The market is segmented based on Global Ball Grid Array (BGA) Microcontroller Socket Market, By Product type (0.4mm Pitch, 0.5mm Pitch, 0.65mm Pitch and Other), End Use (Prototyping, Validation, Testing and Others), Application (Industrial, Consumer Electronics, Automotive, Medical Devices, Military and Defense and Others), Country (U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, U.A.E, Saudi Arabia, Egypt, South Africa, Israel, Rest of Middle East and Africa) Industry Trends and Forecast to 2028
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The Global Ball Grid Array Bga Microcontroller Socket Market size was valued at USD 1189.30 USD Million in 2020.
The Global Ball Grid Array Bga Microcontroller Socket Market is projected to grow at a CAGR of 4.2% during the forecast period of 2021 to 2028.
The major players operating in the market include ,Intel Corporation, 3M, Aries Electronics, Mill-Max Mfg. Corp., SamtecInc., CnC TechLLC, Sensata Technology Inc., STMicroelectronics, WELLS-CTI Inc., Loranger International Corp., Enplas Corporation, Johnstech, MolexLLC, TE Connectivity., Win Way Technology Ltd., Enplas Corporation, Intel Corporation, Hon Hai Precision Industry Co.Ltd., Plastronics, Chupond Precision Co. Ltd and Yamaichi Electronics Co. Ltd. .
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The data presented is for visualization purposes only and may not reflect actual results.
