- In June 2024, Multibeam Corp. introduced its MB platform, the first-ever Multicolumn E-Beam Lithography (MEBL) system, designed to improve chip manufacturing. This fully automated, precision-patterning technology is intended for mass production, with applications in rapid prototyping, advanced packaging, high-mix production, chip identification, compound semiconductors, and more
- In January 2024, ZEISS, in collaboration with ASML Holding, launched high NA-EUV lithography technology, which will enable a threefold increase in transistor density for advanced microchips. This breakthrough European technology, featuring ZEISS's ultra-precise optical system developed over 25 years, is set to power the first series production of next-generation microchips in 2025
- In October 2023, Canon released the FPA-1200NZ2C nanoimprint semiconductor manufacturing equipment, designed to carry out circuit pattern transfers, an essential step in semiconductor production
- In December 2022, Bruker Corporation acquired Neurescence Inc., a leading developer of ultralight fiber-bundle Multiscopes™ for optical functional neuroimaging in multi-regions. This acquisition strengthens Bruker's position in the field of freely behaving animal imaging and photostimulation, expanding their research and imaging capabilities for emerging trends
- In July 2021, Qualcomm partnered with General Motors to incorporate AI and 5G connectivity into future automotive systems. This collaboration aims to develop next-generation telematics systems and enhance the performance of ADAS and autonomous driving by powering digital cockpits
Frequently Asked Questions
Companies such as EV Group (EVG) (Austria), SUSS MicroTec SE (Germany), Canon Inc. (Japan), Nikon Corporation (Japan), ASML (Netherlands), Ultratech Inc. (U.S.), Neutronix Inc. (U.S.), and OAI (Optical Associates, Inc.) are the major companies in the Mask Alignment System market.
The countries covered in the market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E., South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.
