Asia-Pacific Wi-Fi Chipset Market, By Devices (Smartphones, Connected Home Devices, Access Point Equipment, PCs, Tablets, Others), Band (Single Band, Dual Band, Tri Band), Fabrication Technology (FinFET, FDSOI CMOS, Silicon On Insulator (SOI) and Sige), Wi-Fi Standard (802.11n, 802.11ac, Wave 2, 802.11ac, Wave 1, 802.11ax, 802.11ad, 802.11ay, 802.11b, 802.11g, Others), Die Size (28nm, 20nm, 14nm, 10nm and others), MIMO Configuration (MU-MIMO, 4x4 MU-MIMO, 8x8 MU-MIMO, SU-MIMO, 3x3 MU-MIMO, 2x2 MU-MIMO, 1x1 MU-MIMO), End User (Consumer, Automotive and Transportation, Healthcare, Education, BFSI, Travel and Hospitality, Others) - Industry Trends and Forecast to 2030.
Asia-Pacific Wi-Fi Chipset Market Analysis and Size
The increasing adoption of IoT, rising globalization and growing number of public Wi-Fi hotspots across the globe will emerge as the major factor driving market growth. In addition to this, the surging number of small scale industries aiming to adopt high speed network connectivity along with growing penetration of consumer electronic gadgets like smartphones, laptops and others will further aggravate the market value. Due to the growing popularity of smartphones worldwide, Wi-Fi technology has increased usage. Customers prefer Voice-Over Mobile Broadband (VOMBB) over traditional telecom carriers because of its great audio quality, lower cost, and ability to save power, fueling demand for Wi-Fi services worldwide
The Asia-Pacific Wi-Fi chipset market was valued at USD 6,475.22 million in 2022 and is expected to reach USD 8,056.22million by 2030, registering a CAGR of 3.2% during the forecast period of 2023-2030. The "smartphones" accounts for the couse type segment in the market, owing to the surging demand for applications. In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.
Asia-Pacific Wi-Fi Chipset Market Scope and Segmentation
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Report Metric
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Details
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Forecast Period
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2023-2030
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Base Year
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2022
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Historic Years
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2021 (Customizable to 2015- 2020)
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Quantitative Units
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Revenue in USD million, Volumes in Units, Pricing in USD
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Segments Covered
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Devices (Smartphones, Connected Home Devices, Access Point Equipment, PCs, Tablets, Others), Band (Single Band, Dual Band, Tri Band), Fabrication Technology (FinFET, FDSOI CMOS, Silicon On Insulator (SOI) and Sige), Wi-Fi Standard (802.11n, 802.11ac, Wave 2, 802.11ac, Wave 1, 802.11ax, 802.11ad, 802.11ay, 802.11b, 802.11g, Others), Die Size (28nm, 20nm, 14nm, 10nm and others), MIMO Configuration (MU-MIMO, 4x4 MU-MIMO, 8x8 MU-MIMO, SU-MIMO, 3x3 MU-MIMO, 2x2 MU-MIMO, 1x1 MU-MIMO), End User (Consumer, Automotive and Transportation, Healthcare, Education, BFSI, Travel and Hospitality, Others
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Countries Covered
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Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific
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Market Players Covered
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Intel Corporation (U.S.), Qualcomm Technologies. Inc., (U.S.), ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD (China), Broadcom, (U.S.), Hitachi(U.S.), Cisco Systems, Inc (U.S.), Microsoft (U.S.), Apple Inc (U.S.), Celeno Communications (U.S.), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), STMicroelectronics (U.S.)
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Market Opportunities
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Market Definition
Wi-Fi chipset is basically an integrated circuit of wireless signals that are generally installed in laptops, routers and cellular phones. They are used to connect all the devices and allow the users to access networked services over wireless connection. In addition to this, rising technological advancements and growing expenditure to undertake research and development proficiencies generate new opportunities for growing the market within the forecast period 2023-2030. The rising security concerns due to growing cases of data leaks will dampen the growth rate that further result as a challenge for the market.
Asia-Pacific Wi-Fi Chipset Market Dynamics
Driver
- Increasing Data Traffic
The significantly increasing data traffic has accelerated the need for superior network connectivity across several verticals, such as corporate and industrial. Thus, it is expected to boost the installations of wi-fi 6 and 6E devices and subsequently increase the demand for their chipsets in the next seven years.
Opportunity
- Adoption of Modern Devices
Manufacturing factories are evolving significantly to improve their operational efficiency. The adoption of modern devices such as Augmented Reality/ Virtual Reality (AR/VR), wireless cameras, and collaborative robots is gaining momentum across the manufacturing industries. The operation of these devices seamlessly requires enhanced wireless network connectivity. Thus, it is expected to boost the adoption of Wi-Fi 6 and 6E devices and their components over the next seven years.
Restraint/Challenge
- High Cost
Owing to the widespread use of connected devices and the growing acceptance of wireless communication technologies, the Asia-Pacific Wi-Fi chipset market has been expanding consistently. The market was being driven by elements including the expanding demand for high-speed internet access, the increase of internet users, and the development of IoT applications. Hence the high cost of chipset and lack of professionals will restraint the growth of the market.
This Asia-Pacific Wi-Fi chipset market, report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the Asia-Pacific Wi-Fi chipset market, contact data bridge market research for an analyst brief, our team will help you take an informed market decision to achieve market growth.
Impact and Current Market Scenario of Raw Material Shortage and Shipping Delays
Data Bridge Market Research offers a high-level analysis of the market and delivers information by keeping in account the impact and current market environment of raw material shortage and shipping delays. This translates into assessing strategic possibilities, creating effective action plans, and assisting businesses in making important decisions.
Apart from the standard report, we also offer in-depth analysis of the procurement level from forecasted shipping delays, distributor mapping by region, commodity analysis, production analysis, price mapping trends, sourcing, category performance analysis, supply chain risk management solutions, advanced benchmarking, and other services for procurement and strategic support.
Expected Impact of Economic Slowdown on the Pricing and Availability of Products
When economic activity slows, industries begin to suffer. The forecasted effects of the economic downturn on the pricing and accessibility of the products are taken into account in the market insight reports and intelligence services provided by DBMR. With this, our clients can typically keep one step ahead of their competitors, project their sales and revenue, and estimate their profit and loss expenditures.
Recent Development
- In 2020, Broadcom Inc. unveiled the BCM4389, the world debut of the Wi-Fi 6E customer device. The device expands the level to accommodate the about-to-be-workable 6 GHz band alongside broader 160 MHz channel bandwidths, doubling the speeds and cutting latency in half compared to the previous device
Asia-Pacific Wi-Fi Chipset Market Scope
The Asia-Pacific Wi-Fi chipset market is segmented on the basis of device, band, fabrication technology, WI-FI Standard, die size, MIMO configuration and end user. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target market.
Device
- Tablet
- Connected Home Devices
- Smartphones
- PCS
- Access Point Equipment
- Others
Band
- Single Band
- Dual Band
- Tri Band
Fabrication Technology
- Finfet
- FDSOI CMOS
- Silicon on Insulator (SOI)
- Sige
Wifi Standards
- 802.11AY
- 802.11AD
- 802.11AX
- 802.11AC
- WAVE 1
- 802.11AC
- WAVE 2
- 802.11B
- 802.11G
- 802.11N
Die Size
- 28nm
- 20nm
- 14nm
- 10nm
- Others
MIMO Configuration
- SU-MIMO
- MU-MIMO
- 1X1 MU-MIMO
- 2X2 MU-MIMO
- 3X3 MU-MIMO
- 4X4 MU-MIMO
- 8X8 MU-MIMO
End User
- Consumer
- Automotive
- Transportation
- Healthcare
- Education
- BFSI
- Travel
- Hospitality
- Others
Asia-Pacific Wi-Fi Chipset Market Region Analysis/Insights
The Asia-Pacific Wi-Fi chipset market is analyzed and market size, volume information is provided by device, band, fabrication technology, WI-FI Standard, die size, MIMO configuration and end user as referenced above.
The countries covered in the Asia-Pacific Wi-Fi chipset market report China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines and rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC).
China is dominating the Asia-Pacific Wi-Fi chipset market and is fastest growing country due to low-cost manufacturing of Wi-Fi chipsets and large number of consumer electronics players present within the region.
The country section of the Asia-Pacific Wi-Fi chipset market report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as consumption volumes, production sites and volumes, import export analysis, price trend analysis, cost of raw materials, down-stream and upstream value chain analysis are some of the major pointers used to forecast the market scenario for individual countries. Also, presence and availability of Asia-Pacific brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Asia-Pacific Wi-Fi Chipset Market Share Analysis
The Asia-Pacific Wi-Fi chipset market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, regional presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to biosensors market.
Some of the major players operating in the market are
- Intel Corporation (U.S.)
- Qualcomm Technologies. Inc., (U.S.)
- ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD (China)
- Broadcom, (U.S.)
- Hitachi(U.S.)
- Cisco Systems, Inc(U.S.),
- Microsoft(U.S.)
- Apple Inc(U.S.)
- Celeno Communications(U.S.)
- Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
- STMicroelectronics(U.S.)
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