글로벌 반도체 웨이퍼 연마 및 연삭 장비 시장 – 2031년까지의 산업 동향 및 예측

시장 분석 및 통찰력: 글로벌 반도체 웨이퍼 연마 및 연삭 장비 시장

집적 회로(IC) 제조에서 반도체 웨이퍼 연마 및 연삭 장비는 중요한 역할을 합니다. 이 장비는 IC를 제조하는 데 필요한 높은 수준의 표면 평탄도와 매끄러움을 달성하는 데 사용됩니다. 이러한 도구는 표면 결함을 제거하고 균일한 두께를 보장하여 회로의 무결성과 성능을 유지하는 데 도움이 됩니다. 연마 및 연삭은 후속 포토리소그래피 및 에칭 공정을 위해 웨이퍼를 준비하는 데 필수적인 단계이며, 이는 IC의 복잡한 패턴을 정의하는 데 필수적입니다.

글로벌 반도체 웨이퍼 연마 및 연삭 장비 시장 규모는 2023년에 4억 894만 달러로 평가되었으며, 2031년까지 5억 4,059만 달러에 도달할 것으로 예상되며, 2024년에서 2031년까지의 예측 기간 동안 CAGR은 3.55%입니다. Data Bridge Market Research에서 큐레이팅한 시장 보고서에는 시장 가치, 성장률, 세분화, 지리적 범위, 주요 업체와 같은 시장 시나리오에 대한 통찰력 외에도 심층적인 전문가 분석, 지리적으로 대표되는 회사별 생산 및 용량, 유통업체 및 파트너의 네트워크 레이아웃, 자세하고 업데이트된 가격 추세 분석, 공급망 및 수요의 적자 분석이 포함됩니다.

보고 범위 및 시장 세분화       

시장 정의

Semiconductor wafer polishing and grinding equipment is used in the manufacturing process of semiconductor wafers to achieve the required surface flatness and smoothness. This equipment helps remove imperfections and prepare the wafers for further processing and fabrication of semiconductor devices.

Semiconductor Wafer Polishing and Grinding Equipment Market Dynamics

Drivers

• Escalating Demand for Semiconductors

Industries integrate semiconductor components such as 5G, IoT, and AI, into their products, the need for high-quality wafer manufacturing rises. Semiconductor wafer polishing and grinding equipment play a crucial role in enhancing the efficiency and performance of semiconductor devices by ensuring precise surface finishes and uniform thickness. This demand surge motivates manufacturers to invest in advanced equipment to meet the stringent quality requirements of the semiconductor industry, thereby driving the growth of the market.

• Growing Advancements in Technology

Advancements in technology require increasingly smaller and more powerful semiconductor components which drives the need for precision polishing and grinding equipment to meet stringent manufacturing standards. Innovations in materials science, such as the emergence of new semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC), are further driving the demand for specialized equipment capable of processing these materials with high precision. As technology continues to evolve, the semiconductor wafer polishing and grinding equipment market is poised for significant growth to meet the demands of emerging applications in sectors like automotive, healthcare, and telecommunications.

Opportunities

• Expansion of the Internet of Things (IoT)

IoT enables real-time monitoring and control of equipment performance, enhancing precision and efficiency in wafer polishing and grinding. Connected devices gather data on process parameters, enabling predictive maintenance and optimizing production workflows. This connectivity fosters seamless communication between equipment and operators, reducing downtime and ensuring consistent quality. As IoT adoption proliferates, the semiconductor industry increasingly relies on advanced wafer polishing and grinding equipment to meet the demands of IoT-driven applications, thus driving market growth.

• Increasing Government Initiatives

Many governments around the world are actively investing in semiconductor manufacturing infrastructure to boost domestic production and technological capabilities. These initiatives include funding research and development, providing incentives for semiconductor companies, and establishing semiconductor fabrication facilities. In addition, government policies aimed at promoting innovation and competitiveness in the semiconductor industry stimulate demand for advanced wafer processing equipment. Fostering a conducive environment for semiconductor manufacturing, governments contribute to the growth of the wafer polishing and grinding equipment market and drive technological advancements in the field.

Restraints/Challenges

• High Initial Investment

The specialized machinery required for wafer polishing and grinding demands substantial capital upfront, deterring entry for smaller players and startups. This barrier limits market participation, restricting competition and innovation. Moreover, for companies already in the market, the need for continuous investment in cutting-edge equipment to remain competitive adds to the financial burden. This high initial investment exacerbates market consolidation, hindering market dynamism and potentially impacting technological advancements.

• Technological Complexity

The operation and maintenance of these machines require specialized knowledge and expertise, which can be challenging for companies to acquire and retain. Moreover, the continuous advancements in semiconductor technology necessitate frequent upgrades and modifications to equipment, adding to the complexity. Training personnel to operate and troubleshoot these sophisticated systems incurs additional costs and time. This complexity increases the initial investment and raises the risk of operational disruptions and downtime, hindering market growth and adoption of the equipment.

This market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the market, contact data bridge market research for an analyst brief, our team will help you take an informed market decision to achieve market growth.

Impact and Current Market Scenario of Raw Material Shortage and Shipping Delays

Data Bridge Market Research offers a high-level analysis of the market and delivers information by keeping in account the impact and current market environment of raw material shortage and shipping delays. This translates into assessing strategic possibilities, creating effective action plans, and assisting businesses in making important decisions.

Apart from the standard report, we also offer in-depth analysis of the procurement level from forecasted shipping delays, distributor mapping by region, commodity analysis, production analysis, price mapping trends, sourcing, category performance analysis, supply chain risk management solutions, advanced benchmarking, and other services for procurement and strategic support.

Expected Impact of Economic Slowdown on the Pricing and Availability of Products

When economic activity slows, industries begin to suffer. The forecasted effects of the economic downturn on the pricing and accessibility of the products are taken into account in the market insight reports and intelligence services provided by DBMR. With this, our clients can typically keep one step ahead of their competitors, project their sales and revenue, and estimate their profit and loss expenditures.

Recent Developments

• In June 2022, Applied Materials announced the acquisition of Picosun Oy, a Finnish semiconductor equipment company. This strategic move aims to enhance Applied Materials' ICAPS (IoT, Communications, Automotive, Power, and Sensors) product offerings and deepen customer engagements by integrating Picosun's advanced atomic layer deposition (ALD) technology into its portfolio
• In February 2022, Revasum secured a growth capital facility from SQN Venture Partners, LLC, valued at up to USD 8 million. This debt financing is intended to accelerate the development of new products and provide working capital to support the company's rapid growth, allowing Revasum to expand its capabilities and market reach

Semiconductor Wafer Polishing and Grinding Equipment Market Scope

The market is segmented on the basis of equipment and end-users. The growth among segments helps you analyze niche pockets of growth and strategies to approach the market and determine your core application areas and the difference in your target markets.

Equipment

• Deposition
• Lithography
• Ion Implant
• Etching and Cleaning
• Others

End-Users

• Foundries
• Memory Manufacturers
• IDMs
• Others

Semiconductor Wafer Polishing and Grinding Equipment Market Analysis/Insights

The market is analysed, and market size, volume information is provided by country, equipment, and end-users as referenced above.   

The countries covered in the market are U.S., Canada, Mexico, Brazil, Argentina, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Saudi Arabia, U.A.E., South Africa, Egypt, and Israel.

북미는 주로 이 지역에 주요 산업 기업이 존재하기 때문에 시장을 지배합니다. 또한 자동차 애플리케이션에서 전력 반도체 IC에 대한 수요가 증가하고 전기 인프라에 대한 상당한 투자가 예측 기간 동안 북미의 시장 성장을 더욱 촉진할 것으로 예상됩니다.

아시아 태평양 지역은 시장에서 상당한 성장을 경험할 것으로 예상됩니다. 이러한 장비 유형의 적용이 증가함에 따라 이러한 성장이 촉진됩니다. 또한, 팹리스 반도체 산업 내에서의 통합이 증가함에 따라 향후 몇 년 동안 기업들이 보다 효율적이고 진보된 제조 공정을 추구함에 따라 시장 확장이 더욱 촉진될 것으로 예상됩니다.

보고서의 국가 섹션은 또한 개별 시장 영향 요인과 국내 시장의 현재 및 미래 트렌드에 영향을 미치는 규제 변화를 제공합니다. 다운스트림 및 업스트림 가치 사슬 분석, 기술 트렌드 및 포터의 5가지 힘 분석, 사례 연구와 같은 데이터 포인트는 개별 국가의 시장 시나리오를 예측하는 데 사용되는 몇 가지 포인터입니다. 또한 글로벌 브랜드의 존재 및 가용성과 지역 및 국내 브랜드와의 대규모 또는 희소한 경쟁으로 인해 직면한 과제, 국내 관세 및 무역 경로의 영향이 국가 데이터에 대한 예측 분석을 제공하는 동안 고려됩니다.

경쟁 환경 및 반도체 웨이퍼 연마 및 연삭 장비 시장 점유율 분석

시장 경쟁 구도는 경쟁자별 세부 정보를 제공합니다. 포함된 세부 정보는 회사 개요, 회사 재무, 창출된 수익, 시장 잠재력, 연구 개발 투자, 새로운 시장 이니셔티브, 글로벌 입지, 생산 현장 및 시설, 생산 용량, 회사의 강점과 약점, 제품 출시, 제품 폭과 범위, 애플리케이션 우세입니다. 위에 제공된 데이터 포인트는 시장과 관련된 회사의 초점에만 관련이 있습니다.

시장에서 운영되는 주요 업체 중 일부는 다음과 같습니다.

• Applied Materials, Inc. (미국)
• 에바라 주식회사(일본)
• 랩마스터 볼터스(미국)
• 엔트레픽스 주식회사(미국)
• 레바숨(미국)
• TOKYO SEIMITSU CO., LTD (일본)
• Logomatic GmbH(독일)
• 코마츠 NTC(일본)
• 오카모토 주식회사(일본)
• Amtech Systems, Inc. (미국)
• BBS KINMEI 주식회사(일본)
• DYMEK Company Ltd. (홍콩)
• 로지텍(스위스)
• 삼성(한국)
• 브로드컴(미국)
• Qualcomm Technologies, Inc. (미국)
• Advanced Micro Devices, Inc. (AMD) (미국)
• 애플 주식회사(미국)
• 마벨(미국)
• 자일링스(미국)
• 엔비디아 코퍼레이션(미국)

SKU-46567