Frequently Asked Questions
The market is segmented based on , By Packaging Technology (BGA, QFN, LTCC), Sales Channel (Direct Sales, Distributor), End-User (Pureplay foundries, IDMs) - Industry Trends and Forecast to 2030.
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The Global Wafer Dicing Saws Market size was valued at USD 97.30 USD Billion in 2022.
The Global Wafer Dicing Saws Market is projected to grow at a CAGR of 6.85% during the forecast period of 2023 to 2030.
The major players operating in the market include GTI Technologies , Dynatex International, ADTAdvanced Dicing Technologies, Disco Corporation, Micross, TOKYO SEIMITSU CO. , Loadpoint, Komatsu NTC, Zhengzhou CY Scientific Instrument Co. , Indotech Industries Pvt. , Multicut Machine Tools, ITL Industries Limited, Cosen Saws, TecSaw International Limited, Marshall Machinery, Vishwacon Engineers Private Limited, Mega Machine Co. , ProMech Engineering, Prosaw Limited, Perfect Laser.
The market report covers data from the U.S., Canada, Mexico, U.K., Germany, France, Spain, Italy, Netherlands, Switzerland, Russia, Belgium, Turkey, Rest of Europe, China, South Korea, Japan, India, Australia, Singapore, Malaysia, Indonesia, Thailand, Philippines, Rest of Asia-Pacific, South Africa, Saudi Arabia, U.A.E., Israel, Egypt and Rest of Middle East and Africa, Brazil, Argentina, Rest of South America.
