The market is segmented based on Global Quad Flat Package (QFP) Microcontroller Socket Market, By Types (Low-profile Quad Flat Package (LQFP), Thin Quad Flat Package (TQFP), Plastic Quad Flat Package (PQFP), Bumpered Quad Flat Package (BQFP)), Application (Industrial, Consumer Electronics, Automotive, Medical Devices, Military and Defense) – Industry Trends and Forecast to 2030.
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The Global Quad Flat Package Qfp Microcontroller Socket Market size was valued at USD 1236.30 USD Million in 2022.
The Global Quad Flat Package Qfp Microcontroller Socket Market is projected to grow at a CAGR of 5.3% during the forecast period of 2023 to 2030.
The major players operating in the market include Intel Corporation , Loranger International Corporation , Aries Electronics , Enplas Corporation , Johnstech , Mill-Max Mfg. Corp , Molex , Foxconn Technology Group , Sensata Technologies Inc , Plastronics , TE Connectivity , Chupond Precision Co. Ltd. , Socionext America Inc. , Win Way Technology Co. Ltd. , ChipMOS TECHNOLOGIES INC , 3M , Yamaichi Electronics Co. .
The market report covers data from the U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, Saudi Arabia, U.A.E., South Africa, Egypt, Israel, Rest of the Middle East and Africa.
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The data presented is for visualization purposes only and may not reflect actual results.