Global Silicon On Insulator Market
市场规模（十亿美元）
CAGR :
% 
 Forecast Period |
2023 –2030 |
 Market Size (Base Year) |
USD 1.45 Billion |
 Market Size (Forecast Year) |
USD 4.50 Billion |
 CAGR |
% |
| Major Markets Players |
|
全球绝缘体上硅市场，按晶圆类型（全耗尽绝缘体上硅 (FD-SOI)、RF-SOI、新兴 SOI、部分耗尽绝缘体上硅 (PD-SOI)）、晶圆尺寸（200mm、300mm）产品（光通信、RF FEM、图像感应、存储设备、RF SOI、电源、MEMS）、技术（键合、智能切割、外延层转移 (ELTRAN)、注氧分离 (SIMOX)、蓝宝石上硅 (SOS)）、应用（汽车、航空航天和国防、消费电子、娱乐和游戏、数据通信和电信、工业、光子学和其他）划分 – 行业趋势和预测到 2030 年。
绝缘体上硅市场分析及规模
市场上的重大技术进步（例如将射频绝缘硅晶片大规模集成到智能手机中，以便从多个位置获得不间断的连接）正在推动市场的增长。由于即将到来的 5G 技术和笔记本电脑、智能手机等消费电子设备对 RF FEM 的需求增加，预计“RF FEM”将成为预测期内增长最快的产品领域。
Data Bridge Market Research 分析称，2022 年绝缘体上硅市场价值为 14.5 亿美元，预计到 2030 年将达到 45 亿美元，在 2023 年至 2030 年的预测期内复合年增长率为 15.20%。除了对市场价值、增长率、细分、地理覆盖范围和主要参与者等市场情景的见解外，Data Bridge Market Research 策划的市场报告还包括深入的专家分析、按地理位置表示的公司生产和产能、分销商和合作伙伴的网络布局、详细和更新的价格趋势分析以及供应链和需求的缺口分析。
绝缘体上硅的市场范围和细分
|
报告指标 |
细节 |
|
预测期 |
2023 至 2030 年 |
|
基准年 |
2022 |
|
历史岁月 |
2021 (可定制为 2015-2020) |
|
定量单位 |
收入（单位：十亿美元）、销量（单位：台）、定价（美元） |
|
涵盖的领域 |
晶圆类型（全耗尽绝缘体上硅 (FD-SOI)、RF-SOI、新兴-SOI、部分耗尽绝缘体上硅 (PD-SOI)）、晶圆尺寸（200mm、300mm）产品（光通信、RF FEM、图像传感、存储设备、RF SOI、电源、MEMS）、技术（键合、智能切割、外延层转移 (ELTRAN)、氧注入分离 (SIMOX)、蓝宝石上硅 (SOS)）、应用（汽车、航空航天和国防、消费电子、娱乐和游戏、数据通信和电信、工业、光子学和其他） |
|
覆盖国家 |
U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America |
|
Market Players Covered |
NXP Semiconductors (Netherlands), STMicroelectronics (Switzerland), Murata Manufacturing Co., Ltd. (Japan), Shin-Etsu Chemical Co., Ltd (Japan), IBM (U.S.), Skyworks Solutions, Inc. (U.S.), Silicon Valley Microelectronics, Inc. (U.S.), United Microelectronics Corporation (Taiwan), Global Wafers Japan Co. Ltd. (Japan), Virginia Semiconductor (U.S.), Siltronic (Germany), SUMCO CORPORATION (Japan), Tower Semiconductor (Israel) |
|
Market Opportunities |
|
Market Definition
The silicon on insulator is the procedure in which thin layer of silicon is placing on the top of insulator, forming silicon semiconductor devices. The silicon on Insulator wafers increase the performance of silicon semiconductor devices in response to the low operating voltage. This silicon wafer is used in the manufacture of advanced electronic devices. It is extensively applicable in the integrated circuit technology used in consumer electronics, automotive and other industries.
Silicon on Insulator Market Dynamics
Drivers
- Increasing demand of 5G in mobile communications
One of the major factors propelling the silicon on insulator (SOI) market is the increasing demand for 5G mobile communication. Several regions have a rise in demand for improved mobile data. Through 5G mobile connection, data communication services and telecom apps are functional. With 5G technology, data transmissions become ten times faster than normal situations. The introduction of 5G has caused a boom in the telecommunications sector. The majority of silicon-on-insulator-based devices in the market are smartphones. As a result of this, the silicon on insulator market is profiting from the switch to 5G in the telecoms sector. The low latency, good user experience, and high reliability of consumer electronics are boosting the production of the silicon on insulator devices.
Opportunities
- Growth and expansion of automotive sector
The demand for the silicon on insulator increase in automotive application which will create immense opportunities for the growth of the market with substantial market share during the forecast period. This growth can be also attributed to the increasing investments by the major market players or manufacturers in automotive sector for the expansion of driverless automobile technologies such as Advanced Driver Assistance Systems (ADAS). For instance, Audi, one of the leading automotive manufacturers, is trying to integrate FD-SOI with devices or sensors used in its autonomous cars. Furthermore, these cars require high-speed, compact and low-power electronic devices for their operations. This, in turn, is prominent to an augmented demand for SOI-based wafers.
Restraints/ Challenges
- Issues associated with silicon on insulator Market
Limited availability of remaining intellectual property ecosystems and floating body and self-heating effects in silicon on insulator devices are some of the major factors that will act as major restraints for the growth of the market. Lack of skilled workforce in SOI wafer manufacturing sector and effective maintenance of thickness uniformity and other parameters will further challenge the market growth.
This silicon on insulator market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the silicon on insulator market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Impact and Current Market Scenario of Raw Material Shortage and Shipping Delays
Data Bridge Market Research offers a high-level analysis of the market and delivers information by keeping in account the impact and current market environment of raw material shortage and shipping delays. This translates into assessing strategic possibilities, creating effective action plans, and assisting businesses in making important decisions.
Apart from the standard report, we also offer in-depth analysis of the procurement level from forecasted shipping delays, distributor mapping by region, commodity analysis, production analysis, price mapping trends, sourcing, category performance analysis, supply chain risk management solutions, advanced benchmarking, and other services for procurement and strategic support.
Expected Impact of Economic Slowdown on the Pricing and Availability of Products
当经济活动放缓时，行业开始受到影响。DBMR 提供的市场洞察报告和情报服务考虑了经济衰退对产品定价和可获得性的预测影响。借助这些，我们的客户通常可以领先竞争对手一步，预测他们的销售额和收入，并估算他们的盈亏支出。
近期发展
- 2021 年，Tower Semiconductor Ltd 与 Cadence Design Systems, Inc. 合作，利用 RF Solution 和 Cadence Virtuoso Design Platform 推出了经过硅验证的 SP4T RF-SOI 开关参考设计流程。该参考设计流程为先进的有线基础设施、5G 无线和汽车 IC 产品开发提供了更快的设计收敛途径。
- 2021 年，环球晶圆有限公司 (GWC) 与格芯签署合同，增加 300 毫米绝缘体上硅 (SOI) 晶圆，以扩大和生产 GWC 的 MEMC 工厂现有的 200 毫米 SOI 晶圆。该合同增加了格芯在美国硅晶圆的供应
全球绝缘体上硅市场范围
绝缘体上硅市场根据晶圆类型、晶圆尺寸、产品、技术和应用进行细分。这些细分市场之间的增长情况将帮助您分析行业中增长缓慢的细分市场，并为用户提供有价值的市场概览和市场洞察，帮助他们做出战略决策，确定核心市场应用。
晶圆类型
- 全耗尽绝缘体上硅 (FD-SOI)
- 射频SOI
- 新兴SOI
- 部分耗尽绝缘体上硅 (PD-SOI)
晶圆尺寸
- 200毫米
- 300毫米
产品
- 光通信
- 射频有限元
- 图像传感
- 记忆装置
- 射频绝缘体上硅
- 力量
- 微机电系统
技术
- 粘合
- 智能剪切
- 外延层转移 (ELTRAN)
- 注入氧气分离 (SIMOX)
- 蓝宝石上硅 (SOS)
应用
- 汽车
- 航空航天和国防
- 消费电子产品
- 娱乐和游戏
- 数据通信和电信
- 工业的
- 光子学
- 其他的
绝缘体上硅市场区域分析/见解
对绝缘体上硅市场进行了分析，并按国家、晶圆类型、晶圆尺寸、产品、技术和应用提供了市场规模的见解和趋势。
绝缘体上硅市场报告涵盖的国家包括北美洲的美国、加拿大和墨西哥、欧洲的德国、法国、英国、荷兰、瑞士、比利时、俄罗斯、意大利、西班牙、土耳其、欧洲其他地区、亚太地区 (APAC) 的中国、日本、印度、韩国、新加坡、马来西亚、澳大利亚、泰国、印度尼西亚、菲律宾、亚太地区 (APAC) 的其他地区、中东和非洲 (MEA) 的其他地区、南美洲的巴西、阿根廷和南美洲其他地区。
就收入和市场份额而言，亚太地区在绝缘体上硅片市场占据主导地位。这主要归因于该地区对消费电子产品的需求不断增长以及投资不断增加。
由于主要市场参与者的强大影响力以及该地区智能手机、数码相机和笔记本电脑应用数量的增加，北美将在 2023-2030 年的预测期内继续保持最高增长率。
报告的国家部分还提供了影响市场当前和未来趋势的各个市场影响因素和市场监管变化。下游和上游价值链分析、技术趋势和波特五力分析、案例研究等数据点是用于预测各个国家市场情景的一些指标。此外，在提供国家数据的预测分析时，还考虑了全球品牌的存在和可用性以及它们因来自本地和国内品牌的大量或稀缺竞争而面临的挑战、国内关税和贸易路线的影响。
竞争格局和绝缘体上硅市场份额分析
绝缘体上硅市场竞争格局提供了按竞争对手划分的详细信息。详细信息包括公司概况、公司财务状况、产生的收入、市场潜力、研发投资、新市场计划、全球影响力、生产基地和设施、生产能力、公司优势和劣势、产品发布、产品宽度和广度、应用主导地位。以上提供的数据点仅与公司对绝缘体上硅市场的关注有关。
绝缘体上硅市场的一些主要参与者包括：
- 恩智浦半导体（荷兰）
- 意法半导体（瑞士）
- 村田制作所（日本）
- 信越化学株式会社（日本）
- IBM（美国）
- Skyworks Solutions, Inc.（美国）
- 硅谷微电子公司（美国）
- 联华电子股份有限公司 (台湾)
- Global Wafers Japan Co. Ltd.（日本）
- 弗吉尼亚半导体（美国）
- Siltronic（德国）
- SUMCO CORPORATION（日本）
- Tower Semiconductor（以色列）
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研究方法
Data collection and base year analysis are done using data collection modules with large sample sizes. The stage includes obtaining market information or related data through various sources and strategies. It includes examining and planning all the data acquired from the past in advance. It likewise envelops the examination of information inconsistencies seen across different information sources. The market data is analysed and estimated using market statistical and coherent models. Also, market share analysis and key trend analysis are the major success factors in the market report. To know more, please request an analyst call or drop down your inquiry.
The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market and primary (industry expert) validation. Data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Patent Analysis, Pricing Analysis, Company Market Share Analysis, Standards of Measurement, Global versus Regional and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.
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