Global Semiconductor Wafer Polishing and Grinding Equipment Market – Industry Trends and Forecast to 2031

Análisis y perspectivas del mercado: mercado mundial de equipos de pulido y rectificado de obleas de semiconductores

En la fabricación de circuitos integrados (CI), los equipos de pulido y rectificado de obleas de semiconductores desempeñan un papel fundamental. Estos equipos se utilizan para lograr los altos niveles de planitud y suavidad de la superficie necesarios para la fabricación de CI. Estas herramientas ayudan a preservar la integridad y el rendimiento de los circuitos eliminando las imperfecciones de la superficie y garantizando un espesor uniforme. El pulido y el rectificado son pasos esenciales para preparar las obleas para los procesos posteriores de fotolitografía y grabado, que son vitales para definir los intrincados patrones de los CI.

El tamaño del mercado global de equipos de pulido y rectificado de obleas de semiconductores se valoró en USD 408,94 millones en 2023 y se proyecta que alcance los USD 540,59 millones para 2031, con una CAGR del 3,55% durante el período de pronóstico de 2024 a 2031. Además de la información sobre escenarios de mercado como el valor de mercado, la tasa de crecimiento, la segmentación, la cobertura geográfica y los principales actores, los informes de mercado seleccionados por Data Bridge Market Research también incluyen un análisis experto en profundidad, producción y capacidad por empresa representada geográficamente, diseños de red de distribuidores y socios, análisis de tendencias de precios detallado y actualizado y análisis de déficit de la cadena de suministro y la demanda.

Alcance del informe y segmentación del mercado       

Definición de mercado

Los equipos de pulido y esmerilado de obleas semiconductoras se utilizan en el proceso de fabricación de obleas semiconductoras para lograr la planitud y suavidad de la superficie requeridas. Este equipo ayuda a eliminar imperfecciones y a preparar las obleas para su posterior procesamiento y fabricación de dispositivos semiconductores.

Dinámica del mercado de equipos de pulido y rectificado de obleas de semiconductores

Conductores

• Demanda creciente de semiconductores

Las industrias integran componentes semiconductores como 5G, IoT e IA en sus productos, lo que aumenta la necesidad de fabricación de obleas de alta calidad. Los equipos de pulido y rectificado de obleas de semiconductores desempeñan un papel crucial en la mejora de la eficiencia y el rendimiento de los dispositivos semiconductores al garantizar acabados superficiales precisos y un espesor uniforme. Este aumento de la demanda motiva a los fabricantes a invertir en equipos avanzados para cumplir con los estrictos requisitos de calidad de la industria de los semiconductores, impulsando así el crecimiento del mercado.

• Crecientes avances en la tecnología

Los avances tecnológicos requieren componentes semiconductores cada vez más pequeños y potentes, lo que impulsa la necesidad de equipos de pulido y rectificado de precisión para cumplir con los estrictos estándares de fabricación. Las innovaciones en la ciencia de los materiales, como la aparición de nuevos materiales semiconductores como el nitruro de galio (GaN) y el carburo de silicio (SiC) , están impulsando aún más la demanda de equipos especializados capaces de procesar estos materiales con alta precisión. A medida que la tecnología continúa evolucionando, el mercado de equipos de pulido y rectificado de obleas de semiconductores está preparado para un crecimiento significativo para satisfacer las demandas de las aplicaciones emergentes en sectores como la automoción, la atención sanitaria y las telecomunicaciones.

Oportunidades

• Expansión del Internet de las cosas (IoT)

El IoT permite la monitorización y el control en tiempo real del rendimiento de los equipos, mejorando la precisión y la eficiencia en el pulido y el esmerilado de obleas. Los dispositivos conectados recopilan datos sobre los parámetros del proceso, lo que permite el mantenimiento predictivo y optimiza los flujos de trabajo de producción. Esta conectividad fomenta la comunicación fluida entre los equipos y los operadores, lo que reduce el tiempo de inactividad y garantiza una calidad constante. A medida que prolifera la adopción del IoT, la industria de los semiconductores depende cada vez más de equipos avanzados de pulido y esmerilado de obleas para satisfacer las demandas de las aplicaciones impulsadas por el IoT, lo que impulsa el crecimiento del mercado.

• Aumentar las iniciativas gubernamentales

Many governments around the world are actively investing in semiconductor manufacturing infrastructure to boost domestic production and technological capabilities. These initiatives include funding research and development, providing incentives for semiconductor companies, and establishing semiconductor fabrication facilities. In addition, government policies aimed at promoting innovation and competitiveness in the semiconductor industry stimulate demand for advanced wafer processing equipment. Fostering a conducive environment for semiconductor manufacturing, governments contribute to the growth of the wafer polishing and grinding equipment market and drive technological advancements in the field.

Restraints/Challenges

• High Initial Investment

The specialized machinery required for wafer polishing and grinding demands substantial capital upfront, deterring entry for smaller players and startups. This barrier limits market participation, restricting competition and innovation. Moreover, for companies already in the market, the need for continuous investment in cutting-edge equipment to remain competitive adds to the financial burden. This high initial investment exacerbates market consolidation, hindering market dynamism and potentially impacting technological advancements.

• Technological Complexity

The operation and maintenance of these machines require specialized knowledge and expertise, which can be challenging for companies to acquire and retain. Moreover, the continuous advancements in semiconductor technology necessitate frequent upgrades and modifications to equipment, adding to the complexity. Training personnel to operate and troubleshoot these sophisticated systems incurs additional costs and time. This complexity increases the initial investment and raises the risk of operational disruptions and downtime, hindering market growth and adoption of the equipment.

This market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the market, contact data bridge market research for an analyst brief, our team will help you take an informed market decision to achieve market growth.

Impact and Current Market Scenario of Raw Material Shortage and Shipping Delays

Data Bridge Market Research offers a high-level analysis of the market and delivers information by keeping in account the impact and current market environment of raw material shortage and shipping delays. This translates into assessing strategic possibilities, creating effective action plans, and assisting businesses in making important decisions.

Apart from the standard report, we also offer in-depth analysis of the procurement level from forecasted shipping delays, distributor mapping by region, commodity analysis, production analysis, price mapping trends, sourcing, category performance analysis, supply chain risk management solutions, advanced benchmarking, and other services for procurement and strategic support.

Expected Impact of Economic Slowdown on the Pricing and Availability of Products

When economic activity slows, industries begin to suffer. The forecasted effects of the economic downturn on the pricing and accessibility of the products are taken into account in the market insight reports and intelligence services provided by DBMR. With this, our clients can typically keep one step ahead of their competitors, project their sales and revenue, and estimate their profit and loss expenditures.

Recent Developments

• In June 2022, Applied Materials announced the acquisition of Picosun Oy, a Finnish semiconductor equipment company. This strategic move aims to enhance Applied Materials' ICAPS (IoT, Communications, Automotive, Power, and Sensors) product offerings and deepen customer engagements by integrating Picosun's advanced atomic layer deposition (ALD) technology into its portfolio
• In February 2022, Revasum secured a growth capital facility from SQN Venture Partners, LLC, valued at up to USD 8 million. This debt financing is intended to accelerate the development of new products and provide working capital to support the company's rapid growth, allowing Revasum to expand its capabilities and market reach

Semiconductor Wafer Polishing and Grinding Equipment Market Scope

The market is segmented on the basis of equipment and end-users. The growth among segments helps you analyze niche pockets of growth and strategies to approach the market and determine your core application areas and the difference in your target markets.

Equipment

• Deposition
• Lithography
• Ion Implant
• Etching and Cleaning
• Others

End-Users

• Foundries
• Memory Manufacturers
• IDMs
• Others

Semiconductor Wafer Polishing and Grinding Equipment Market Analysis/Insights

The market is analysed, and market size, volume information is provided by country, equipment, and end-users as referenced above.   

The countries covered in the market are U.S., Canada, Mexico, Brazil, Argentina, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Saudi Arabia, U.A.E., South Africa, Egypt, and Israel.

North America dominates the market, primarily due to the presence of major industry players in the region. In addition, the increasing demand for power semiconductor ICs in automotive applications and significant investments in electric infrastructure are expected to further drive market growth in North America during the forecast period.

Asia-Pacific is expected to experience significant growth in the market. The increasing applications of these equipment types drive this growth. Additionally, the rising consolidation within the fabless semiconductor industry is anticipated to boost market expansion further, as companies seek more efficient and advanced manufacturing processes in the coming years.

The country section of the report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.

Competitive Landscape and Semiconductor Wafer Polishing and Grinding Equipment Market Share Analysis

The market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to the market.

Some of the major players operating in the market are

• Applied Materials, Inc. (U.S.)
• EBARA CORPORATION (Japan)
• Lapmaster Wolters (U.S.)
• Entrepix, Inc. (U.S.)
• Revasum (U.S.)
• TOKYO SEIMITSU CO., LTD (Japan)
• Logomatic GmbH (Germany)
• Komatsu NTC (Japan)
• Okamoto Corporation (Japan)
• Amtech Systems, Inc. (U.S.)
• BBS KINMEI CO., LTD. (Japan)
• DYMEK Company Ltd. (Hong Kong)
• Logitech (Switzerland)
• SAMSUNG (South Korea)
• Broadcom (U.S.)
• Qualcomm Technologies, Inc. (U.S.)
• Advanced Micro Devices, Inc. (AMD) (U.S.)
• Apple Inc. (U.S.)
• Marvell (U.S.)
• Xilinx (U.S.)
• NVIDIA Corporation (U.S.)

SKU-46567