>中东和非洲 Wi-Fi 芯片组市场，按设备（智能手机、联网家庭设备、接入点设备、个人电脑、平板电脑等）、频段（单频段、双频段、三频段）、制造技术（FinFET、FDSOI CMOS、绝缘体上硅 (SOI) 和 Sige）、Wi-Fi 标准（802.11n、802.11ac、Wave 2、802.11ac、Wave 1、802.11ax、802.11ad、802.11ay、802.11b、802.11g、其他）、芯片尺寸（28nm、20nm、14nm、10nm 等）、MIMO 配置（MU-MIMO、4x4 MU-MIMO、8x8 MU-MIMO、SU-MIMO、3x3 MU-MIMO、2x2 MU-MIMO、1x1 MU-MIMO）、最终用户（消费者、汽车和运输、医疗保健、教育、BFSI、旅游和酒店、其他）、国家（阿联酋、沙特阿拉伯、埃及、南非、以色列、中东和非洲其他地区）- 行业趋势和预测到 2028 年。
Wi-Fi 芯片组市场分析及洞察
预计 Wi-Fi 芯片组市场将在 2021 年至 2028 年的预测期内实现市场增长。Data Bridge Market Research 分析，到 2028 年，Wi-Fi 芯片组市场价值将达到 23.075 亿美元，预测复合年增长率为 4.10%。
Wi-Fi 芯片组基本上是无线信号的集成电路，通常安装在笔记本电脑、路由器和手机中。它们用于连接所有设备并允许用户通过无线连接访问网络服务。
物联网的普及、全球化的不断推进以及全球公共 Wi-Fi 热点数量的不断增加将成为推动市场增长的主要因素。除此之外，旨在采用高速网络连接的小型行业数量激增，以及智能手机、笔记本电脑等消费电子产品的普及率不断提高，将进一步提升市场价值。然而，欠发达经济体缺乏知识和技术专长以及大规模技术限制将抑制市场增长率。
此外，技术进步的不断进步和研发支出的不断增加为预测期内的市场增长创造了新的机会。数据泄露事件的增多导致的安全问题不断增加，这将抑制增长率，从而进一步给市场带来挑战。
This Wi-Fi chipset market report provides details of new recent developments, trade regulations, import export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographical expansions, technological innovations in the market. To gain more info on Wi-Fi chipset market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Middle East and Africa Wi-Fi Chipset Market Scope and Market Size
Wi-Fi chipset market is segmented on the basis of device, band, fabrication technology, WI-FI Standard, die size, MIMO configuration and end user. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target market.
- On the basis of device, the market is segmented into tablet, connected home devices, smartphones, PCs, access point equipment and others.
- On the basis of band, the market is segmented into single band, dual band and tri band.
- On the basis of fabrication technology, the market is segmented into FinFET, FDSOI CMOS, silicon on insulator (SOI) and sige.
- On the basis of WI-FI standard, the market is segmented into 802.11AY, 802.11AD, 802.11AX, 802.11AC, WAVE 1, 802.11AC, WAVE 2, 802.11B, 802.11G and 802.11N.
- On the basis of die size, the market is segmented into 28nm, 20nm, 14nm, 10nm and others.
- On the basis of MIMO configuration, the market is segmented into SU-MIMO, MU-MIMO, 1X1 MU-MIMO, 2X2 MU-MIMO, 3X3 MU-MIMO, 4X4 MU-MIMO, and 8X8 MU-MIMO.
- On the basis of end user, the market is segmented into consumer, automotive and transportation, healthcare, education, BFSI, travel and hospitality and others.
Wi-Fi Chipset Market Country Level Analysis
Wi-Fi chipset market is analyzed and market size, volume information is provided by device, band, fabrication technology, WI-FI Standard, die size, MIMO configuration and end user as referenced above.
The countries covered in the Wi-Fi chipset market report are Saudi Arabia, U.A.E, Israel, Egypt, South Africa, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA).
Wi-Fi 芯片组市场报告的国家部分还提供了影响单个市场因素和国内市场监管变化，这些因素和变化会影响市场的当前和未来趋势。消费量、生产地点和产量、进出口分析、价格趋势分析、原材料成本、下游和上游价值链分析等数据点是用于预测单个国家市场情景的一些主要指标。此外，在提供国家数据的预测分析时，还考虑了中东和非洲品牌的存在和可用性以及它们因来自本地和国内品牌的激烈或稀少竞争而面临的挑战、国内关税和贸易路线的影响。
竞争格局和 Wi-Fi 芯片组市场份额分析
Wi-Fi 芯片组市场竞争格局按竞争对手提供详细信息。详细信息包括公司概况、公司财务状况、收入、市场潜力、研发投资、新市场计划、中东和非洲业务、生产基地和设施、生产能力、公司优势和劣势、产品发布、产品宽度和广度、应用主导地位。以上提供的数据点仅与公司对 Wi-Fi 芯片组市场的关注有关。
Wi-Fi 芯片组市场报告中涉及的主要参与者包括英特尔公司、高通技术公司、索尼半导体以色列有限公司、思睿系统（上海）有限公司、博通、日立 Vantara 公司、思科系统公司、微软、苹果公司、Celeno Communications、台湾半导体制造有限公司、意法半导体、联发科技公司、赛普拉斯半导体公司、PERASO TECHNOLOGIES INC、PERASO TECHNOLOGIES INC、半导体元件工业有限责任公司、赛普拉斯半导体公司和德州仪器公司等。DBMR 分析师了解竞争优势，并为每个竞争对手分别提供竞争分析。
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研究方法
Data collection and base year analysis are done using data collection modules with large sample sizes. The stage includes obtaining market information or related data through various sources and strategies. It includes examining and planning all the data acquired from the past in advance. It likewise envelops the examination of information inconsistencies seen across different information sources. The market data is analysed and estimated using market statistical and coherent models. Also, market share analysis and key trend analysis are the major success factors in the market report. To know more, please request an analyst call or drop down your inquiry.
The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market and primary (industry expert) validation. Data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Patent Analysis, Pricing Analysis, Company Market Share Analysis, Standards of Measurement, Global versus Regional and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.
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