Global Dicing Tapes Market, By Type (Wafer Dicing, Back Grinding), Coating (Double Sided, Single Sided), Strength (Tensile Strength, Adhesive Strength, Elongation), Backing Material (Polyethylene Terephthalate (PET), Polyvinyl Chloride (PVC), Ethylene-Vinyl Acetate (EVA), Polyolefin (PO)), Product (Silicon Free Adhesive Films, UV Curable Dicing Type, Non UV Curable Dicing Type), Application (Package Dicing, Wafer Dicing, Resin Substrate Manufacturing, Adhesive Control Needs, Glass, Ceramics), Thickness (Below 85 Microns, 85-125 Microns, 126-150 Microns, Above 150 Microns), Country (U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, U.A.E, Saudi Arabia, Egypt, South Africa, Israel, Rest of Middle East and Africa) Industry Trends and Forecast to 2028.
Market Analysis and Insights : Global Dicing Tapes Market
The dicing tapes market will grow at a rate of 7.95% for the forecast period of 2021 to 2028. Rise in the demand for aesthetically thin electronics is an essential factor driving the dicing tapes market.
Dicing tape is defined as a type of backing tape, and is being extensively used during the production of electrical and electronic products. Dicing tape has found application for the dicing of wafers, glass, packaging, and ceramics, among others, positively impacting the growth of the global dicing tapes market.
Rise in the demand for aesthetically thin electronics has resulted in thinner and more delicate component which acts as the major factor escalating the market growth, also rise in the presence of dicing tape manufacturers and growing preference for the miniaturization of electronic devices are the major factors among others propelling the growth of dicing tapes market. Moreover, rise in the research and development activities and rise in the demand from emerging economies will further create new opportunities for the dicing tapes market in the in the forecast period of 2021- 2028.
However, rise in the cost of research and development activities is the major factor among others restraining the market growth, and will further challenge the growth of dicing tapes market.
This dicing tapes market report provides details of new recent developments, trade regulations, import export analysis, production analysis, value chain optimization, market share, impact of domestic and localised market players. The report analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographical expansions, technological innovations in the market. To gain more info on the dicing tapes market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Dicing Tapes Market Scope and Market Size
The dicing tapes market is segmented on the basis of type, coating, strength, backing material, product, application and thickness. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target markets.
- On the basis of type, the dicing tapes market is segmented into wafer dicing and back grinding.
- Based on coating, the dicing tapes market is segmented into double sided and single sided.
- Based on strength, the dicing tapes market is segmented into tensile strength, adhesive strength and elongation.
- Based on backing material, the dicing tapes market is segmented into polyethylene terephthalate (PET), polyvinyl chloride (PVC), ethylene-vinyl acetate (EVA) and polyolefin (PO).
- Based on product, the dicing tapes market is segmented into silicon free adhesive films, UV curable dicing type and non UV curable dicing type.
- Based on application, the dicing tapes market is segmented into package dicing, wafer dicing, resin substrate manufacturing, adhesive control needs, glass and ceramics.
- The dicing tapes market is also segmented on the basis of thickness into below 85 microns, 85-125 microns, 126-150 microns and above 150 microns.
Dicing Tapes Market Country Level Analysis
The dicing tapes market is analysed and market size, volume information is provided by type, coating, strength, backing material, product, application and thickness as referenced above.
The countries covered in the dicing tapes market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, Israel, Egypt, South Africa, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.
Asia-Pacific dominates dicing tapes market due to increase in the demand for aesthetically thin electronics, rise in the presence of dicing tape manufacturers and growing preference for the miniaturization of electronic devices in this region.
The country section of the dicing tapes market report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as consumption volumes, production sites and volumes, import export analysis, price trend analysis, cost of raw materials, down-stream and upstream value chain analysis are some of the major pointers used to forecast the market scenario for individual countries. Also, presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Dicing Tapes Market Share Analysis
The dicing tapes market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to dicing tapes market.
The major players covered in the dicing tapes market report are Sumitomo Bakelite Co., Ltd, Daest Coating India Pvt Ltd, AI Technology, Inc., Denka Company Limited, ULTRON SYSTEMS, INC, Pantech Tape Co., Ltd, NITTO DENKO CORPORATION, QES GROUP OF COMPANIES, NIPPON PULSE MOTOR Co., Ltd, LINTEC Corporation, Mitsui Chemicals, Inc, Loadpoint, Shenzhen Xinst Technology Co., Ltd and Solar Plus Company among other domestic and global players. Market share data is available for global, North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America separately. DBMR analysts understand competitive strengths and provide competitive analysis for each competitor separately.
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