全球工业电子封装市场 – 行业趋势和 2029 年预测

市场分析和规模

该技术涉及建立电气互连和为电路提供适当的外壳。工业电子封装提供四大功能：为电路功能分配电能（即功率）、电信号互连、电路机械保护以及电路功能产生的热量消散。工业电子封装被广泛用于防止产品受到射频噪声发射、冷却、机械损坏、静电放电和物理损坏。

Data Bridge Market Research 分析称，2021 年工业电子封装市场价值为 18.2 亿美元，预计到 2029 年将达到 25.2 亿美元，在 2022 年至 2029 年的预测期内复合年增长率为 4.13%。除了市场价值、增长率、细分市场、地理覆盖范围、市场参与者和市场情景等市场洞察外，Data Bridge Market Research 团队策划的市场报告还包括深入的专家分析、进出口分析、定价分析、生产消费分析、专利分析和技术进步。     

报告范围和市场细分

Market Definition

Industrial electronic packaging refers to the production and design of enclosures for electronic devices ranging from specific semiconductor devices to complete systems such as a mainframe computer. An electronic system's packaging must consider radio frequency noise emission, mechanical damage, cooling, and electrostatic discharge. Industrial electronic equipment made in small quantities may use standardized commercially available enclosures such as prefabricated boxes or card cages.

Industrial Electronics Packaging Market Dynamics

Drivers

• Rise the demand of paper and paperboard packaging

Paper and paperboard is a material which is extensively used for the packaging of computer and mobile phones. Computers and Mobile phones are electronic products that are breakable in nature, so they require packaging that offers complete safety for the product. Paper and paperboard offer both strength and rigidity for the product. Other features of paper and paperboard such as soft superb printability, and polished finish make it more popular among electronics appliances companies.

• Growing digitalization

The increasing digitization is growing the demand for Internet of Things (IOT) in the market, which is driving the global need for effective packaging and industrial electronics product. The global industrial electronic market needs for electronics packaging which are increased by the rising adoption of smart computing devices such as smart computing, tablets, laptops mobile phones e-readers and smartphones in several developed and underdeveloped economies which are anticipated to increase the growth of the industrial  electronics packaging market.

• Demand of sustainable packaging

Many e-commerce industries are aiming to use the sustainable packaging solutions such as paper based packaging to decrease the use of the plastic wastes and moving towards the use of paper-based packaging for the packaging of electronic products. This trend is also projected to hit the industrial  electronics packaging market, which is sensitive to exterior impacts with better designing to make packaging more stronger.

Opportunities

• Technological advancement

Technology development is embedded into packages, making a convincing business case for industrial electronics products with the potential to increase profits and reduce costs. Technological advancement in electronics packaging are forcing to electronic packaging industries because the electronics packaging design is evolving at a speedy rate. As technology increases, the demands of the electronic packaging also goes up and changes accordingly, creating beneficial opportunity for the revenue growth of thw market.

• Photonics development

Photonics development is automatically integrated with the multiple levels of media interconnections which has connected to custom electronic packaging. This is the major factor which is pushing electronic product major companies to alter and adapt electronic packaging’s functions with packaging designs.

Restraints/ Challenges

However, the industrial sector is anticipated to witness large manufacturing disruptions. This disruptions in the manufacturing sector are anticipated to lead the brand reputation and losses in the market share of the manufactured electronics products. A shift in dynamics in the economics of production, customized demand of products and value chain can lead to disruptions in manufacturing which will act as a market restraint that will obstruct the market's growth rate

Moreover, lack of skilled professionals with high cost of technology and equipment will likely obstruct the growth of the industrial electronics packaging market during the forecast period. Also, the Harmful effects of plastic will become the major challenge for the market's growth.

This industrial electronics packaging market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the industrial electronics packaging market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.

COVID-19 Impact on Industrial Electronics Packaging Market

The outbreak of Covid-19 pandemic had an adverse impact on the sales of packaging industries globally, along with industrial electronics packaging. The computer, mobile phones and other electronic sector drive the demand for the industrial electronics packaging. Even during this epidemic, the product production in these industries did not considerably affect the market. This is slightly affected due to a disruptions in supply chains, close in production and a scarcity of raw materials.

此外，严格的封锁和停工总体上影响了对电子设备的初始需求。此外，学校开始以在线模式运营，办公室开始在家办公，这些因素大大增加了对电子设备的需求，从而刺激了工业电子封装解决方案。从更广泛的角度来看，在 Covid-19 疫情高峰期间，工业电子封装的销售和需求大幅增加。

近期发展

• 2020 年 5 月，KLA Corporation 宣布成立新业务集团，该集团将完全专注于其封装、电子和组件 (EPC) 业务。随着机器学习、物联网等技术的发展，这项新业务旨在满足电子行业不断变化的格局。
• 2020 年 10 月，Smurfit Kappa 集团公司宣布已以 3.6 亿欧元完成对意大利北部 Verzuolo 的收购。此次新收购增加了 60 万吨箱板纸厂集团的资产，预计将为公司的可持续发展目标做出贡献。

全球工业电子封装市场范围

工业电子封装市场根据产品、材料、封装类型、应用和最终用户进行细分。这些细分市场之间的增长情况将帮助您分析行业中增长缓慢的细分市场，并为用户提供有价值的市场概览和市场洞察，帮助他们做出战略决策，确定核心市场应用。

产品

• 测试和测量设备
• 过程控制设备
• 工业控制
• 电力电子
• 工业自动化设备
• 其他的

材料

• 塑料
• 纸和纸板

包装类型

• 死板的
• 灵活的

 应用

• 半导体与集成电路
• 印刷电路板
• 其他的

最终用户

• 消费电子产品
• 航空航天和国防
• 汽车
• 电信
• 其他的

工业电子包装市场区域分析/见解

对工业电子封装市场进行了分析，并按国家、产品、材料、封装类型、应用和最终用户提供了市场规模见解和趋势。

工业电子封装市场报告涵盖的国家包括美国、加拿大、墨西哥、巴西、阿根廷、南美洲其他地区、德国、法国、意大利、英国、比利时、西班牙、俄罗斯、土耳其、荷兰、瑞士、欧洲其他地区、日本、中国、印度、韩国、澳大利亚和新西兰、新加坡、马来西亚、泰国、印度尼西亚、菲律宾、亚太其他地区、阿拉伯联合酋长国、沙特阿拉伯、埃及、以色列、南非、中东和非洲其他地区。

预测期内，北美在工业电子包装市场中占据主导地位。这是由于该地区对工业电子包装的需求不断增长。北美地区引领工业电子包装市场，美国在电子产品产量增长以及对成本效益、耐用性和抗冲击性需求不断增长方面处于领先地位。

在预计期内，由于亚太地区电子行业的增长，预计该地区将成为发展最快的地区。

报告的国家部分还提供了影响市场当前和未来趋势的各个市场影响因素和市场监管变化。下游和上游价值链分析、技术趋势和波特五力分析、案例研究等数据点是用于预测各个国家市场情景的一些指标。此外，在提供国家数据的预测分析时，还考虑了全球品牌的存在和可用性以及它们因来自本地和国内品牌的大量或稀缺竞争而面临的挑战、国内关税和贸易路线的影响。   

竞争格局和工业电子封装市场份额分析

工业电子封装市场竞争格局按竞争对手提供详细信息。详细信息包括公司概况、公司财务状况、收入、市场潜力、研发投资、新市场计划、全球影响力、生产基地和设施、生产能力、公司优势和劣势、产品发布、产品宽度和广度、应用主导地位。以上提供的数据点仅与公司对工业电子封装市场的关注有关。

工业电子封装市场的一些主要参与者包括：

• DS Smith（英国）
• Mondi（英国）
• 国际纸业（美国）
• Sonoco Products Company（美国）
• 希悦尔（美国）
• Huhtamaki（芬兰）
• Smurfit Kappa（爱尔兰）
• WestRock 公司（美国）
• UFP Technologies Inc.（美国）
• 斯道拉恩索 (芬兰)
• Pregis LLC（美国）
• 深圳市海潮包装制造有限公司 (中国)
• Dordan 制造公司 (美国)
• 杭州迅达包装有限公司 (中国)
• Dunapack 包装集团（奥地利）
• Universal Protective Packaging Inc.（美国）
• Parksons Packaging Ltd.（印度）
• Neenah 纸业和包装公司（美国）
• Plastic Ingenuity（美国）
• JJX包装（美国）

SKU-56340