve a 20% reduction in switching losses in industrial equipment. This innovation aims to improve the efficiency and performance of industry

SiC Power Semiconductor Market Scope

The market is segmented on the basis of type, voltage range, wafer size, wafer type, application, and vertical. The growth amongst these segments will help you analyze meager growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

Type

  • MOSFETS
  • Hybrid Modules
  • Schottky Barrier Diodes (SBDS)
  • IGBT
  • Bipolar Junction Transistor (BJT)
  • Pin Diode
  • Junction FET (JFET)
  • Others

Voltage Range

  • 301-900 V
  • 901-1700 V
  • Above 1701 V

Wafer Size

  • 6 Inch
  • 4 Inch
  • 2 Inch
  • Above 6 Inch

Wafer Type

  • SiC epitaxial wafers
  • Blank SiC wafers

Application

  • Electric Vehicles (EV)
  • Photovoltaics
  • Power supplies
  • Industrial motor drives
  • EV charging infrastructure
  • RF Devices
  • Others

Vertical

  • Automotive
  • Utilities and energy
  • Industrial
  • Transportation
  • IT and telecommunication
  • Consumer electronics
  • Aerospace and defense
  • Commercial
  • Others

North America SiC Power Semiconductor Market Analysis/Insights

The market is analysed and market size, volume information is provided by region, type, voltage range, wafer size, wafer type, application, and vertical as referenced above.

The countries covered in the market report are U.S., Canada, Mexico, Brazil, Argentina and Rest of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Rest of Europe in Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA).

由于对 SiC 功率半导体产品的需求巨大,美国预计将主导市场。对​​功率模块和相关设备的高需求预计将推动市场增长,使美国成为该行业扩张的关键参与者。

报告的国家部分还提供了影响单个市场因素和国内市场监管变化,这些因素和变化会影响市场的当前和未来趋势。下游和上游价值链分析、技术趋势和波特五力分析、案例研究等数据点是用于预测单个国家市场情景的一些指标。此外,在提供国家数据的预测分析时,还考虑了全球品牌的存在和可用性以及它们因来自本地和国内品牌的大量或稀缺竞争而面临的挑战、国内关税和贸易路线的影响。

竞争格局和 SiC 功率半导体市场份额分析

市场竞争格局按竞争对手提供详细信息。详细信息包括公司概况、公司财务状况、产生的收入、市场潜力、研发投资、新市场计划、全球影响力、生产基地和设施、生产能力、公司优势和劣势、产品发布、产品宽度和广度、应用主导地位。以上提供的数据点仅与公司对市场的关注有关。

市场上的一些主要参与者包括

  • WOLFSPEED, INC.(美国)
  • 意法半导体(瑞士)
  • 罗姆株式会社(日本)
  • 富士电机株式会社(日本)
  • 三菱电机株式会社(日本)
  • 德州仪器公司(美国)
  • 英飞凌科技股份公司(德国)
  • 赛米控丹佛斯(德国)
  • 瑞萨电子株式会社(日本)
  • 东芝电子元件及存储株式会社(日本)
  • Microchip Technology Inc.(美国)
  • 半导体元件工业有限责任公司(美国)
  • 恩智浦半导体(荷兰)
  • UnitedSiC(美国)
  • SemiQ Inc.(美国)
  • Littelfuse, Inc.(美国)
  • Allegro MicroSystems, Inc.(美国)
  • 日立功率半导体器件有限公司(日本)
  • GeneSiC Semiconductor Inc.(美国)


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Frequently Asked Questions

The market is segmented based on North America SiC Power Semiconductor Market, By Type (MOSFETS, Hybrid Modules, Schottky Barrier Diodes (SBDS), IGBT, Bipolar Junction Transistor (BJT), Pin Diode, Junction FET (JFET), and Others), Voltage Range (301-900 V, 901-1700 V, and Above 1701 V), Wafer size (6 Inch, 4 Inch, 2 Inch, and Above 6 Inch), Wafer type (SiC Epitaxial Wafers, and Blank SiC Wafers), Application (Electric Vehicles (EV), Photovoltaics, Power Supplies, Industrial Motor Drives, EV Charging Infrastructure, RF Devices, and Others), Vertical (Automotive, Utilities and Energy, Industrial, Transportation, IT and Telecommunication, Consumer Electronics, Aerospace and Defense, Commercial, and Others) – Industry Trends and Forecast to 2031. .
The North America Sic Power Semiconductor Market size was valued at USD 258525.40 USD Thousand in 2023.
The North America Sic Power Semiconductor Market is projected to grow at a CAGR of 26.2% during the forecast period of 2024 to 2031.
The major players operating in the market include WOLFSPEED, STMicroelectronics , ROHM CO. , Fuji Electric Co. , Mitsubishi Electric Corporation , Texas Instruments ,orporated , Infineon Technologies AG , Semikron Danfoss , Renesas Electronics Corporation , TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION , Microchip Technology , Semiconductor Components Industries, , NXP Semiconductors , UnitedSiC , SemiQ , Littelfuse, Allegro MicroSystems, Hitachi Power Semiconductor Device, GeneSiC Semiconductor among others.
The market report covers data from the U.S., Canada, and Mexico.