>亚太 MEMS 和传感器市场，按类型（惯性传感器、超声波传感器、位置传感器、运动传感器、麦克风、生物/化学传感器、光学传感器和环境传感器）、材料（聚合物、金属、硅和陶瓷）、封装尺寸（小于 0.5 毫米、0.5 毫米至 0.9 毫米、大于 0.9 毫米）、制造工艺（沉积、光刻和蚀刻）、执行器类型（光学、射频、微流体和喷墨头）、最终用户（消费电子、IT 和电信、汽车、航空航天、国防、医疗、工业和制造、智能电网基础设施、智能家居、游戏等）、行业趋势和预测到 2029 年。
市场分析和见解
传感器是用于检测附近是否存在任何物理对象并将有关该对象的信息发送到接收端的设备或机器。该设备主要与其他电子设备一起使用。任何物理量，如压力、力、应变、光等，都可以被识别并转换为所需的电信号。这些传感器分为模拟传感器和数字传感器。其他包括温度、超声波、压力和接近传感器。它们消耗的能量更少，性能更高。物联网使用传感器从环境中收集数据。
半导体行业的技术发展促进了基于应用和 MEMS 技术的传感器的制造，这些传感器可用于各种领域，例如智能电网基础设施、智能家电等。随着人们越来越倾向于使用数字平台、互联网服务和在线服务来满足日常需求，这已成为可能。基于物联网的半导体设备日益普及，增加了对智能消费电子产品和可穿戴设备的需求。预计亚太地区的 MEMS 和传感器市场未来将蓬勃发展。
目前，MEMS 器件的重要性急剧增长，亚太地区惯性传感器、超声波传感器和基于封装尺寸的服务增长迅速。此外，各行各业对 MEMS 和传感器的需求不断增长，推动了市场繁荣。Data Bridge Market Research 显示，亚太地区 MEMS 和传感器市场从 2022 年到 2029 年的复合年增长率将达到 9.3%。
市场定义
MEMS is an integrated system of mechanical and electro-mechanical devices and structures manufactured using micro fabrication techniques. A MEMS device consists of three-dimensional properties which sense and manipulate any physical or chemical property. Basic components using micro sensors, micro actuators, and other microstructures are fabricated on a single silicon substrate. Basic components of MEMS devices include micro-sensors and micro-actuators, which convert one form of energy into another. A MEMS device can have static or movable components whose physical dimension varies from below one micron to several millimetres.
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Report Metric |
Details |
|
Forecast Period |
2022 to 2029 |
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Base Year |
2021 |
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Historic Years |
2020 (Customizable to 2019 - 2014) |
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Quantitative Units |
Revenue in USD Thousand, Pricing in USD |
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Segments Covered |
By Type (Inertial Sensor, Ultrasonic Sensor, Position Sensor, Motion Sensor, Microphone, Bio/Chemical Sensor, Optical Sensor And Environmental Sensor), Material (Polymer, Metal, Silicon and Ceramic), Packaging Size (Less Than 0.5 MM, 0.5 MM To 0.9 MM, More Than 0.9 MM), Fabrication Process (Deposition, Lithography and Etching), Actuator Type (Optical, RF, Microfluidics and Inkjet Head), End User (Consumer Electronics, IT and Telecommunication, Automotive, Aerospace, Defense, Medical, Industrial and Manufacturing, Smart Grid Infrastructure, Smart Homes, Gaming and Others) |
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Countries Covered |
China, Japan, South Korea, India, Australia, Singapore, Thailand, Malaysia, Indonesia, Philippines and Rest of Asia-Pacific |
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Market Players Covered |
Panasonic Corporation of North America, Murata Manufacturing Co., Ltd, InvenSense, Honeywell International Inc., Infineon Technologies AG, STMicroelectronics, Texas Instruments Incorporated, NXP Semiconductors, Analog Devices, Inc., ROHM CO., LTD., Teledyne Technologies Incorporated., Robert Bosch GmbH., Sensata Technologies, Inc., DENSO CORPORATION., Hitachi, Ltd., Qualcomm Technologies, Inc., Allegro MicroSystems, Inc, MegaChips Corporation., Vishay Intertechnology, Inc |
Asia-Pacific MEMS and Sensors Market Dynamics
Drivers
- Growing demand for automotive sensors for security
The world has steadily shifted its preference from conventional vehicles to electric vehicles. In vehicles, sensors and MEMS-based devices are essential parts of the electronic control system in automobiles. Modern cars, such as hybrid electric vehicles and Plug-in Hybrid vehicles (PHEV), make thousands of decisions based on the data provided by various sensors that are interfaced with the vehicle's on-board computer system. The sensors are used for security purposes in automobiles as they can operate in harsh and rough conditions involving extreme temperatures, vibrations, and exposure to environmental contaminants.
- Rising demand for sensors in consumer electronics
The COVID-19 pandemic positively affected the consumer electronics market in 2020. The growth was driven by a lack of entertainment opportunities outside the home and the increasing number of employees working from home. Consumer electronics involves a lot of devices ranging from entertainment to recreation to communication.
Consumers are rapidly adopting new and emerging products such as wearables, voice-activated smart speakers, video game consoles, and automotive electronics. Sensors are used extensively in consumer electronics for monitoring, measuring, data logging, and control. Various applications in consumer electronics, such as television remote control systems, use infrared sensors to change the device-related settings.
- Increasing use of (micro-electro-mechanical-system) MEMS gyroscopes
MEMS gyroscopes have been used in many applications, including consumer, automotive, industrial, and military. MEMS gyroscopes have enabled exciting applications in portable devices, including optical image stabilization for cameras, dead reckoning, and GPS assistance. The advent of MEMS technology has controlled the development of miniaturized, low-cost, low-power sensors for various applications.
In recent years, there have been continuous improvements in semiconductors, passives, and interconnects to enable high-precision data acquisition and processing. MEMS sensors are accepted widely due to the demand for sensors that can tolerate more than 175 degrees. MEMS gyroscopes are used due to their high-temperature tolerance, smaller sizes, and low-cost maintenance.
- Growing applications of MEMS sensors in defense and military
Sensors for defense and military applications require proven and reliable technologies. Sensors are a critical part of technologies as these provide solutions to the defense ecosystem, including monitoring and execution.
The various systems, including drones, spacecraft, missiles, military vehicles, ships, marine systems, satellites, and rockets, need sensors because these systems are used to collect data from space. The different types of sensors, such as active, smart, intelligent, camera, infrared and nano sensors are used in military applications. Active sensors provide sensing solutions in high-performance military control and measurement applications.
Opportunities
- Growing demand for smart grid infrastructure
Smart grid infrastructure needs sensors to monitor the power line temperature and weather conditions. Sensors monitoring electrical parameters over an entire electricity network infrastructure play a fundamental role in protecting the smart grid and improving the network's energy efficiency. Smart grids include protection devices for sensing electrical faults ranging from classic analogue electro-mechanics relays to modern intelligent electronic devices. Protection systems play an essential role in maintaining smart grids' power quality and reliability.
Smart grid infrastructure is characterized by high penetration of renewable energy sources available. It mainly focuses on duration indices such as the System Average Interruption Duration Index (SAIDI) or frequency indexes such as the System Average Interruption Frequency Index (SAIFI).
- Developments in environmental based sensors
Versatile environmental-based sensors for environmental condition monitoring are being adopted globally. Increasing developments in environmental-based sensors such as gas, temperature, and smoke sensors have artificial intelligence-based interfaces, which have led to the protection of environmental conditions. On an industrial scale, the technology has many benefits, such as continuous monitoring of chemical releases, and will help reduce them to protect environmental resources.
Numerous environment-based sensors such as biosensors are being introduced into the market to monitor harmful environmental substances. Various companies are taking initiatives to manufacture and develop environment-based sensors
- Rise in investments for R&D of MEMS sensors
MEMS sensors have come a long way since they were first developed in 1971. It is a chip-based technology with sensors composed of a suspended mass between a pair of capacitive plates. Their sizes have drastically reduced while their efficiency has increased exponentially. However, they still have a long way to go as the demand for ultra-thin and flexible displays is increasing. Citing this, major corporations are spending heavily researching the future potential of MEMS sensor and developing them to turn them into reality.
MEMS sensors are used and operated in extreme temperatures. They are mostly used due to their shock and vibration resistance properties. Hence, to overcome many limitations such as precision factors and increase accuracy in measurement, a lot of R&D is being initiated to enhance this technology further to reduce the sensors' cost.
Covid-19 Impact on Asia-Pacific MEMS and Sensors Market
The COVID-19 pandemic positively affected the consumer electronics market in 2020. The growth was driven by a lack of entertainment opportunities outside the home and an increasing number of employees working from home. Consumer electronics involves a lot of devices ranging from entertainment to recreation to communication.
Consumers are rapidly adopting new and emerging products such as wearables, voice-activated smart speakers, video game consoles, and automotive electronics. Sensors are used extensively in consumer electronics for monitoring, measuring, data logging, and control. Various applications in consumer electronics, such as television remote control systems, use infrared sensors to change the device-related settings.
消费电子产品和家用电器中的传感器包括压力、接近度、运动、温度、流量和液位、声学、触摸和图像传感器。此外，传感器的尺寸减小，效率提高了数倍，因此发生了巨大变化。联网家庭已成为现实，只需一个手势即可控制整个房屋。
近期发展
- 2022 年 5 月，Analog Devices Inc. 与 Synopsys 合作加速电源系统设计。此次合作为 DC/DC IC 和 µModule 稳压器提供了模型选项。此次合作将有助于开发电子系统创新并满足客户的设计目标。此次合作将帮助两家公司扩大客户群
- 2022 年 5 月，霍尼韦尔国际公司宣布扩大其室内通信产品组合。此次扩张将有助于该公司开发安全频谱，并能够提供可扩展的解决方案。这将有助于该公司瞄准新客户。
亚太 MEMS 和传感器市场范围
亚太地区 MEMS 和传感器市场根据类型、材料、封装尺寸、制造工艺、执行器类型和最终用户进行细分。这些细分市场之间的增长情况将帮助您分析行业中增长缓慢的细分市场，并为用户提供有价值的市场概览和市场洞察，帮助他们做出战略决策，确定核心市场应用。
按类型
- 惯性传感器
- 超声波传感器
- 位置传感器
- 运动传感器
- 麦克风
- 生物/化学传感器
- 光学传感器
- 环境传感器
根据类型，MEMS 和传感器市场分为惯性传感器、超声波传感器、位置传感器、运动传感器、麦克风、生物/化学传感器、光学传感器和环境传感器。
材料
- 聚合物
- 金属
- 硅
- 陶瓷制品
根据材料，MEMS 和传感器市场分为聚合物、金属、硅和陶瓷。
包装尺寸
- 小于 0.5 毫米
- 0.5 毫米至 0.9 毫米
- 大于 0.9 毫米
根据封装尺寸，MEMS 和传感器市场细分为小于 0.5 毫米、0.5 毫米至 0.9 毫米和大于 0.9 毫米。
制造工艺
- 沉积
- 光刻
- 蚀刻
根据制造工艺，MEMS 和传感器市场分为沉积、光刻和蚀刻。
执行器类型
- 光学的
- 射频
- 微流体
- 喷墨头
根据执行器类型，MEMS 和传感器市场分为光学、RF、微流体和喷墨头。
最终用户
- 消费电子产品
- 信息技术和电信
- 汽车
- 航天
- 防御
- 医疗的
- 工业和制造业
- 智能电网基础设施
- 智能家居
- 赌博
- 其他的
根据最终用户，MEMS 和传感器市场细分为消费电子、IT 和电信、汽车、航空航天、国防、医疗、工业和制造、智能电网基础设施、智能家居、游戏等。
亚太地区 MEMS 和传感器市场区域分析/见解
如上所述，MEMS 和传感器市场按类型、材料、封装尺寸、制造工艺、执行器类型、最终用户进行分析。
亚太 MEMS 和传感器市场涵盖的国家包括中国、日本、印度、韩国、新加坡、马来西亚、澳大利亚、泰国、印度尼西亚、菲律宾和亚太其他地区。
中国因 GDP 快速增长而成为主导国家，并拥有电子行业最大的制造工厂。
报告的国家部分还提供了影响当前和未来市场趋势的各个市场影响因素和国内监管变化。新销售、替代销售、国家人口统计、疾病流行病学和进出口关税等数据点是用于预测各个国家市场情景的一些主要指标。此外，在对国家数据进行预测分析时，还考虑了全球品牌的存在和可用性以及它们因来自本地和国内品牌的激烈或稀缺竞争而面临的挑战以及销售渠道的影响。
竞争格局和亚太地区 MEMS 和传感器市场份额分析
MEMS 和传感器市场竞争格局提供了竞争对手的详细信息。详细信息包括公司概况、公司财务状况、收入、市场潜力、研发投资、新市场计划、全球影响力、生产基地和设施、生产能力、公司优势和劣势、产品发布、产品宽度和广度、应用主导地位。以上提供的数据点仅与公司对 MEMS 和传感器市场的关注有关。
MEMS 和传感器市场的一些主要参与者包括北美松下公司、村田制作所、InvenSense、霍尼韦尔国际公司、英飞凌科技股份公司、意法半导体、德州仪器公司、恩智浦半导体、ADI 公司、罗姆株式会社、Teledyne Technologies Incorporated.、罗伯特·博世有限公司、森萨塔科技公司、电装株式会社、日立有限公司、高通技术公司、Allegro MicroSystems 公司、MegaChips 公司、Vishay Intertechnology 公司等。
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目录
1 INTRODUCTION
1.1 OBJECTIVES OF THE STUDY
1.2 MARKET DEFINITION
1.3 OVERVIEW OF ASIA PACIFIC MEMS AND SENSORS MARKET
1.4 CURRENCY AND PRICING
1.5 LIMITATIONS
1.6 MARKETS COVERED
2 MARKET SEGMENTATION
2.1 MARKETS COVERED
2.2 GEOGRAPHICAL SCOPE
2.3 YEARS CONSIDERED FOR THE STUDY
2.4 DBMR TRIPOD DATA VALIDATION MODEL
2.5 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS
2.6 DBMR MARKET POSITION GRID
2.7 VENDOR SHARE ANALYSIS
2.8 MULTIVARIATE MODELING
2.9 TYPE TIMELINE CURVE
2.1 MARKET APPLICATION COVERAGE GRID
2.11 SECONDARY SOURCES
2.12 ASSUMPTIONS
3 EXECUTIVE SUMMARY
4 PREMIUM INSIGHTS
4.1 REGULATIONS
4.1.1 OVERVIEW
4.1.2 INTERNATIONAL ORGANIZATION FOR STANDARDIZATION (ISO)
4.1.3 OCCUPATIONAL SAFETY & HEALTH ADMINISTRATION (OSHA)
4.1.4 AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI)
4.1.5 UNDERWRITERS LABORATORIES (UL)
4.1.6 UNDERWRITERS LABORATORIES (UL)
4.1.7 EN ISO/IEC 17025
4.1.8 CCC CERTIFICATION
4.2 PORTER'S FIVE FORCE ANALYSIS
5 MARKET OVERVIEW
5.1 DRIVERS
5.1.1 GROWING DEMAND FOR AUTOMOTIVE SENSORS FOR SECURITY
5.1.2 RISING DEMAND FOR SENSORS IN CONSUMER ELECTRONICS
5.1.3 INCREASING USE OF (MICRO-ELECTRO-MECHANICAL-SYSTEM) MEMS GYROSCOPES
5.1.4 GROWING APPLICATIONS OF MEMS SENSORS IN DEFENSE AND MILITARY
5.2 RESTRAINT
5.2.1 LACK OF STANDARDIZED FABRICATION PROCESS OF MEMS (MICRO-ELECTRO-MECHANICAL-SYSTEM)
5.3 OPPORTUNITIES
5.3.1 GROWING DEMAND FOR SMART GRID INFRASTRUCTURE
5.3.2 DEVELOPMENTS IN ENVIRONMENTAL BASED SENSORS
5.3.3 RISE IN INVESTMENTS FOR R&D OF MEMS SENSORS
5.4 CHALLENGES
5.4.1 TECHNICAL CHALLENEGS AND HIGH COST OF END PRODUCTS
5.4.2 TOUCH SENSORS LEAD TO HIGH SENSITIVITY
6 ASIA PACIFIC MEMS & SENSORS MARKET, BY TYPE
6.1 OVERVIEW
6.2 MICROPHONE
6.3 MOTION SENSOR
6.3.1 ACTIVE
6.3.1.1 ULTRASONIC SENSOR
6.3.1.2 MICROWAVE SENSOR
6.3.1.3 TOMOGRAPHIC SENSOR
6.3.2 PASSIVE
6.3.2.1 DUAL OR HYBRID TECHNOLOGY
6.3.2.2 INFRARED MOTION SENSOR
6.3.2.3 OTHERS
6.4 OPTICAL SENSOR
6.4.1 AMBIENT LIGHT SENSOR
6.4.2 MICROBOLOMETER
6.4.3 PIR AND THERMOPHILE
6.4.4 OTHERS
6.5 INERTIAL SENSOR
6.5.1 ACCELEROMETER
6.5.1.1 SINGLE AXIS
6.5.1.2 MULTI AXIS
6.5.2 GYROSCOPE
6.5.3 COMBO SENSOR
6.5.4 MAGNETOMETER
6.6 POSITION SENSOR
6.6.1 PROXIMITY SENSORS
6.6.2 LINEAR SENSORS
6.6.3 DISPLACEMENT SENSORS
6.6.4 3D SENSORS
6.6.5 PHOTOELECTRIC SENSORS
6.6.6 ROTARY SENSOR
6.7 ULTRASONIC SENSOR
6.8 ENVIRONMENTAL SENSOR
6.8.1 HUMIDITY SENSORS
6.8.1.1 ABSOLUTE HUMIDITY SENSORS
6.8.1.2 RELATIVE HUMIDITY SENSORS
6.8.1.3 OSCILLATING HYGROMETER
6.8.1.4 OPTICAL HYGROMETER
6.8.1.5 GRAVIMETRIC HYGROMETER
6.8.2 PRESSURE SENSORS
6.8.2.1 GAUGE PRESSURE SENSORS
6.8.2.2 DIFFERENTIAL PRESSURE SENSORS
6.8.2.3 ABSOLUTE PRESSURE SENSORS
6.8.2.4 VACUUM PRESSURE SENSORS
6.8.2.5 SEALED PRESSURE SENSORS
6.8.3 TEMPERATURE SENSORS
6.8.3.1 CONTACT
6.8.3.1.1 THERMOCOUPLES
6.8.3.1.2 BIMETALLIC TEMPERATURE SENSORS
6.8.3.1.3 RESISTIVE TEMPERATURE DETECTORS
6.8.3.1.4 TEMPERATURE SENSORS ICS
6.8.3.1.5 THERMISTORS
6.8.3.2 NON-CONTACT
6.8.3.2.1 FIBER OPTIC TEMPERATURE SENSORS
6.8.3.2.2 INFRARED TEMPERATURE SENSORS
6.8.4 GAS SENSORS
6.8.4.1 OXYGEN
6.8.4.2 CARBON DIOXIDE
6.8.4.3 AMMONIA
6.8.4.4 HYDROGEN
6.8.4.5 HYDROGEN SULFIDE
6.8.4.6 CARBON MONOXIDE
6.8.4.7 METHANE
6.8.4.8 NITROGEN OXIDE
6.8.4.9 CHLORINE
6.8.4.10 HYDROCARBON
6.8.4.11 VOLATILE ORGANIC COMPOUND
6.8.5 OTHERS
6.9 BIO/CHEMICAL SENSOR
6.9.1 ELECTROCHEMICAL
6.9.2 SENSOR PATCH
7 ASIA PACIFIC MEMS AND SENSORS MARKET, BY ACTUATOR TYPE
7.1 OVERVIEW
7.2 OPTICAL
7.3 RF
7.3.1 SWITCH
7.3.2 FILTER
7.3.3 OSCILLATOR
7.4 MICROFLUIDICS
7.5 INKJET HEAD
8 ASIA PACIFIC MEMS AND SENSORS MARKET, BY PACKAGING SIZE
8.1 OVERVIEW
8.2 LESS THAN 0.5 MM
8.3 0.5 MM TO 0.9 MM
8.4 MORE THAN 0.9 MM
9 ASIA PACIFIC MEMS AND SENSORS MARKET, BY FABRICATION PROCESS
9.1 OVERVIEW
9.2 DEPOSITION
9.3 LITHOGRAPHY
9.4 ETCHING
10 ASIA PACIFIC MEMS AND SENSORS MARKET, BY MATERIAL
10.1 OVERVIEW
10.2 POLYMER
10.3 METAL
10.4 SILICON
10.5 CERAMIC
11 ASIA PACIFIC MEMS & SENSORS MARKET, BY END USER
11.1 OVERVIEW
11.2 CONSUMER ELECTRONICS
11.2.1 BY TYPE
11.2.1.1 SMARTPHONES
11.2.1.2 LAPTOPS
11.2.1.3 TABLETS
11.2.1.4 CAMERAS
11.2.1.5 WEARABLE DEVICES
11.2.1.6 HEADPHONES
11.2.1.7 SMART AUDIO DEVICES
11.2.1.8 TELEVISION
11.2.1.9 INKJET PRINTERS
11.2.1.10 AR/VR
11.2.1.11 OTHERS
11.2.2 BY SENSOR TYPE
11.2.2.1 MICROPHONE
11.2.2.2 MOTION SENSOR
11.2.2.3 OPTICAL SENSOR
11.2.2.4 INERTIAL SENSOR
11.2.2.5 POSITION SENSOR
11.2.2.6 ULTRASONIC SENSOR
11.2.2.7 ENVIRONMENTAL SENSOR
11.2.2.8 BIO/CHEMICAL SENSOR
11.2.2.9 OTHERS
11.3 IT AND TELECOMMUNICATION
11.4 AUTOMOTIVE
11.4.1 BY TYPE
11.4.1.1 VEHICLE COMFORT SYSTEMS
11.4.1.2 AIR CONDITIONING COMPRESSOR
11.4.1.3 BRAKE FORCE AND SUSPENSION CONTROL
11.4.1.4 FUEL AND VAPOUR LEVEL SENSOR
11.4.1.5 ENGINE MANAGEMENT SYSTEM
11.4.1.6 RESTRAINT SYSTEMS
11.4.1.7 TIRE PRESSURE
11.4.1.8 OTHERS
11.4.2 BY SENSOR TYPE
11.4.2.1 MICROPHONE
11.4.2.2 MOTION SENSOR
11.4.2.3 OPTICAL SENSOR
11.4.2.4 INERTIAL SENSOR
11.4.2.5 POSITION SENSOR
11.4.2.6 ULTRASONIC SENSOR
11.4.2.7 ENVIRONMENTAL SENSOR
11.4.2.8 BIO/CHEMICAL SENSOR
11.4.2.9 OTHERS
11.5 GAMING
11.5.1 MICROPHONE
11.5.2 MOTION SENSOR
11.5.3 OPTICAL SENSOR
11.5.4 INERTIAL SENSOR
11.5.5 POSITION SENSOR
11.5.6 ULTRASONIC SENSOR
11.5.7 ENVIRONMENTAL SENSOR
11.5.8 BIO/CHEMICAL SENSOR
11.5.9 OTHERS
11.6 AEROSPACE
11.6.1 MICROPHONE
11.6.2 MOTION SENSOR
11.6.3 OPTICAL SENSOR
11.6.4 INERTIAL SENSOR
11.6.5 POSITION SENSOR
11.6.6 ULTRASONIC SENSOR
11.6.7 ENVIRONMENTAL SENSOR
11.6.8 BIO/CHEMICAL SENSOR
11.6.9 OTHERS
11.7 DEFENSE
11.7.1 BY TYPE
11.7.1.1 AIRCRAFT CONTROL
11.7.1.2 SURVEILLANCE
11.7.1.3 ARMING SYSTEMS
11.7.1.4 EMBEDDED SENSORS
11.7.1.5 MUNITIONS GUIDANCE
11.7.1.6 DATA STORAGE
11.7.2 BY SENSOR TYPE
11.7.2.1 MICROPHONE
11.7.2.2 MOTION SENSOR
11.7.2.3 OPTICAL SENSOR
11.7.2.4 INERTIAL SENSOR
11.7.2.5 POSITION SENSOR
11.7.2.6 ULTRASONIC SENSOR
11.7.2.7 ENVIRONMENTAL SENSOR
11.7.2.8 BIO/CHEMICAL SENSOR
11.7.2.9 OTHERS
11.8 MEDICAL
11.8.1 BY TYPE
11.8.1.1 MONITORING DEVICES
11.8.1.2 SURGICAL DEVICES
11.8.1.3 DIAGNOSTIC DEVICES
11.8.1.4 THERAPEUTIC DEVICES
11.8.1.5 OTHERS
11.8.2 BY SENSOR TYPE
11.8.2.1 MICROPHONE
11.8.2.2 MOTION SENSOR
11.8.2.3 OPTICAL SENSOR
11.8.2.4 INERTIAL SENSOR
11.8.2.5 POSITION SENSOR
11.8.2.6 ULTRASONIC SENSOR
11.8.2.7 ENVIRONMENTAL SENSOR
11.8.2.8 BIO/CHEMICAL SENSOR
11.8.2.9 OTHERS
11.9 INDUSTRIAL AND MANUFACTURING
11.9.1 BY TYPE
11.9.1.1 INDUSTRIAL ROBOTS
11.9.1.2 DRONES
11.9.1.3 OTHERS
11.9.2 BY SENSOR TYPE
11.9.2.1 MICROPHONE
11.9.2.2 MOTION SENSOR
11.9.2.3 OPTICAL SENSOR
11.9.2.4 INERTIAL SENSOR
11.9.2.5 POSITION SENSOR
11.9.2.6 ULTRASONIC SENSOR
11.9.2.7 ENVIRONMENTAL SENSOR
11.9.2.8 BIO/CHEMICAL SENSOR
11.9.2.9 OTHERS
11.1 SMART GRID INFRASTRUCTURE
11.10.1 MICROPHONE
11.10.2 MOTION SENSOR
11.10.3 OPTICAL SENSOR
11.10.4 INERTIAL SENSOR
11.10.5 POSITION SENSOR
11.10.6 ULTRASONIC SENSOR
11.10.7 ENVIRONMENTAL SENSOR
11.10.8 BIO/CHEMICAL SENSOR
11.10.9 OTHERS
11.11 SMART HOMES
11.11.1 MICROPHONE
11.11.2 MOTION SENSOR
11.11.3 OPTICAL SENSOR
11.11.4 INERTIAL SENSOR
11.11.5 POSITION SENSOR
11.11.6 ULTRASONIC SENSOR
11.11.7 ENVIRONMENTAL SENSOR
11.11.8 BIO/CHEMICAL SENSOR
11.11.9 OTHERS
11.12 OTHERS
12 ASIA PACIFIC MEMS AND SENSORS MARKET BY GEOGRAPHY
12.1 ASIA-PACIFIC
12.1.1 CHINA
12.1.2 JAPAN
12.1.3 INDIA
12.1.4 SOUTH KOREA
12.1.5 SINGAPORE
12.1.6 MALAYSIA
12.1.7 THAILAND
12.1.8 AUSTRALIA
12.1.9 INDONESIA
12.1.10 PHILIPPINES
12.1.11 REST OF ASIA-PACIFIC
13 ASIA PACIFIC MEMS AND SENSORS MARKET, COMPANY LANDSCAPE
13.1 COMPANY SHARE ANALYSIS: ASIA PACIFIC
14 SWOT ANALYSIS
15 COMPANY PROFILE
15.1 SENSATA TECHNOLOGIES, INC.
15.1.1 COMPANY SNAPSHOT
15.1.2 REVENUE ANALYSIS
15.1.3 COMPANY SHARE ANALYSIS
15.1.4 PRODUCT PORTFOLIO
15.1.5 RECENT DEVELOPMENT
15.2 ROBERT BOSCH GMBH
15.2.1 COMPANY SNAPSHOT
15.2.2 REVENUE ANALYSIS
15.2.3 COMPANY SHARE ANALYSIS
15.2.4 PRODUCT PORTFOLIO
15.2.5 RECENT DEVELOPMENT
15.3 DENSO CORPORATION
15.3.1 COMPANY SNAPSHOT
15.3.2 REVENUE ANALYSIS
15.3.3 COMPANY SHARE ANALYSIS
15.3.4 PRODUCT PORTFOLIO
15.3.5 RECENT DEVELOPMENT
15.4 HITACHI, LTD.
15.4.1 COMPANY SNAPSHOT
15.4.2 REVENUE ANALYSIS
15.4.3 COMPANY SHARE ANALYSIS
15.4.4 PRODUCT PORTFOLIO
15.4.5 RECENT DEVELOPMENT
15.5 HONEYWELL INTERNATIONAL INC.
15.5.1 COMPANY SNAPSHOT
15.5.2 REVENUE ANALYSIS
15.5.3 COMPANY SHARE ANALYSIS
15.5.4 PRODUCT PORTFOLIO
15.5.5 RECENT DEVELOPMENTS
15.6 ALLEGRO MICROSYSTEMS, INC.
15.6.1 COMPANY SNAPSHOT
15.6.2 REVENUE ANALYSIS
15.6.3 PRODUCT PORTFOLIO
15.6.4 RECENT DEVELOPMENT
15.7 ANALOG DEVICES, INC.
15.7.1 COMPANY SNAPSHOT
15.7.2 REVENUE ANALYSIS
15.7.3 PRODUCT PORTFOLIO
15.7.4 RECENT DEVELOPMENTS
15.8 HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
15.8.1 COMPANY SNAPSHOT
15.8.2 REVENUE ANALYSIS
15.8.3 PRODUCT PORTFOLIO
15.8.4 RECENT DEVELOPMENT
15.9 INVENSENSE
15.9.1 COMPANY SNAPSHOT
15.9.2 PRODUCT PORTFOLIO
15.9.3 RECENT DEVELOPMENT
15.1 INFINEON TECHNOLOGIES AG
15.10.1 COMPANY SNAPSHOT
15.10.2 REVENUE ANALYSIS
15.10.3 PRODUCT PORTFOLIO
15.10.4 RECENT DEVELOPMENT
15.11 MURATA MANUFACTURING CO., LTD.
15.11.1 COMPANY SNAPSHOT
15.11.2 REVENUE ANALYSIS
15.11.3 PRODUCT PORTFOLIO
15.11.4 RECENT DEVELOPMENT
15.12 MEGACHIPS CORPORATION
15.12.1 COMPANY SNAPSHOT
15.12.2 REVENUE ANALYSIS
15.12.3 PRODUCT PORTFOLIO
15.12.4 RECENT DEVELOPMENT
15.13 NXP SEMICONDUCTORS
15.13.1 COMPANY SNAPSHOT
15.13.2 REVENUE ANALYSIS
15.13.3 PRODUCT PORTFOLIO
15.13.4 RECENT DEVELOPMENT
15.14 PANASONIC CORPORATION OF NORTH AMERICA
15.14.1 COMPANY SNAPSHOT
15.14.2 REVENUE ANALYSIS
15.14.3 PRODUCT PORTFOLIO
15.14.4 RECENT DEVELOPMENT
15.15 QUALCOMM TECHNOLOGIES, INC.
15.15.1 COMPANY SNAPSHOT
15.15.2 REVENUE ANALYSIS
15.15.3 PRODUCT PORTFOLIO
15.15.4 RECENT DEVELOPMENT
15.16 ROHM CO., LTD.
15.16.1 COMPANY SNAPSHOT
15.16.2 REVENUE ANALYSIS
15.16.3 PRODUCT PORTFOLIO
15.16.4 RECENT DEVELOPMENT
15.17 STMICROELECTRONICS
15.17.1 COMPANY SNAPSHOT
15.17.2 REVENUE ANALYSIS
15.17.3 PRODUCT PORTFOLIO
15.17.4 RECENT DEVELOPMENTS
15.18 TEXAS INSTRUMENTS INCORPORATED
15.18.1 COMPANY SNAPSHOT
15.18.2 REVENUE ANALYSIS
15.18.3 PRODUCT PORTFOLIO
15.18.4 RECENT DEVELOPMENT
15.19 TELEDYNE TECHNOLOGIES INCORPORATED
15.19.1 COMPANY SNAPSHOT
15.19.2 REVENUE ANALYSIS
15.19.3 PRODUCT PORTFOLIO
15.19.4 RECENT DEVELOPMENT
15.2 VISHAY INTERTECHNOLOGY, INC.
15.20.1 COMPANY SNAPSHOT
15.20.2 REVENUE ANALYSIS
15.20.3 PRODUCT PORTFOLIO
15.20.4 RECENT DEVELOPMENT
16 QUESTIONNAIRE
17 RELATED REPORTS
表格列表
TABLE 1 ASIA PACIFIC MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 2 ASIA PACIFIC MICROPHONE IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 3 ASIA PACIFIC MOTION SENSORS IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 4 ASIA PACIFIC MOTION SENSOR IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 5 ASIA PACIFIC ACTIVE IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 6 ASIA PACIFIC PASSIVE IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 7 ASIA PACIFIC OPTICAL SENSOR IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 8 ASIA PACIFIC OPTICAL SENSOR IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 9 ASIA PACIFIC INERTIAL SENSOR IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 10 ASIA PACIFIC INERTIAL SENSOR IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 11 ASIA PACIFIC ACCELEROMETER IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 12 ASIA PACIFIC POSITION SENSOR IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 13 ASIA PACIFIC POSITION SENSOR IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 14 ASIA PACIFIC ULTRASONIC SENSOR IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 15 ASIA PACIFIC ENVIRONMENTAL SENSOR IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 16 ASIA PACIFIC ENVIRONMENTAL SENSOR IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 17 ASIA PACIFIC HUMIDITY SENSOR IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 18 ASIA PACIFIC PRESSURE SENSORS IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 19 ASIA PACIFIC TEMPERATURE SENSOR IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 20 ASIA PACIFIC CONTACT IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 21 ASIA PACIFIC NON-CONTACT IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 22 ASIA PACIFIC GAS SENSOR IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 23 ASIA PACIFIC BIO/CHEMICAL SENSOR IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 24 ASIA PACIFIC BIO/CHEMICAL SENSOR IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 25 ASIA PACIFIC MEMS AND SENSORS MARKET, BY ACTUATOR TYPE, 2020-2029 (USD THOUSAND)
TABLE 26 ASIA PACIFIC OPTICAL IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 27 ASIA PACIFIC RF IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 28 ASIA PACIFIC RF IN MEMS AND SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 29 ASIA PACIFIC MICROFLUIDICS IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 30 ASIA PACIFIC INKJET HEAD IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 31 ASIA PACIFIC MEMS AND SENSORS MARKET, BY PACKAGING SIZE, 2020-2029 (USD THOUSAND)
TABLE 32 ASIA PACIFIC LESS THAN 0.5 MM IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 33 ASIA PACIFIC 0.5MM TO 0.9 MM IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 34 ASIA PACIFIC MORE THAN 0.9 MM IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 35 ASIA PACIFIC MEMS AND SENSORS MARKET, BY FABRICATION PROCESS, 2020-2029 (USD THOUSAND)
TABLE 36 ASIA PACIFIC DEPOSITION IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 37 ASIA PACIFIC LITHOGRAPHY IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 38 ASIA PACIFIC ETCHING IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 39 ASIA PACIFIC MEMS AND SENSORS MARKET, BY MATERIAL, 2020-2029 (USD THOUSAND)
TABLE 40 ASIA PACIFIC POLYMER IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 41 ASIA PACIFIC METAL IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 42 ASIA PACIFIC SILICON IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 43 ASIA PACIFIC CERAMIC IN MEMS AND SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 44 ASIA PACIFIC MEMS & SENSORS MARKET, BY END USER, 2020-2029 (USD THOUSAND)
TABLE 45 ASIA PACIFIC CONSUMER ELECTRONICS IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 46 ASIA PACIFIC CONSUMER ELECTRONICS IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 47 ASIA PACIFIC CONSUMER ELECTRONICS IN MEMS & SENSORS MARKET, BY SENSOR TYPE, 2020-2029 (USD THOUSAND)
TABLE 48 ASIA PACIFIC IT AND TELECOMMUNICATION IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 49 ASIA PACIFIC AUTOMOTIVE IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 50 ASIA PACIFIC AUTOMOTIVE IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 51 ASIA PACIFIC AUTOMOTIVE IN MEMS & SENSORS MARKET, BY SENSOR TYPE, 2020-2029 (USD THOUSAND)
TABLE 52 ASIA PACIFIC GAMING IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 53 ASIA PACIFIC GAMING IN MEMS & SENSORS MARKET, BY SENSOR TYPE, 2020-2029 (USD THOUSAND)
TABLE 54 ASIA PACIFIC AEROSPACE IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 55 ASIA PACIFIC AEROSPACE IN MEMS & SENSORS MARKET, BY SENSOR TYPE, 2020-2029 (USD THOUSAND)
TABLE 56 ASIA PACIFIC DEFENSE IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 57 ASIA PACIFIC DEFENSE IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 58 ASIA PACIFIC DEFENSE IN MEMS & SENSORS MARKET, BY SENSOR TYPE, 2020-2029 (USD THOUSAND)
TABLE 59 ASIA PACIFIC MEDICAL IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 60 ASIA PACIFIC MEDICAL IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 61 ASIA PACIFIC MEDICAL IN MEMS & SENSORS MARKET, BY SENSOR TYPE, 2020-2029 (USD THOUSAND)
TABLE 62 ASIA PACIFIC INDUSTRIAL AND MANUFACTURING IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 63 ASIA PACIFIC INDUSTRIAL AND MANUFACTURING IN MEMS & SENSORS MARKET, BY TYPE, 2020-2029 (USD THOUSAND)
TABLE 64 ASIA PACIFIC INDUSTRIAL AND MANUFACTURING IN MEMS & SENSORS MARKET, BY SENSOR TYPE, 2020-2029 (USD THOUSAND)
TABLE 65 ASIA PACIFIC SMART GRID INFRASTRUCTURE IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 66 ASIA PACIFIC SMART GRID INFRASTRUCTURE IN MEMS & SENSORS MARKET, BY SENSOR TYPE, 2020-2029 (USD THOUSAND)
TABLE 67 ASIA PACIFIC SMART HOMES IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
TABLE 68 ASIA PACIFIC SMART HOMES IN MEMS & SENSORS MARKET, BY SENSOR TYPE, 2020-2029 (USD THOUSAND)
TABLE 69 ASIA PACIFIC OTHERS IN MEMS & SENSORS MARKET, BY REGION, 2020-2029 (USD THOUSAND)
研究方法
Data collection and base year analysis are done using data collection modules with large sample sizes. The stage includes obtaining market information or related data through various sources and strategies. It includes examining and planning all the data acquired from the past in advance. It likewise envelops the examination of information inconsistencies seen across different information sources. The market data is analysed and estimated using market statistical and coherent models. Also, market share analysis and key trend analysis are the major success factors in the market report. To know more, please request an analyst call or drop down your inquiry.
The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market and primary (industry expert) validation. Data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Patent Analysis, Pricing Analysis, Company Market Share Analysis, Standards of Measurement, Global versus Regional and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.
可定制
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