Edge computing is a distributed computing paradigm that brings computation and data storage closer to the location where it is needed. Unlike traditional cloud computing, which relies on centralized data centers, edge computing processes data locally, at the "edge" of the network. This approach reduces latency, improves real-time data processing, and enhances overall efficiency. In data centers, edge computing is increasingly being adopted to handle the growing demand for fast, localized processing, especially in applications requiring immediate data analysis, such as IoT devices, autonomous vehicles, and smart cities.
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Data Bridge Market Research analyses that the Global Cooling System for Edge Computing Market is expected to reach USD 3.38 billion by 2031 from USD 1.44 billion in 2023, growing with a CAGR of 11.2% in the forecast period of 2024 to 2031. The rapid growth of edge computing applications within data centers is significantly driving the demand for advanced cooling systems. As edge data centers increase in numbers, the need to manage the heat generated by densely packed, high-performance computing equipment becomes crucial. Efficient cooling systems are essential to maintaining optimal operating conditions, preventing overheating, and ensuring the reliability and longevity of the equipment. This increased demand for cooling solutions in edge data centers is propelling the growth of the global cooling systems for edge computing market, as organizations invest in innovative technologies to support the expansion of edge computing infrastructure.
Key Findings of the Study
Growing Need for Efficient Thermal Management in Harsh Environments
Thermal management is a critical component in maintaining the performance and reliability of edge computing systems. As these systems are often deployed in locations with limited space and challenging environmental conditions, managing heat effectively is crucial. Overheating can lead to several detrimental effects, including system malfunctions, reduced computational efficiency, and permanent hardware damage. If the temperature within these systems is not carefully regulated, it can cause a chain reaction of failures, ultimately compromising the integrity of the entire network. Therefore, efficient thermal management is essential to ensure the longevity and optimal performance of edge computing devices.
Report Scope and Market Segmentation
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Report Metric
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Details
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Forecast Period
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2024 to 2031
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Base Year
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2023
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Historic Years
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2022 (Customizable to 2016-2021)
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Quantitative Units
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Revenue in USD Billion
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Segments Covered
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Type of Cooling System (Air-Based, Liquid-Based, and Hybrid), Cooling Capacity (Medium-Scale Cooling Systems, Small-Scale Cooling Systems, and Large-Scale Cooling Systems (Above 200KW)), Deployment Type (Room-Based Cooling Units, In-Rack Cooling Units, Outdoor Cooling Units, Direct-to Chip Liquid Cooling Units, Portable Cooling Units, and Immersion Cooling Units), Cooling Management System (Integrated Cooling Management Systems and Standalone Cooling Management Systems), Cooling Method (Chilled Water Cooling, Direct Expansion (DX Cooling), Liquid Cooling, and Others), Verticals (IT & Telecom, Manufacturing, Government & Public Sectors, Healthcare, Transportation & Logistics, Retail & Consumer Goods, and Others)
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Countries Covered
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U.S., Canada, Mexico, China, Japan, India, South Korea, Australia, New Zealand, Singapore, Malaysia, Thailand, Indonesia, Philippines, Taiwan, Vietnam, Rest of Asia-Pacific, U.K., Germany, France, Italy, Spain, Russia, Netherlands, Switzerland, Sweden, Belgium, Denmark, Poland, Norway, Turkey, Finland, Rest of Europe, Saudi Arabia, South Africa, U.A.E., Israel, Egypt, Qatar, Oman, Kuwait, Bahrain, Rest of Middle East and Africa, Brazil, Argentina, Rest of South America
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Market Players Covered
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VERTIV (U.S.), Schneider electric (France), STULZ GMBH (Germany), RITTAL (Germany), Mitsubishi Electric Corporation (Japan), Hitachi, Ltd. (Japan), Fujitsu (Japan), Eaton (U.S.), ClimateMaster, Inc., HUAWEI (China), Trane (U.S.), Coolcentric (U.S.), Siemens (Germany), LG Electronics (South Korea), Danfoss A/S (Poland), Delta electronics (Taiwan), IBM (U.S.), Johnson Controls Inc. (U.S.), 2CRSI group (France), Airedale International (U.K.), Minekels B.V. (Netherland), Coolit systems (Canada), Iceotope (U.K.), Krellian Ltd. (U.K.), Smartpod, and Green Revolution Cooling Inc. (U.S.) among others
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Data Points Covered in the Report
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In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.
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Segment Analysis
Global cooling system for edge computing market is segmented into six notable segments, which is based on type of cooling system, cooling capacity, deployment type, cooling management system, cooling method, and vertical.
- On the basis of type of cooling system, the market is segmented into air-based, liquid-based, and hybrid
In 2024, the air-based segment is expected to dominate the global cooling system for edge computing market
In 2024, the air-based segment is expected to dominate the market with the market share of 57.32% due to their cost-effective, reliable, and easily deployable solution for managing the heat generated by localized, often remote, computing infrastructure.
- On the basis of cooling capacity, the market is segmented into medium-scale cooling systems, small-scale cooling systems, and large-scale cooling systems (above 200KW).
In 2024, the medium-scale cooling systems segment is expected to dominate the global cooling system for edge computing market
In 2024, medium-scale cooling systems is expected to dominate the global cooling system for edge computing market with a market share of 52.30% due to growing need for efficient thermal management in harsh environments.
- On the basis of deployment type, the market is segmented into room-based cooling units, in-rack cooling units, outdoor cooling units, direct-to chip liquid cooling units, portable cooling units and immersion cooling units. In 2024, room-based cooling units is expected to dominate the market with a market share of 37.87%
- On the basis of cooling management, the market is segmented into integrated cooling management system and standalone cooling management system. In 2024, integrated cooling management system is expected to dominate the market with 69.72% market share
- On the basis of cooling method, the market is segmented into chilled water cooling, direct expansion (DX cooling), liquid cooling, and others. In 2024, the chilled water cooling segment is expected to dominate the market with 46.26% market share
- On the basis of vertical, the market is segmented into IT & telecom, manufacturing, government & public sectors, healthcare, transportation & logistics, retail & consumer goods and others. In 2024, the IT & telecom segment is expected to dominate the market with 35.77% market share
Major Players
Data Bridge Market Research analyzes VERTIV (U.S.), Schneider Electric (France), STULZ GMBH (Germany), RITTAL (Germany), Mitsubishi Electric Corporation (Japan) as the major players operating in the global cooling system for edge computing market.
Market Development
- In May 2024, Vertiv has introduced the SmartCabinet ID, a comprehensive, sealed rack enclosure tailored for edge computing. This all-in-one solution delivers integrated cooling, power, and environmental protection, ideal for challenging edge locations such as warehouses and factory floors. By addressing the unique cooling requirements of these environments with varying capacities, the SmartCabinet ID strengthens Vertiv's position as a leader in providing advanced cooling systems designed specifically for edge computing
- In June 2024, Schneider Electric has released a new white paper on liquid cooling for AI data centers, offering insights on choosing the best cooling architectures to improve energy efficiency, server performance, and sustainability. This strengthens Schneider Electric's position as a leader in advanced cooling solutions, enhancing its ability to support edge computing and AI data centers with effective and sustainable technologies
- In February 2024, STULZ GmbH partnered with Asperitas to develop a modular data center solution featuring immersion cooling. STULZ Modular handled the infrastructure and cooling system, while Asperitas contributed immersion cooling technology. The resulting compact data center supports up to 200 kW IT loads and offers efficient cooling for high-demand applications. Benefits include high reliability, rapid scalability, and global support. The solution is available for order in EMEA and will be showcased at the Kickstart Europe Conference
- In February 2024, Stulz GmbH partnered with Asperitas to enhance immersion cooling for high-density data centers. Stulz Modular developed a modular data center solution with integrated immersion cooling, while Asperitas provided expertise in the cooling technology. The collaboration resulted in a compact, scalable data center designed for up to 200kW IT loads, benefiting from efficient cooling for power-intensive applications. The new solution supports efficient local data processing and AI applications
- In March 2024, Rittal has increased its production capacity with the launch of a new Integration Centre in Bangalore, India, focused on Cooling Units and Liquid Cooling Package (LCP) solutions. This expansion boosts Rittal's ability to address rising demand for Cooling Systems, especially for Edge Computing, by enhancing production capabilities and providing advanced, energy-efficient solutions in India and other emerging markets
Regional Analysis
Geographically, the countries covered in the global cooling system for edge computing market report are U.S., Canada, Mexico, China, Japan, India, South Korea, Australia, New Zealand, Singapore, Malaysia, Thailand, Indonesia, Philippines, Taiwan, Vietnam, rest of Asia-Pacific, U.K., Germany, France, Italy, Spain, Russia, Netherlands, Switzerland, Sweden, Belgium, Denmark, Poland, Norway, Turkey, Finland, rest of Europe, Saudi Arabia, South Africa, U.A.E., Israel, Egypt, Qatar, Oman, Kuwait, Bahrain, rest of Middle East and Africa, Brazil, Argentina, rest of South America.
As per Data Bridge Market Research analysis:
North America is expected to be the dominant and fastest growing region in the global cooling system for edge computing market
North America is expected to dominate the cooling system for edge computing market due to its advanced technology infrastructure, high adoption of edge computing across industries, and significant investments in data centers. The region's emphasis on energy efficiency and innovation also drives demand for integrated cooling solutions to support growing edge deployments. Research and development, alongside the presence of key market players.
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