Global Quad Flat Package Qfp Microcontroller Socket Market
Market Size in USD Billion
CAGR :
% 
USD
1,236.30 Million
USD
2,104.70 Million
2022
2030
 Forecast Period |
2023 –2030 |
 Market Size (Base Year) |
USD 1,236.30 Million |
 Market Size (Forecast Year) |
USD 2,104.70 Million |
 CAGR |
% |
| Major Markets Players |
|
Global Quad Flat Package (QFP) Microcontroller Socket Market, By Types (Low-profile Quad Flat Package (LQFP), Thin Quad Flat Package (TQFP), Plastic Quad Flat Package (PQFP), Bumpered Quad Flat Package (BQFP)), Application (Industrial, Consumer Electronics, Automotive, Medical Devices, Military and Defense) – Industry Trends and Forecast to 2030.
Quad Flat Package (QFP) Microcontroller Socket Market Analysis and Size
The quad flat package (QFP) is basically an integrated circuit package which is surface-mounted and pins on them are spaced anywhere from 0.4mm-1mm apart. Socketing of these packages is rare and through-hole mounting is not possible. The smaller types of the standard QFP package generally includes packages such as thin QFP (TQFP), very-thin QFP (VQFP) and low-profile QFP (LQFP) packages. The factors such as rapid adoption of smart machines, applications of embedded system and the surging demand for enhanced technology, which reduces fuel consumption are expected to emerge as the significant factor accelerating the growth of global quad flat package (QFP) microcontroller socket market.
Data Bridge Market Research analyses that the global quad flat package (QFP) microcontroller socket market is expected to grow at a CAGR of 5.30% during the forecast period of 2023 to 2030, at a USD 1236.3 million in 2022 is expected to reach USD 2104.7 million by 2030. The ‘Low-profile Quad Flat Package (QFP)” segment has established dominance in the global quad flat package (QFP) microcontroller socket market due to its compact design and space-efficient attributes. This type of QFP offers a sleek, low-profile form factor, making it highly sought after in modern electronic devices where space is a premium. Its versatility and compatibility with a wide range of microcontrollers have contributed significantly to its market leadership, meeting the demand for smaller, more compact electronics across various industries. In addition to the market insights such as market value, growth rate, market segments, geographical coverage, market players, and market scenario, the market report curated by the Data Bridge Market Research team includes in-depth expert analysis, import/export analysis, pricing analysis, production consumption analysis, and pestle analysis.
Quad Flat Package (QFP) Microcontroller Socket Market Scope and Segmentation
|
Report Metric |
Details |
|
Forecast Period |
2023 to 2030 |
|
Base Year |
2022 |
|
Historic Years |
2021 (Customizable to 2015-2020) |
|
Quantitative Units |
Revenue in USD Million, Volumes in Units, Pricing in USD |
|
Segments Covered |
Types (Low-profile Quad Flat Package (LQFP), Thin Quad Flat Package (TQFP), Plastic Quad Flat Package (PQFP), Bumpered Quad Flat Package (BQFP)), Application (Industrial, Consumer Electronics, Automotive, Medical Devices, Military and Defense) |
|
Countries Covered |
U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, Saudi Arabia, U.A.E., South Africa, Egypt, Israel, Rest of the Middle East and Africa |
|
Market Players Covered |
Intel Corporation (U.S), Loranger International Corporation (U.S), Aries Electronics (U.S), Enplas Corporation (Japan), Johnstech (U.S), Mill-Max Mfg. Corp (U.S), Molex (U.S), Foxconn Technology Group (Taiwan), Sensata Technologies Inc (U.S), Plastronics (U.S), TE Connectivity (Switzerland), Chupond Precision Co. Ltd. (Taiwan), Socionext America Inc. (U.S), Win Way Technology Co. Ltd. (Taiwan), ChipMOS TECHNOLOGIES INC (Taiwan), 3M (U.S), Yamaichi Electronics Co. (Japan) |
|
Market Opportunities |
|
Market Definition
A Quad Flat Package (QFP) Microcontroller Socket is a specialized electrical component used in electronic circuits and systems to facilitate the easy insertion and removal of a microcontroller or integrated circuit (IC) that is packaged in a Quad Flat Package.
Global Quad Flat Package (QFP) Microcontroller Socket Market Dynamics
Drivers
- Advancements in Microcontroller Technology
The microcontroller market constantly witnesses advancements in technology, leading to the development of more powerful and feature-rich microcontrollers. These innovations often result in the introduction of new microcontroller packages, including QFP, to accommodate the increased pin count and functionality. As microcontrollers become smaller and more capable, the need for compatible sockets to enable testing, programming, and replacement becomes essential.
- Rising Automotive Industry Growth
The automotive sector is increasingly using QFP microcontrollers for various applications such as engine control units, infotainment systems, and advanced driver-assistance systems. As the automotive industry continues to evolve with electric and autonomous vehicles, the demand for QFP microcontroller sockets is expected to rise.
Opportunity
•Rising Demand for Consumer Electronics
The growing consumer demand for electronic devices like smartphones, tablets, smart TVs, and IoT devices is a significant driver for the QFP microcontroller socket market. These devices often incorporate QFP microcontrollers for their compact size and high-performance capabilities.
- Rapid Automotive Industry Growth
The automotive sector is increasingly using QFP microcontrollers for various applications such as engine control units, infotainment systems, and advanced driver-assistance systems. As the automotive industry continues to evolve with electric and autonomous vehicles, the demand for QFP microcontroller sockets is expected to rise.
Restraint/Challenge
- Increased Technical Advancements
Keeping up with rapid technological advancements is a significant challenge. QFP microcontrollers are continually evolving, with new features and specifications. Socket manufacturers need to invest in research and development to stay competitive.
Recent Developments
- In October 2016, STMicroelectronics acquired NFC and RFID reader assets, strengthening their portfolio ofgeneration mobile and Internet of Things devices
- In September 2012, Sensata Technology Inc. acquired WELLS-CTI Inc. a product divided by the name of Qisockets for the Semiconductors Industry. WELLS-CTI Inc. specializes in the making of test sockets which inc
Global Quad Flat Package (QFP) Microcontroller Socket Market Scope
The global quad flat package (QFP) microcontroller socket market is segmented on the basis of types and application. The growth amongst the different segments helps in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target market.
Types
- Low-profile Quad Flat Package (LQFP)
- Thin Quad Flat Package (TQFP)
- Plastic Quad Flat Package (PQFP)
- Bumpered Quad Flat Package (BQFP)
Application
- Industrial
- Consumer Electronics
- Automotive
- Medical Devices
- Military and Defense
Global Quad Flat Package (QFP) Microcontroller Socket Market Region Analysis/Insights
The global quad flat package (QFP) microcontroller socket market is analyzed and market size, volume information is provided by types and applications as referenced above.
The countries covered in the global quad flat package (QFP) microcontroller socket market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, Israel, Egypt, South Africa, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.
Asia-Pacific is projected to dominate the global quad flat package (QFP) microcontroller socket market during the forecast period 2023-2030 owing to the flourishing microelectronics industry and high demand in Japan and China. Europe and North America will however, register the highest growth rate and highest CAGR for this period due to the presence of the big manufacturers within these regions.
The country section of the global quad flat package (QFP) microcontroller socket market report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Global Quad Flat Package (QFP) Microcontroller Socket Market Share Analysis
The global quad flat package (QFP) microcontroller socket market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to global quad flat package (QFP) microcontroller socket market.
The major players covered in the global quad flat package (QFP) microcontroller socket market report are:
- Intel Corporation (U.S)
- Loranger International Corporation (U.S)
- Aries Electronics (U.S)
- Enplas Corporation (Japan)
- Johnstech (U.S)
- Mill-Max Mfg. Corp (U.S)
- Molex (U.S)
- Foxconn Technology Group (Taiwan)
- Sensata Technologies Inc (U.S)
- Plastronics (U.S)
- TE Connectivity (Switzerland)
- Chupond Precision Co. Ltd. (Taiwan)
- Socionext America Inc. (U.S)
- Win Way Technology Co. Ltd. (Taiwan)
- ChipMOS TECHNOLOGIES INC (Taiwan)
- 3M (U.S)
- Yamaichi Electronics Co. (Japan)
SKU-
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Table of Content
1 INTRODUCTION
1.1 OBJECTIVES OF THE STUDY
1.2 MARKET DEFINITION
1.3 OVERVIEW OF GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET
1.4 CURRENCY AND PRICING
1.5 LIMITATION
1.6 MARKETS COVERED
2 MARKET SEGMENTATION
2.1 KEY TAKEAWAYS
2.2 ARRIVING AT THE GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET
2.2.1 VENDOR POSITIONING GRID
2.2.2 TECHNOLOGY LIFE LINE CURVE
2.2.3 MARKET GUIDE
2.2.4 COMPANY POSITIONING GRID
2.2.5 COMAPANY MARKET SHARE ANALYSIS
2.2.6 MULTIVARIATE MODELLING
2.2.7 TOP TO BOTTOM ANALYSIS
2.2.8 STANDARDS OF MEASUREMENT
2.2.9 VENDOR SHARE ANALYSIS
2.2.10 DATA POINTS FROM KEY PRIMARY INTERVIEWS
2.2.11 DATA POINTS FROM KEY SECONDARY DATABASES
2.3 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET: RESEARCH SNAPSHOT
2.4 ASSUMPTIONS
3 MARKET OVERVIEW
3.1 DRIVERS
3.2 RESTRAINTS
3.3 OPPORTUNITIES
3.4 CHALLENGES
4 EXECUTIVE SUMMARY
5 PREMIUM INSIGHT
5.1 PORTERS FIVE FORCES
5.2 REGULATORY STANDARDS
5.3 TECHNOLOGICAL TRENDS
5.4 PATENT ANALYSIS
5.5 CASE STUDY
5.6 VALUE CHAIN ANALYSIS
5.7 COMPANY COMPARITIVE ANALYSIS
5.8 PRICING ANALYSIS
6 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY TYPE
6.1 OVERVIEW
6.2 THIN QUAD FLAT PACK (TQFP)
6.2.1 BY BODY SIZE
6.2.1.1. UPTO 5 SQ. MM.
6.2.1.2. 5 SQ. MM. TO 15 SQ. MM.
6.2.1.3. 15 SQ. MM. & ABOVE
6.2.2 BY LEAD PITCH
6.2.2.1. 0.4 MM
6.2.2.2. 0.5 MM
6.2.2.3. 0.65 MM
6.2.2.4. 0.8 MM
6.2.2.5. 1.0 MM
6.2.3 BY LEAD COUNT RANGE
6.2.3.1. UPTO 32
6.2.3.2. 32 TO 64
6.2.3.3. 64 TO 128
6.2.3.4. 128 & ABOVE
6.3 LOW PROFILE QUAD FLAT PACK (LQFP)
6.3.1 BY BODY SIZE
6.3.1.1. UPTO 7 SQ. MM.
6.3.1.2. 7 SQ. MM. TO 14 SQ. MM.
6.3.1.3. 14 SQ. MM. & ABOVE
6.3.2 BY LEAD PITCH
6.3.2.1. 0.4 MM
6.3.2.2. 0.5 MM
6.3.2.3. 0.6 MM
6.3.2.4. 0.8 MM
6.3.3 BY LEAD COUNT RANGE
6.3.3.1. UPTO 40
6.3.3.2. 04 TO 100
6.3.3.3. 100 TO 200
6.3.3.4. 200 & ABOVE
6.4 METRIC QUAD FLAT PACK (MQFP)
6.4.1 BY BODY SIZE
6.4.1.1. UPTO 10 SQ.MM
6.4.1.2. 10 SQ. MM. TO 14 SQ. MM.
6.4.1.3. 14 SQ.MM TO 28 SQ.MM
6.4.1.4. 28 SQ. MM. & ABOVE
6.4.2 BY LEAD PITCH
6.4.2.1. 0.5 MM
6.4.2.2. 0.6 MM
6.4.2.3. 0.8 MM
6.4.3 BY LEAD COUNT RANGE
6.4.3.1. UPTO 44
6.4.3.2. 44 TO 120
6.4.3.3. 120 TO 200
6.4.3.4. 200 & ABOVE
6.5 BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
6.6 OTHERS
7 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY SUBSTRATES
7.1 OVERVIEW
7.2 PLASTIC
7.3 CERAMIC
7.4 METAL
8 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY PACKAGE TYPE
8.1 OVERVIEW
8.2 QFP32
8.3 QFP64
8.4 QFP100
8.5 QFP144
8.6 QFP208
8.7 OTHERS
9 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY TECHNOLOGY
9.1 OVERVIEW
9.2 SURFACE MOUNT TECHNOLOGY
9.3 THROUGH-HOLE TECHNOLOGY
10 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY SALES CHANNEL
10.1 OVERVIEW
10.2 OEM
10.3 AFTERMARKET
11 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY DISTRIBUTION CHANNEL
11.1 OVERVIEW
11.2 DIRECT SALES
11.3 INDIRECT SALES
12 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY APPLICATION
12.1 OVERVIEW
12.2 CONSUMER ELECTRONICS
12.2.1 BY TYPE
12.2.1.1. THIN QUAD FLAT PACK (TQFP)
12.2.1.1.1. BY BODY SIZE
12.2.1.1.1.1 UPTO 5 SQ. MM.
12.2.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.
12.2.1.1.1.3 15 SQ. MM. & ABOVE
12.2.1.1.2. BY LEAD PITCH
12.2.1.1.2.1 0.4 MM
12.2.1.1.2.2 0.5 MM
12.2.1.1.2.3 0.65 MM
12.2.1.1.2.4 0.8 MM
12.2.1.1.2.5 1.0 MM
12.2.1.1.3. BY LEAD COUNT RANGE
12.2.1.1.3.1 UPTO 32
12.2.1.1.3.2 32 TO 64
12.2.1.1.3.3 64 TO 128
12.2.1.1.3.4 128 & ABOVE
12.2.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)
12.2.1.2.1. BY BODY SIZE
12.2.1.2.1.1 UPTO 7 SQ. MM.
12.2.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.
12.2.1.2.1.3 14 SQ. MM. & ABOVE
12.2.1.2.2. BY LEAD PITCH
12.2.1.2.2.1 0.4 MM
12.2.1.2.2.2 0.5 MM
12.2.1.2.2.3 0.6 MM
12.2.1.2.2.4 0.8 MM
12.2.1.2.3. BY LEAD COUNT RANGE
12.2.1.2.3.1 UPTO 40
12.2.1.2.3.2 04 TO 100
12.2.1.2.3.3 100 TO 200
12.2.1.2.3.4 200 & ABOVE
12.2.1.3. METRIC QUAD FLAT PACK (MQFP)
12.2.1.3.1. BY BODY SIZE
12.2.1.3.1.1 UPTO 10 SQ.MM
12.2.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.
12.2.1.3.1.3 14 SQ.MM TO 28 SQ.MM
12.2.1.3.1.4 28 SQ. MM. & ABOVE
12.2.1.3.2. BY LEAD PITCH
12.2.1.3.2.1 0.5 MM
12.2.1.3.2.2 0.6 MM
12.2.1.3.2.3 0.8 MM
12.2.1.3.3. BY LEAD COUNT RANGE
12.2.1.3.3.1 UPTO 44
12.2.1.3.3.2 44 TO 120
12.2.1.3.3.3 120 TO 200
12.2.1.3.3.4 200 & ABOVE
12.2.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
12.2.1.5. OTHERS
12.3 AUTOMOTIVE
12.3.1 BY TYPE
12.3.1.1. THIN QUAD FLAT PACK (TQFP)
12.3.1.1.1. BY BODY SIZE
12.3.1.1.1.1 UPTO 5 SQ. MM.
12.3.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.
12.3.1.1.1.3 15 SQ. MM. & ABOVE
12.3.1.1.2. BY LEAD PITCH
12.3.1.1.2.1 0.4 MM
12.3.1.1.2.2 0.5 MM
12.3.1.1.2.3 0.65 MM
12.3.1.1.2.4 0.8 MM
12.3.1.1.2.5 1.0 MM
12.3.1.1.3. BY LEAD COUNT RANGE
12.3.1.1.3.1 UPTO 32
12.3.1.1.3.2 32 TO 64
12.3.1.1.3.3 64 TO 128
12.3.1.1.3.4 128 & ABOVE
12.3.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)
12.3.1.2.1. BY BODY SIZE
12.3.1.2.1.1 UPTO 7 SQ. MM.
12.3.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.
12.3.1.2.1.3 14 SQ. MM. & ABOVE
12.3.1.2.2. BY LEAD PITCH
12.3.1.2.2.1 0.4 MM
12.3.1.2.2.2 0.5 MM
12.3.1.2.2.3 0.6 MM
12.3.1.2.2.4 0.8 MM
12.3.1.2.3. BY LEAD COUNT RANGE
12.3.1.2.3.1 UPTO 40
12.3.1.2.3.2 04 TO 100
12.3.1.2.3.3 100 TO 200
12.3.1.2.3.4 200 & ABOVE
12.3.1.3. METRIC QUAD FLAT PACK (MQFP)
12.3.1.3.1. BY BODY SIZE
12.3.1.3.1.1 UPTO 10 SQ.MM
12.3.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.
12.3.1.3.1.3 14 SQ.MM TO 28 SQ.MM
12.3.1.3.1.4 28 SQ. MM. & ABOVE
12.3.1.3.2. BY LEAD PITCH
12.3.1.3.2.1 0.5 MM
12.3.1.3.2.2 0.6 MM
12.3.1.3.2.3 0.8 MM
12.3.1.3.3. BY LEAD COUNT RANGE
12.3.1.3.3.1 UPTO 44
12.3.1.3.3.2 44 TO 120
12.3.1.3.3.3 120 TO 200
12.3.1.3.3.4 200 & ABOVE
12.3.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
12.3.1.5. OTHERS
12.4 INDUSTRIAL
12.4.1 BY TYPE
12.4.1.1. THIN QUAD FLAT PACK (TQFP)
12.4.1.1.1. BY BODY SIZE
12.4.1.1.1.1 UPTO 5 SQ. MM.
12.4.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.
12.4.1.1.1.3 15 SQ. MM. & ABOVE
12.4.1.1.2. BY LEAD PITCH
12.4.1.1.2.1 0.4 MM
12.4.1.1.2.2 0.5 MM
12.4.1.1.2.3 0.65 MM
12.4.1.1.2.4 0.8 MM
12.4.1.1.2.5 1.0 MM
12.4.1.1.3. BY LEAD COUNT RANGE
12.4.1.1.3.1 UPTO 32
12.4.1.1.3.2 32 TO 64
12.4.1.1.3.3 64 TO 128
12.4.1.1.3.4 128 & ABOVE
12.4.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)
12.4.1.2.1. BY BODY SIZE
12.4.1.2.1.1 UPTO 7 SQ. MM.
12.4.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.
12.4.1.2.1.3 14 SQ. MM. & ABOVE
12.4.1.2.2. BY LEAD PITCH
12.4.1.2.2.1 0.4 MM
12.4.1.2.2.2 0.5 MM
12.4.1.2.2.3 0.6 MM
12.4.1.2.2.4 0.8 MM
12.4.1.2.3. BY LEAD COUNT RANGE
12.4.1.2.3.1 UPTO 40
12.4.1.2.3.2 04 TO 100
12.4.1.2.3.3 100 TO 200
12.4.1.2.3.4 200 & ABOVE
12.4.1.3. METRIC QUAD FLAT PACK (MQFP)
12.4.1.3.1. BY BODY SIZE
12.4.1.3.1.1 UPTO 10 SQ.MM
12.4.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.
12.4.1.3.1.3 14 SQ.MM TO 28 SQ.MM
12.4.1.3.1.4 28 SQ. MM. & ABOVE
12.4.1.3.2. BY LEAD PITCH
12.4.1.3.2.1 0.5 MM
12.4.1.3.2.2 0.6 MM
12.4.1.3.2.3 0.8 MM
12.4.1.3.3. BY LEAD COUNT RANGE
12.4.1.3.3.1 UPTO 44
12.4.1.3.3.2 44 TO 120
12.4.1.3.3.3 120 TO 200
12.4.1.3.3.4 200 & ABOVE
12.4.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
12.4.1.5. OTHERS
12.5 MILITARY & DEFENSE
12.5.1 BY TYPE
12.5.1.1. THIN QUAD FLAT PACK (TQFP)
12.5.1.1.1. BY BODY SIZE
12.5.1.1.1.1 UPTO 5 SQ. MM.
12.5.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.
12.5.1.1.1.3 15 SQ. MM. & ABOVE
12.5.1.1.2. BY LEAD PITCH
12.5.1.1.2.1 0.4 MM
12.5.1.1.2.2 0.5 MM
12.5.1.1.2.3 0.65 MM
12.5.1.1.2.4 0.8 MM
12.5.1.1.2.5 1.0 MM
12.5.1.1.3. BY LEAD COUNT RANGE
12.5.1.1.3.1 UPTO 32
12.5.1.1.3.2 32 TO 64
12.5.1.1.3.3 64 TO 128
12.5.1.1.3.4 128 & ABOVE
12.5.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)
12.5.1.2.1. BY BODY SIZE
12.5.1.2.1.1 UPTO 7 SQ. MM.
12.5.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.
12.5.1.2.1.3 14 SQ. MM. & ABOVE
12.5.1.2.2. BY LEAD PITCH
12.5.1.2.2.1 0.4 MM
12.5.1.2.2.2 0.5 MM
12.5.1.2.2.3 0.6 MM
12.5.1.2.2.4 0.8 MM
12.5.1.2.3. BY LEAD COUNT RANGE
12.5.1.2.3.1 UPTO 40
12.5.1.2.3.2 04 TO 100
12.5.1.2.3.3 100 TO 200
12.5.1.2.3.4 200 & ABOVE
12.5.1.3. METRIC QUAD FLAT PACK (MQFP)
12.5.1.3.1. BY BODY SIZE
12.5.1.3.1.1 UPTO 10 SQ.MM
12.5.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.
12.5.1.3.1.3 14 SQ.MM TO 28 SQ.MM
12.5.1.3.1.4 28 SQ. MM. & ABOVE
12.5.1.3.2. BY LEAD PITCH
12.5.1.3.2.1 0.5 MM
12.5.1.3.2.2 0.6 MM
12.5.1.3.2.3 0.8 MM
12.5.1.3.3. BY LEAD COUNT RANGE
12.5.1.3.3.1 UPTO 44
12.5.1.3.3.2 44 TO 120
12.5.1.3.3.3 120 TO 200
12.5.1.3.3.4 200 & ABOVE
12.5.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
12.5.1.5. OTHERS
12.6 MEDICAL DEVICES
12.6.1 BY TYPE
12.6.1.1. THIN QUAD FLAT PACK (TQFP)
12.6.1.1.1. BY BODY SIZE
12.6.1.1.1.1 UPTO 5 SQ. MM.
12.6.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.
12.6.1.1.1.3 15 SQ. MM. & ABOVE
12.6.1.1.2. BY LEAD PITCH
12.6.1.1.2.1 0.4 MM
12.6.1.1.2.2 0.5 MM
12.6.1.1.2.3 0.65 MM
12.6.1.1.2.4 0.8 MM
12.6.1.1.2.5 1.0 MM
12.6.1.1.3. BY LEAD COUNT RANGE
12.6.1.1.3.1 UPTO 32
12.6.1.1.3.2 32 TO 64
12.6.1.1.3.3 64 TO 128
12.6.1.1.3.4 128 & ABOVE
12.6.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)
12.6.1.2.1. BY BODY SIZE
12.6.1.2.1.1 UPTO 7 SQ. MM.
12.6.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.
12.6.1.2.1.3 14 SQ. MM. & ABOVE
12.6.1.2.2. BY LEAD PITCH
12.6.1.2.2.1 0.4 MM
12.6.1.2.2.2 0.5 MM
12.6.1.2.2.3 0.6 MM
12.6.1.2.2.4 0.8 MM
12.6.1.2.3. BY LEAD COUNT RANGE
12.6.1.2.3.1 UPTO 40
12.6.1.2.3.2 04 TO 100
12.6.1.2.3.3 100 TO 200
12.6.1.2.3.4 200 & ABOVE
12.6.1.3. METRIC QUAD FLAT PACK (MQFP)
12.6.1.3.1. BY BODY SIZE
12.6.1.3.1.1 UPTO 10 SQ.MM
12.6.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.
12.6.1.3.1.3 14 SQ.MM TO 28 SQ.MM
12.6.1.3.1.4 28 SQ. MM. & ABOVE
12.6.1.3.2. BY LEAD PITCH
12.6.1.3.2.1 0.5 MM
12.6.1.3.2.2 0.6 MM
12.6.1.3.2.3 0.8 MM
12.6.1.3.3. BY LEAD COUNT RANGE
12.6.1.3.3.1 UPTO 44
12.6.1.3.3.2 44 TO 120
12.6.1.3.3.3 120 TO 200
12.6.1.3.3.4 200 & ABOVE
12.6.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
12.6.1.5. OTHERS
12.7 COMMUNICATION
12.7.1 BY TYPE
12.7.1.1. THIN QUAD FLAT PACK (TQFP)
12.7.1.1.1. BY BODY SIZE
12.7.1.1.1.1 UPTO 5 SQ. MM.
12.7.1.1.1.2 5 SQ. MM. TO 15 SQ. MM.
12.7.1.1.1.3 15 SQ. MM. & ABOVE
12.7.1.1.2. BY LEAD PITCH
12.7.1.1.2.1 0.4 MM
12.7.1.1.2.2 0.5 MM
12.7.1.1.2.3 0.65 MM
12.7.1.1.2.4 0.8 MM
12.7.1.1.2.5 1.0 MM
12.7.1.1.3. BY LEAD COUNT RANGE
12.7.1.1.3.1 UPTO 32
12.7.1.1.3.2 32 TO 64
12.7.1.1.3.3 64 TO 128
12.7.1.1.3.4 128 & ABOVE
12.7.1.2. LOW PROFILE QUAD FLAT PACK (LQFP)
12.7.1.2.1. BY BODY SIZE
12.7.1.2.1.1 UPTO 7 SQ. MM.
12.7.1.2.1.2 7 SQ. MM. TO 14 SQ. MM.
12.7.1.2.1.3 14 SQ. MM. & ABOVE
12.7.1.2.2. BY LEAD PITCH
12.7.1.2.2.1 0.4 MM
12.7.1.2.2.2 0.5 MM
12.7.1.2.2.3 0.6 MM
12.7.1.2.2.4 0.8 MM
12.7.1.2.3. BY LEAD COUNT RANGE
12.7.1.2.3.1 UPTO 40
12.7.1.2.3.2 04 TO 100
12.7.1.2.3.3 100 TO 200
12.7.1.2.3.4 200 & ABOVE
12.7.1.3. METRIC QUAD FLAT PACK (MQFP)
12.7.1.3.1. BY BODY SIZE
12.7.1.3.1.1 UPTO 10 SQ.MM
12.7.1.3.1.2 10 SQ. MM. TO 14 SQ. MM.
12.7.1.3.1.3 14 SQ.MM TO 28 SQ.MM
12.7.1.3.1.4 28 SQ. MM. & ABOVE
12.7.1.3.2. BY LEAD PITCH
12.7.1.3.2.1 0.5 MM
12.7.1.3.2.2 0.6 MM
12.7.1.3.2.3 0.8 MM
12.7.1.3.3. BY LEAD COUNT RANGE
12.7.1.3.3.1 UPTO 44
12.7.1.3.3.2 44 TO 120
12.7.1.3.3.3 120 TO 200
12.7.1.3.3.4 200 & ABOVE
12.7.1.4. BUMPERED QUAD FLAT PACK PACKAGES（BQFP)
12.7.1.5. OTHERS
12.8 OTHERS
13 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, BY GEOGRAPHY
GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, (ALL SEGMENTATION PROVIDED ABOVE IS REPRESENTED IN THIS CHAPTER BY COUNTRY)
13.1 NORTH AMERICA
13.1.1 U.S.
13.1.2 CANADA
13.1.3 MEXICO
13.2 EUROPE
13.2.1 GERMANY
13.2.2 FRANCE
13.2.3 U.K.
13.2.4 ITALY
13.2.5 SPAIN
13.2.6 RUSSIA
13.2.7 TURKEY
13.2.8 BELGIUM
13.2.9 NETHERLANDS
13.2.10 NORWAY
13.2.11 FINLAND
13.2.12 SWITZERLAND
13.2.13 DENMARK
13.2.14 SWEDEN
13.2.15 POLAND
13.2.16 REST OF EUROPE
13.3 ASIA PACIFIC
13.3.1 JAPAN
13.3.2 CHINA
13.3.3 SOUTH KOREA
13.3.4 INDIA
13.3.5 AUSTRALIA
13.3.6 NEW ZEALAND
13.3.7 SINGAPORE
13.3.8 THAILAND
13.3.9 MALAYSIA
13.3.10 INDONESIA
13.3.11 PHILIPPINES
13.3.12 TAIWAN
13.3.13 VIETNAM
13.3.14 REST OF ASIA PACIFIC
13.4 SOUTH AMERICA
13.4.1 BRAZIL
13.4.2 ARGENTINA
13.4.3 REST OF SOUTH AMERICA
13.5 MIDDLE EAST AND AFRICA
13.5.1 SOUTH AFRICA
13.5.2 EGYPT
13.5.3 SAUDI ARABIA
13.5.4 U.A.E
13.5.5 OMAN
13.5.6 BAHRAIN
13.5.7 ISRAEL
13.5.8 KUWAIT
13.5.9 QATAR
13.5.10 REST OF MIDDLE EAST AND AFRICA
13.6 KEY PRIMARY INSIGHTS: BY MAJOR COUNTRIES
14 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET,COMPANY LANDSCAPE
14.1 COMPANY SHARE ANALYSIS: GLOBAL
14.2 COMPANY SHARE ANALYSIS: NORTH AMERICA
14.3 COMPANY SHARE ANALYSIS: EUROPE
14.4 COMPANY SHARE ANALYSIS: ASIA PACIFIC
14.5 MERGERS & ACQUISITIONS
14.6 NEW PRODUCT DEVELOPMENT AND APPROVALS
14.7 EXPANSIONS
14.8 REGULATORY CHANGES
14.9 PARTNERSHIP AND OTHER STRATEGIC DEVELOPMENTS
15 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, SWOT & DBMR ANALYSIS
16 GLOBAL QUAD FLAT PACKAGE (QFP) MICROCONTROLLER SOCKET MARKET, COMPANY PROFILE
16.1 JHDPCB. SHENZHEN JIANHONGDA ELECTRONIC TECHNICAL CO.,LTD
16.1.1 COMPANY SNAPSHOT
16.1.2 REVENUE ANALYSIS
16.1.3 GEOGRAPHIC PRESENCE
16.1.4 PRODUCT PORTFOLIO
16.1.5 RECENT DEVELOPMENT
16.2 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
16.2.1 COMPANY SNAPSHOT
16.2.2 REVENUE ANALYSIS
16.2.3 GEOGRAPHIC PRESENCE
16.2.4 PRODUCT PORTFOLIO
16.2.5 RECENT DEVELOPMENT
16.3 ARIES ELECTRONICS
16.3.1 COMPANY SNAPSHOT
16.3.2 REVENUE ANALYSIS
16.3.3 GEOGRAPHIC PRESENCE
16.3.4 PRODUCT PORTFOLIO
16.3.5 RECENT DEVELOPMENT
16.4 SFA SEMICON CO., LTD.
16.4.1 COMPANY SNAPSHOT
16.4.2 REVENUE ANALYSIS
16.4.3 GEOGRAPHIC PRESENCE
16.4.4 PRODUCT PORTFOLIO
16.4.5 RECENT DEVELOPMENT
16.5 YAMAICHI.
16.5.1 COMPANY SNAPSHOT
16.5.2 REVENUE ANALYSIS
16.5.3 GEOGRAPHIC PRESENCE
16.5.4 PRODUCT PORTFOLIO
16.5.5 RECENT DEVELOPMENT
16.6 AMKOR TECHNOLOGY
16.6.1 COMPANY SNAPSHOT
16.6.2 REVENUE ANALYSIS
16.6.3 GEOGRAPHIC PRESENCE
16.6.4 PRODUCT PORTFOLIO
16.6.5 RECENT DEVELOPMENT
16.7 TEXAS INSTRUMENTS INCORPORATED
16.7.1 COMPANY SNAPSHOT
16.7.2 REVENUE ANALYSIS
16.7.3 GEOGRAPHIC PRESENCE
16.7.4 PRODUCT PORTFOLIO
16.7.5 RECENT DEVELOPMENT
16.8 NXP SEMICONDUCTORS
16.8.1 COMPANY SNAPSHOT
16.8.2 REVENUE ANALYSIS
16.8.3 GEOGRAPHIC PRESENCE
16.8.4 PRODUCT PORTFOLIO
16.8.5 RECENT DEVELOPMENT
16.9 ANALOG DEVICES, INC
16.9.1 COMPANY SNAPSHOT
16.9.2 REVENUE ANALYSIS
16.9.3 GEOGRAPHIC PRESENCE
16.9.4 PRODUCT PORTFOLIO
16.9.5 RECENT DEVELOPMENT
16.1 KYOCERA CORPORATION
16.10.1 COMPANY SNAPSHOT
16.10.2 REVENUE ANALYSIS
16.10.3 GEOGRAPHIC PRESENCE
16.10.4 PRODUCT PORTFOLIO
16.10.5 RECENT DEVELOPMENT
16.11 CHIZHOU HISEMI ELECTRONIC TECHNOLOGY CO., LTD
16.11.1 COMPANY SNAPSHOT
16.11.2 REVENUE ANALYSIS
16.11.3 GEOGRAPHIC PRESENCE
16.11.4 PRODUCT PORTFOLIO
16.11.5 RECENT DEVELOPMENT
16.12 OSE CORP
16.12.1 COMPANY SNAPSHOT
16.12.2 REVENUE ANALYSIS
16.12.3 GEOGRAPHIC PRESENCE
16.12.4 PRODUCT PORTFOLIO
16.12.5 RECENT DEVELOPMENT
16.13 JIANGXI WAN NIAN XIN MICRO-ELECTRONICS CO. LTD
16.13.1 COMPANY SNAPSHOT
16.13.2 REVENUE ANALYSIS
16.13.3 GEOGRAPHIC PRESENCE
16.13.4 PRODUCT PORTFOLIO
16.13.5 RECENT DEVELOPMENT
16.14 ENPLAS CORPORATION
16.14.1 COMPANY SNAPSHOT
16.14.2 REVENUE ANALYSIS
16.14.3 GEOGRAPHIC PRESENCE
16.14.4 PRODUCT PORTFOLIO
16.14.5 RECENT DEVELOPMENT
16.15 SENSATA TECHNOLOGIES
16.15.1 COMPANY SNAPSHOT
16.15.2 REVENUE ANALYSIS
16.15.3 GEOGRAPHIC PRESENCE
16.15.4 PRODUCT PORTFOLIO
16.15.5 RECENT DEVELOPMENT
NOTE: THE COMPANIES PROFILED IS NOT EXHAUSTIVE LIST AND IS AS PER OUR PREVIOUS CLIENT REQUIREMENT. WE PROFILE MORE THAN 100 COMPANIES IN OUR STUDY AND HENCE THE LIST OF COMPANIES CAN BE MODIFIED OR REPLACED ON REQUEST
17 CONCLUSION
18 QUESTIONNAIRE
19 RELATED REPORTS
20 ABOUT DATA BRIDGE MARKET RESEARCH
Research Methodology
Data collection and base year analysis are done using data collection modules with large sample sizes. The stage includes obtaining market information or related data through various sources and strategies. It includes examining and planning all the data acquired from the past in advance. It likewise envelops the examination of information inconsistencies seen across different information sources. The market data is analysed and estimated using market statistical and coherent models. Also, market share analysis and key trend analysis are the major success factors in the market report. To know more, please request an analyst call or drop down your inquiry.
The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market and primary (industry expert) validation. Data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Patent Analysis, Pricing Analysis, Company Market Share Analysis, Standards of Measurement, Global versus Regional and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.
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