Frequently Asked Questions
The market is segmented based on , By Product (Testing and Measuring Equipment, Process Control Equipment, Industrial Controls, Power Electronics, Industrial Automation Equipment, Others), Material (Plastic, Paper and Paperboard), Packaging Type (Rigid, Flexible), Application (Semiconductor and Integrated Circuit, Printed Circuit Board, Others), End User (Consumer Electronics, Aerospace and Defence, Automotive, Telecommunication, Others) – Industry Trends and Forecast to 2029
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The Global Industrial Electronics Packaging Market size was valued at USD 1.82 USD Billion in 2021.
The Global Industrial Electronics Packaging Market is projected to grow at a CAGR of 4.13% during the forecast period of 2022 to 2029.
The major players operating in the market include DS Smith, Mondi, International Paper, Sonoco Products Company, Sealed Air, Huhtamaki, Smurfit Kappa, WestRock Company, UFP Technologies , Stora Enso, Pregis LLC, Shenzhen Hoichow Packing Manufacturing , Dordan Manufacturing Company, Hangzhou Xunda Packaging Co., Dunapack Packaging Group, Universal Protective Packaging , Parksons Packaging , Neenah Paper and Packaging, Plastic Ingenuity, JJX Packaging.
The market report covers data from the U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia and New Zealand, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, United Arab Emirate, Saudi Arabia, Egypt, Israel, South Africa, Rest of Middle East and Africa.
