Global Ball Grid Array Bga Microcontroller Socket Market
Market Size in USD Billion
CAGR :
% 
 Forecast Period |
2021 –2028 |
 Market Size (Base Year) |
USD 1,189.30 Million |
 Market Size (Forecast Year) |
USD 1,652.84 Million |
 CAGR |
% |
| Major Markets Players |
Global Ball Grid Array (BGA) Microcontroller Socket Market, By Product type (0.4mm Pitch, 0.5mm Pitch, 0.65mm Pitch and Other), End Use (Prototyping, Validation, Testing and Others), Application (Industrial, Consumer Electronics, Automotive, Medical Devices, Military and Defense and Others), Country (U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, U.A.E, Saudi Arabia, Egypt, South Africa, Israel, Rest of Middle East and Africa) Industry Trends and Forecast to 2028
Market Analysis and Insights: Global Ball Grid Array (BGA) Microcontroller Socket Market
Surge in the application of ball grid array (BGA) microcontroller socket by the automobile sector globally, growth and expansion of various end user verticals especially in the developing economies and rapid adoption of advanced technologies are the major factors attributable to the growth of the ball grid array (BGA) microcontroller socket market. Data Bridge Market Research analyses that the ball grid array (BGA) microcontroller socket market will exhibit a CAGR of 4.20% for the forecast period of 2021-2028. Therefore, the market value, which was USD 1,189.30 million in 2020, will rocket up to USD 1,652.84 million by 2028.
Microcontrollers are the small devices that are majorly used in electrical components. Microcontroller sockets consist of a rectangular housing and two parallel rows connecting electrical pins. With the rising advancements in the technology, the microcontroller sockets are embedded with interconnecting solutions for fine pitch, low profile applications and high I/O.
Growing demand for enhanced technologies that reduces fuel consumption will emerge as the major ball grid array (BGA) microcontroller socket market growth driving factor. Growing focus of the manufacturers on technological advancements and increasing production of automobiles will further aggravate the growth of the ball grid array (BGA) microcontroller socket market. Growing adoption of consumer electronics, rising powertrain applications, growing proliferation of smart electronic machines and growing demand for thinner, smaller, and lesser expensive device packaging are some other factors bolstering the growth of the ball grid array (BGA) microcontroller socket market.
However, lack of skilled workforce and technological expertise in underdeveloped and developing economies will act as a growth restraint for the ball grid array (BGA) microcontroller socket market. Technical and operational challenges involved in ball grid array (BGA) microcontrollers and fierce competition among the leading vendors will yet again hamper the ball grid array (BGA) microcontroller socket market growth rate.
This ball grid array (BGA) microcontroller socket market report provides details of new recent developments, trade regulations, import export analysis, production analysis, value chain optimization, market share, impact of domestic and localised market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographical expansions, technological innovations in the market. To gain more info on ball grid array (BGA) microcontroller socket market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Global Ball Grid Array (BGA) Microcontroller Socket Market Scope and Market Size
The ball grid array (BGA) microcontroller socket market is segmented on the basis of product type, end use and application. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target market.
- On the basis of product type, the ball grid array (BGA) microcontroller socket market is segmented into 0.4mm pitch, 0.5mm pitch, 0.65mm pitch and others.
- On the basis of end use, the ball grid array (BGA) microcontroller socket market is segmented into prototyping, validation, testing and others.
- On the basis of application, the ball grid array (BGA) microcontroller socket market is segmented into industrial, consumer electronics, automotive, medical devices, military and defense and others.
Ball Grid Array (BGA) Microcontroller Socket Market Country Level Analysis
The ball grid array (BGA) microcontroller socket market is analysed and market size, volume information is provided by country, product type, end use and application as referenced above.
The countries covered in the ball grid array (BGA) microcontroller socket market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, Israel, Egypt, South Africa, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.
Asia-Pacific dominates the ball grid array (BGA) microcontroller socket market and will continue to flourish its trend of dominance during the forecast period owing to the rising production of automobiles especially in the developing economies such as India and China. Asia-Pacific will continue to undergo substantial gains during the forecast period. This is because of the growth and expansion of electrical and electronics industry, presence of the large and small manufacturers and growing demand of sockets in the microelectronics industry.
The country section of the ball grid array (BGA) microcontroller socket market report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as consumption volumes, production sites and volumes, import export analysis, price trend analysis, cost of raw materials, down-stream and upstream value chain analysis are some of the major pointers used to forecast the market scenario for individual countries. Also, presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Ball Grid Array (BGA) Microcontroller Socket Market Share Analysis
The ball grid array (BGA) microcontroller socket market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to ball grid array (BGA) microcontroller socket market.
The major players covered in the ball grid array (BGA) microcontroller socket market report are Intel Corporation, 3M, Aries Electronics, Mill-Max Mfg. Corp., Samtec, Inc., CnC Tech, LLC, Sensata Technology Inc., STMicroelectronics, WELLS-CTI Inc., Loranger International Corp., Enplas Corporation, Johnstech, Molex, LLC, TE Connectivity., Win Way Technology Ltd., Enplas Corporation, Intel Corporation, Hon Hai Precision Industry Co., Ltd., Plastronics, Chupond Precision Co. Ltd and Yamaichi Electronics Co. Ltd. among other domestic and global players. Market share data is available for global, North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America separately. DBMR analysts understand competitive strengths and provide competitive analysis for each competitor separately.
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Research Methodology
Data collection and base year analysis are done using data collection modules with large sample sizes. The stage includes obtaining market information or related data through various sources and strategies. It includes examining and planning all the data acquired from the past in advance. It likewise envelops the examination of information inconsistencies seen across different information sources. The market data is analysed and estimated using market statistical and coherent models. Also, market share analysis and key trend analysis are the major success factors in the market report. To know more, please request an analyst call or drop down your inquiry.
The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market and primary (industry expert) validation. Data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Patent Analysis, Pricing Analysis, Company Market Share Analysis, Standards of Measurement, Global versus Regional and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.
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