Global Interposer and Fan-Out WLP Market – Industry Trends and Forecast to 2030

Inhaltsverzeichnis anfordernInhaltsverzeichnis anfordern Mit Analyst sprechen Mit Analyst sprechen Jetzt kaufenJetzt kaufen Vor dem Kauf anfragen Vorher anfragen Kostenloser Beispielbericht Kostenloser Beispielbericht

Global Interposer and Fan-Out WLP Market – Industry Trends and Forecast to 2030

  • Semiconductors and Electronics
  • Upcoming Reports
  • Oct 2023
  • Global
  • 350 Seiten
  • Anzahl der Tabellen: 220
  • Anzahl der Abbildungen: 60

Global Interposer Fan Wlp Market

Marktgröße in Milliarden USD

CAGR :  % Diagram

Diagramm Prognosezeitraum
2023 –2030
Diagramm Marktgröße (Basisjahr)
MILLIONEN USD
Diagramm Marktgröße (Prognosejahr)
MILLIONEN USD
Diagramm CAGR
%
Diagramm Wichtige Marktteilnehmer
  • United Microelectronics Corporation
  • ASE Technology Holding Co.
  • Taiwan Semiconductor Manufacturing Company Limited
  • Intel Corporation
  • Amkor Technology

Global Interposer and Fan-Out WLP Market, By Packaging Technology (Through-silicon Vias, Interposers and Fan-Out Wafer-Level Packaging), Application (Logic, Imaging and Optoelectronics, Memory, MEMES or Sensors, LED, Power, Analog and Mixed-Signal, Photonics and Radio Frequency), End-User (Consumer Electronics, Telecommunication, Industrial Sector, Automotive, Military and Aerospace, Smart Technologies and Medical devices) – Industry Trends and Forecast to 2030.

Interposer and Fan-Out WLP Market

Interposer and Fan-Out WLP Market Analysis and Size

An interposer is known as an electrical interface whose function is to redirect a connection to a special connection. Fan-out WLP (FOWLP) is a complex version of the quality wafer-level packages and is advanced to satisfy the need for higher-level integration and a greater number of external contacts by electrical devices.

Data Bridge Market Research analyses that the global interposer and fan-out WLP market which was USD 13,400 million in 2022, would rocket up to USD 1,03,000 million by 2030, and is expected to undergo a CAGR of 22.6% during the forecast period. This indicates the market value. “Through-silicon Vias” accounts for the largest type segment in the respective market TSVs allowed for the vertical stacking of multiple silicon layers, enabling the integration of multiple components, such as microprocessors, memory, and sensors, within a single package. This helped in achieving higher levels of miniaturization and integration, which are essential in modern electronic devices. In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.

Interposer and Fan-Out WLP Market Scope and Segmentation

Report Metric

Details

Forecast Period

2023 to 2030

Base Year

2022

Historic Years

2021 (Customizable to 2015-2020)

Quantitative Units

Revenue in USD Million, Volumes in Units, Pricing in USD

Segments Covered

Packaging Technology (Through-silicon Vias, Interposers and Fan-Out Wafer-Level Packaging), Application (Logic, Imaging and Optoelectronics, Memory, MEMES or Sensors, LED, Power, Analog and Mixed-Signal, Photonics and Radio Frequency), End-User (Consumer Electronics, Telecommunication, Industrial Sector, Automotive, Military and Aerospace, Smart Technologies and Medical devices)

Countries Covered

(U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, Saudi Arabia, U.A.E., South Africa, Egypt, Israel, Rest of Middle East and Africa)

Market Players Covered

United Microelectronics Corporation (U.S.), ASE Technology Holding Co., Ltd. (U.K.), Taiwan Semiconductor Manufacturing Company Limited (Germany), Intel Corporation (U.S.), Amkor Technology (U.S.), TOSHIBA CORPORATION (Japan), Broadcom (U.S.), Texas Instruments Incorporated (U.S.), Infineon Technologies AG (U.K.), SAMSUNG (South Korea), Qualcomm Technologies, Inc. (U.S.), STMicroelectronics (U.S.), Powertech Technology Inc. (U.S.), Siliconware Precision Industries Co. (U.K.), Ltd., STATS ChipPAC Pte. Ltd. (China), UTAC (Australia), ASTI Holdings Limited (Ireland), AMETEK.Inc. (Germany), LAM RESEARCH CORPORATION (U.S.), VeriSilicon Limited (Switzerland), ALLVIA, Inc.(U.S.) and Murata Manufacturing Co., Ltd. (U.S.)

Market Opportunities

  • Adoption of digital tools, such as artificial intelligence (AI), and application program interface (API)
  • Rise in the demand for business travel accident (BTA) insurance
  • Rise in the economic growth

Market Definition

An interposer is known as an electrical interface whose function is to redirect a connection to a special connection. Fan-out WLP (FOWLP) is a complex version of the quality wafer-level packages and is advanced to satisfy the need for higher-level integration and a greater number of external contacts by electrical devices. Major factors that are expected to boost the growth of the interposer and fan-out WLP market in the forecast period are the increase in the utilization of wearable and connected devices.

Global Interposer and Fan-Out WLP Dynamics

Drivers

  • Miniaturization and Performance

As electronic devices become smaller and more powerful, there is a growing need for packaging solutions that can accommodate the miniaturization trend while maintaining or enhancing performance. Interposers and FOWLP offer solutions for integrating and connecting multiple components in a smaller footprint

  • Increased Chip Complexity

Advances in semiconductor technology have led to increasingly complex and multifunctional chips. Interposers and FOWLP provide a means to package these advanced chips and manage their interconnections efficiently.

Opportunity

  • Advanced Packaging Technologies

Invest in research and development to create innovative packaging solutions that offer improved performance, smaller form factors, and enhanced thermal management. Developing new materials and manufacturing processes can lead to competitive advantages.

Restraint/Challenge

  • High Cost

The interposer and fan-out wafer-level packaging (WLP) market, while showing remarkable growth and potential, faces several notable restraints. One primary constraint is the high cost associated with these advanced packaging technologies. Developing and implementing interposer and fan-out WLP solutions can be financially demanding, limiting their widespread adoption, particularly in cost-sensitive consumer applications.

Recent Development

  • In July 2018, Intel announced that it will purchase eASIC. Through this acquisition, Intel is aiming to expand its portfolio to include structured eASIC and therefore service a wider range of clients across the world

Global Interposer and Fan-Out WLP Scope

The business travel insurance market is segmented on the basis of on the basis of packaging technology, application, and end-user. The growth amongst these segments will help you analyze meager growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

 Packaging Technology

  • Through-silicon Vias
  • Interposers
  • Fan-Out Wafer-Level Packaging

Application

  • Logic
  • Imaging and Optoelectronics
  • Memory
  • MEMES or Sensors
  • LED
  • Power
  • Analog and Mixed-Signal
  • Photonics and Radio Frequency

End-User

  • Consumer Electronics
  • Telecommunication
  • Industrial Sector
  • Automotive
  • Military and Aerospace
  • Smart Technologies
  • Medical devices

Global Interposer and Fan-Out WLP Market Regional Analysis/Insights

The interposer and fan-out WLP market is analyzed, and market size, volume information is provided by packaging technology, application, and end-user as referenced above.  

The countries covered in the interposer and fan-out WLP market report are the U.S., Canada, and Mexico in North America, Brazil, Argentina, and the rest of South America as part of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Rest of Europe in Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC)  in the Asia-Pacific (APAC), Saudi Arabia, U.A.E., South Africa, Egypt, Israel, rest of the Middle East and Africa (MEA) as a part of the Middle East and Africa (MEA)

Asia-Pacific dominates the interposer and fan-out WLP market due to the occurrence of major semiconductor foundries. Furthermore, the proximity to major down-stream electronics manufacturing operations will further boost the growth of the interposer and fan-out WLP market in the region during the forecast period.

The country section of the report also provides individual market impacting factors and changes in regulation in the market domestically that impact the current and future trends of the market. Data points such as down-stream and up-stream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, the impact of domestic tariffs, and trade routes are considered while providing forecast analysis of the country data.

Competitive Landscape and Global Interposer and Fan-Out WLP Market Share Analysis

The global interposer and fan-out WLP market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the company’s focus related to market.

Some of the major players operating in global interposer and fan-out WLP market are:

  • United Microelectronics Corporation (U.S.)
  • ASE Technology Holding Co., Ltd. (U.K.)
  • Taiwan Semiconductor Manufacturing Company Limited (Germany)
  • Intel Corporation (U.S.)
  • Amkor Technology (U.S.)
  • TOSHIBA CORPORATION (Japan)
  • Broadcom (U.S.)
  • Texas Instruments Incorporated (U.S.)
  • Infineon Technologies AG (U.K.)
  • SAMSUNG (South Korea)
  • Qualcomm Technologies, Inc. (U.S.)
  • STMicroelectronics (U.S.)
  • Powertech Technology Inc. (U.S.)
  • Siliconware Precision Industries Co. (U.K.)
  • Ltd., STATS ChipPAC Pte. Ltd. (China)
  • UTAC (Australia)
  • ASTI Holdings Limited (Ireland)
  • AMETEK.Inc. (Germany)
  • LAM RESEARCH CORPORATION (U.S.)
  • VeriSilicon Limited (Switzerland)
  • ALLVIA, Inc. (U.S.)
  • Murata Manufacturing Co., Ltd. (U.S.)


SKU-

Erhalten Sie Online-Zugriff auf den Bericht zur weltweit ersten Market Intelligence Cloud

  • Interaktives Datenanalyse-Dashboard
  • Unternehmensanalyse-Dashboard für Chancen mit hohem Wachstumspotenzial
  • Zugriff für Research-Analysten für Anpassungen und Abfragen
  • Konkurrenzanalyse mit interaktivem Dashboard
  • Aktuelle Nachrichten, Updates und Trendanalyse
  • Nutzen Sie die Leistungsfähigkeit der Benchmark-Analyse für eine umfassende Konkurrenzverfolgung
Demo anfordern

Forschungsmethodik

Die Datenerfassung und Basisjahresanalyse werden mithilfe von Datenerfassungsmodulen mit großen Stichprobengrößen durchgeführt. Die Phase umfasst das Erhalten von Marktinformationen oder verwandten Daten aus verschiedenen Quellen und Strategien. Sie umfasst die Prüfung und Planung aller aus der Vergangenheit im Voraus erfassten Daten. Sie umfasst auch die Prüfung von Informationsinkonsistenzen, die in verschiedenen Informationsquellen auftreten. Die Marktdaten werden mithilfe von marktstatistischen und kohärenten Modellen analysiert und geschätzt. Darüber hinaus sind Marktanteilsanalyse und Schlüsseltrendanalyse die wichtigsten Erfolgsfaktoren im Marktbericht. Um mehr zu erfahren, fordern Sie bitte einen Analystenanruf an oder geben Sie Ihre Anfrage ein.

Die wichtigste Forschungsmethodik, die vom DBMR-Forschungsteam verwendet wird, ist die Datentriangulation, die Data Mining, die Analyse der Auswirkungen von Datenvariablen auf den Markt und die primäre (Branchenexperten-)Validierung umfasst. Zu den Datenmodellen gehören ein Lieferantenpositionierungsraster, eine Marktzeitlinienanalyse, ein Marktüberblick und -leitfaden, ein Firmenpositionierungsraster, eine Patentanalyse, eine Preisanalyse, eine Firmenmarktanteilsanalyse, Messstandards, eine globale versus eine regionale und Lieferantenanteilsanalyse. Um mehr über die Forschungsmethodik zu erfahren, senden Sie eine Anfrage an unsere Branchenexperten.

Anpassung möglich

Data Bridge Market Research ist ein führendes Unternehmen in der fortgeschrittenen formativen Forschung. Wir sind stolz darauf, unseren bestehenden und neuen Kunden Daten und Analysen zu bieten, die zu ihren Zielen passen. Der Bericht kann angepasst werden, um Preistrendanalysen von Zielmarken, Marktverständnis für zusätzliche Länder (fordern Sie die Länderliste an), Daten zu klinischen Studienergebnissen, Literaturübersicht, Analysen des Marktes für aufgearbeitete Produkte und Produktbasis einzuschließen. Marktanalysen von Zielkonkurrenten können von technologiebasierten Analysen bis hin zu Marktportfoliostrategien analysiert werden. Wir können so viele Wettbewerber hinzufügen, wie Sie Daten in dem von Ihnen gewünschten Format und Datenstil benötigen. Unser Analystenteam kann Ihnen auch Daten in groben Excel-Rohdateien und Pivot-Tabellen (Fact Book) bereitstellen oder Sie bei der Erstellung von Präsentationen aus den im Bericht verfügbaren Datensätzen unterstützen.

Häufig gestellte Fragen

The Interposer and Fan-Out WLP Market will be worth USD 1,03,000 million by 2030.
The Interposer and Fan-Out WLP Market growth rate is 22.6% during the forecast period.
Miniaturization and Performance & Increased Chip Complexity are the growth drivers of the Interposer and Fan-Out WLP Market.
The packaging technology, application, and end-user are the factors on which the Interposer and Fan-Out WLP Market research is based.
Intel announced that it will purchase eASIC and through this acquisition, Intel is aiming to expand its portfolio to include structured eASIC and therefore service a wider range of clients across the world is the latest development in the Interposer and Fan-Out WLP Market.