Global Molded Interconnect Device Market
市场规模（十亿美元）
CAGR :
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 Forecast Period |
2023 –0 |
 Market Size (Base Year) |
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 Market Size (Forecast Year) |
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 CAGR |
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>全球模制互连设备市场，按工艺（激光直接成型 (LDS)、双色成型、薄膜技术）、产品类型（天线和连接模块、连接器和开关、传感器、照明、其他）、最终用户（汽车、消费品、医疗保健、工业、军事和航空航天、电信和计算）、国家（美国、加拿大、墨西哥、巴西、阿根廷、南美洲其他地区、德国、法国、意大利、英国、比利时、西班牙、俄罗斯、土耳其、荷兰、瑞士、欧洲其他地区、日本、中国、印度、韩国、澳大利亚、新加坡、马来西亚、泰国、印度尼西亚、菲律宾、亚太其他地区、阿联酋、沙特阿拉伯、埃及、南非、以色列、中东和非洲其他地区）行业趋势和预测到 2029 年。
市场分析与洞察 全球模制互连设备市场
Data Bridge Market Research 分析，模制互连设备市场在 2022-2029 年的预测期内将呈现 13.7% 的复合年增长率，到 2029 年可能达到 35 亿美元。
带有集成电路的注塑热塑性部件被称为模制互连设备 (MID)。这些三维机电元件采用高温热塑性塑料和结构化金属化模制而成，带有电路，为电子行业带来了全新的载体电路设计视角。这些模制部件用于消费电子行业，以取代手机内部天线上的短截线。使用内部天线作为手机内部配件的一部分，可以最大限度地提高空间效率，从而节省体积。
消费电子行业对小型化的需求激增将成为推动市场扩张的关键因素。模制互连设备市场也受到医疗设备中模制互连设备 (MID) 的使用日益增多等因素的推动。除此之外，模制互连设备操作、安装和配置简单。减少电子垃圾的日益增长的需求和技术发展是扩大模制互连设备市场的因素。此外，有利于减少电子垃圾的监管环境以及汽车和半导体等各种终端行业对设备的需求不断增长将成为影响模制互连设备市场增长的主要因素。另一个将缓冲模制互连设备市场增长率的重要因素是可穿戴设备的普及。
此外，物联网设备的日益普及将为市场增长创造有利机会。此外，技术的发展、智能手机需求的不断增长以及模制互连设备市场尚未开发的潜力将成为市场驱动力，并在上述预测期内进一步推动新机遇。
However, the high tooling cost and incompatibility with electronic packages will hamper the market’s growth rate. Also, fluctuating prices of raw materials will further pose a challenge to the market. Other factors such as impact of COVID-19 on supply chain and the technological monopoly of Lds equipment manufacturer will obstruct the market’s growth.
This molded interconnect device market report provides details of new recent developments, trade regulations, import export analysis, production analysis, value chain optimization, market share, impact of domestic and localised market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographical expansions, technological innovations in the market. To gain more info on molded interconnect device market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Global Molded Interconnect Device Market Scope and Market Size
The molded interconnect device market is segmented on the basis of process, product type and end user. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target market.
- On the basis of process, the molded interconnect device market has been segmented as laser direct structuring (LDS), 2-shot molding and film techniques.
- Based on product type, the molded interconnect device market has been segmented into antenna and connectivity modules, connectors and switches, sensors, lighting and others.
- Molded interconnect device market has also been segmented on the basis of end user into automotive, consumer products, healthcare, industrial, military and aerospace and telecommunication and computing.
Molded Interconnect Device Market Country Level Analysis
The molded interconnect device market is analysed and market size, volume information is provided by country, process, product type and end user as referenced above.
The countries covered in the molded interconnect device market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, Israel, Egypt, South Africa, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.
在 2022-2029 年的预测期内，北美占据模制互连设备市场的主导地位，并且由于消费者对智能设备的采用激增以及苹果、谷歌和微软等科技巨头在该地区的存在，其主导趋势将在预测期内继续蓬勃发展。由于消费电子产品的使用率不断提高、原材料采购方便以及该地区劳动力廉价，预计在 2022-2029 年的预测期内，亚太地区将实现增长。
模制互连设备市场报告的国家部分还提供了影响单个市场因素和国内市场法规变化，这些因素和变化会影响市场的当前和未来趋势。消费量、生产地点和产量、进出口分析、价格趋势分析、原材料成本、下游和上游价值链分析等数据点是用于预测单个国家市场情景的一些主要指标。此外，在提供国家数据的预测分析时，还考虑了全球品牌的存在和可用性以及它们因来自本地和国内品牌的大量或稀缺竞争而面临的挑战、国内关税和贸易路线的影响。
竞争格局和全球模制互连设备市场份额分析
模制互连设备市场竞争格局按竞争对手提供详细信息。详细信息包括公司概况、公司财务状况、产生的收入、市场潜力、研发投资、新市场计划、全球影响力、生产基地和设施、生产能力、公司优势和劣势、产品发布、产品宽度和广度、应用主导地位。以上提供的数据点仅与公司对模制互连设备市场的关注有关。
模制互连设备市场的一些主要参与者包括 GALTRONICS、HARTING Technology Group、MacDermid, Inc.、LPKF Laser & Electronics AG、Cicor Management AG、YOMURA、RTP Company、S2P 智能塑料产品、SelectConnect Technologies、苏州 Cicor Technology Co. Ltd、TE Connectivity、Teprosa GmbH、通达集团、BASF SE、EMS-CHEMIE HOLDING AG、DSM、Ensinger、Evonik Industries AG、LANXESS、三菱瓦斯化学公司、PTS (TQM) Ltd. 和 ZEON CORPORATION 等。
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研究方法
Data collection and base year analysis are done using data collection modules with large sample sizes. The stage includes obtaining market information or related data through various sources and strategies. It includes examining and planning all the data acquired from the past in advance. It likewise envelops the examination of information inconsistencies seen across different information sources. The market data is analysed and estimated using market statistical and coherent models. Also, market share analysis and key trend analysis are the major success factors in the market report. To know more, please request an analyst call or drop down your inquiry.
The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market and primary (industry expert) validation. Data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Patent Analysis, Pricing Analysis, Company Market Share Analysis, Standards of Measurement, Global versus Regional and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.
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