Global Through Hole Mounting Electronics Packaging Market – Industry Trends and Forecast to 2031

Through Hole Mounting Electronics Packaging Market Analysis and Size

In the aerospace and defense sectors, through-hole mounting electronics packaging plays a crucial role due to its ability to provide robust and reliable connections in critical systems. Components such as resistors, capacitors, and connectors are securely soldered through holes in PCBs, ensuring resilience against vibrations, shocks, and extreme temperatures typically encountered in aerospace and defense environments. Through-hole mounting allows for easier repair and maintenance of electronic systems, contributing to overall mission success and safety in demanding operational conditions.

The global through hole mounting electronics packaging market size was valued at USD 34.28 billion in 2023 and is projected to reach USD 113.95 billion by 2031, with a CAGR of 16.20% during the forecast period of 2024 to 2031. In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.

Report Scope and Market Segmentation       

Market Definition

Through-hole mounting in electronics packaging involves inserting component leads through holes in the PCB and soldering them to pads on the opposite side. This method ensures secure mechanical and electrical connections, suitable for components needing robust support and heat dissipation, such as connectors and larger components. It contrasts with surface-mount technology (SMT), which places components directly on the PCB surface, allowing for denser packing and automated assembly processes.

Through Hole Mounting Electronics Packaging Market Dynamics

Drivers

• Rising Demands in Electronics

As electronic devices become more powerful and compact, there is a continued need for robust and reliable connections that through-hole mounting offers. Industries such as automotive, aerospace, and telecommunications rely on through-hole mounting for components that require high durability and mechanical strength, ensuring stable performance in demanding environments. Moreover, the compatibility of through-hole mounting with existing designs and the ability to handle higher power densities further fuel its adoption. These factors collectively drive growth in the market as electronics continue to permeate various sectors with increasingly stringent performance requirements.

• Increasing Specific Component Requirements

Certain components, such as high-power resistors, connectors, and larger semiconductor packages, often require robust mechanical support and efficient heat dissipation, which through-hole mounting provides. These components may handle significant current loads or require reliable connections in harsh environments, such as aerospace, automotive, and industrial applications. Through-hole mounting ensures secure attachment to PCBs, minimizing the risk of mechanical stress or failure during operation. Additionally, for legacy systems and designs where through-hole components are already established, compatibility and reliability further drive their continued use, especially in sectors where reliability and durability are paramount.

Opportunities

• Growing Component Suitability

Components such as large connectors, high-power resistors, and capacitors with higher voltage ratings often require through-hole mounting for secure mechanical support and robust electrical connections. Unlike surface-mount technology (SMT), which may not provide adequate support for larger or heavier components, through-hole mounting ensures that these components remain securely anchored to the PCB. This method is crucial in industries like aerospace, defense, and automotive, where reliability and durability are paramount. Moreover, through-hole mounting facilitates easier inspection, maintenance, and repair processes, contributing to overall operational efficiency and longevity of electronic systems in demanding applications.

• Rising Demand for Repairability

Unlike surface-mount technology (SMT), through-hole components are easier to replace and repair, reducing downtime and repair costs in critical industries such as aerospace, defense, and automotive. Technicians can desolder and replace through-hole components more readily, even under challenging conditions, ensuring quicker turnaround times for repairs and upgrades. This capability is crucial in industries where reliability and uptime are paramount, as it enhances the overall lifecycle management of electronic systems, supports legacy equipment maintenance, and facilitates technology upgrades without requiring full board replacements.

Restraints/Challenges

• Automated Assembly Challenges

Unlike surface-mount technology (SMT), through hole components require additional steps such as manual insertion and wave soldering, which are less conducive to fully automated production lines. This manual handling increases production time and labor costs, limiting the scalability and cost-effectiveness of through-hole mounting in high-volume manufacturing environments. Moreover, the size and mechanical nature of through-hole components makes them less compatible with modern pick-and-place robotic systems used in SMT, further complicating integration into automated assembly lines. These factors contribute to a preference for SMT in industries seeking faster production cycles, reduced assembly costs, and enhanced manufacturing flexibility.

• High Manufacturing Costs

This method involves additional manufacturing steps, such as drilling holes in PCBs and wave soldering components, which are more labor-intensive and time-consuming compared to surface-mount technology (SMT). These processes require specialized equipment and skilled labor, contributing to higher production costs. Moreover, the larger size of through-hole components limits PCB design flexibility and reduces the potential for compact, lightweight electronic devices, which are increasingly demanded in modern applications. As a result, industries seeking cost-effective manufacturing solutions often prefer SMT, which offers faster assembly times, higher automation capabilities, and lower material and labor costs overall.

This market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the market, contact Data Bridge Market Research for an analyst brief; our team will help you take an informed market decision to achieve market growth.

Impact and Current Market Scenario of Raw Material Shortage and Shipping Delays

Data Bridge Market Research offers a high-level analysis of the market and delivers information by keeping in account the impact and current market environment of raw material shortage and shipping delays. This translates into assessing strategic possibilities, creating effective action plans, and assisting businesses in making important decisions.

Apart from the standard report, we also offer in-depth analysis of the procurement level from forecasted shipping delays, distributor mapping by region, commodity analysis, production analysis, price mapping trends, sourcing, category performance analysis, supply chain risk management solutions, advanced benchmarking, and other services for procurement and strategic support.

Expected Impact of Economic Slowdown on the Pricing and Availability of Products

When economic activity slows, industries begin to suffer. The forecasted effects of the economic downturn on the pricing and accessibility of the products are taken into account in the market insight reports and intelligence services provided by DBMR. With this, our clients can typically keep one step ahead of their competitors, project their sales and revenue, and estimate their profit and loss expenditures.

Through Hole Mounting Electronics Packaging Market Scope

The market is segmented on the basis of material and end-user. The growth amongst these segments will help you analyze meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

Material

• Plastic
• Metal
• Glass
• Others

End-User

• Consumer Electronics
• Aerospace and Defense
• Automotive
• Telecommunication
• Others

Through Hole Mounting Electronics Packaging Market Analysis/Insights

The market is analyzed and market size insights and trends are provided by material and end-user as referenced above.

The countries covered in the market report are U.S., Canada, Mexico, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America.

Asia-Pacific leads the through hole mounting electronics packaging market due to several key factors. The region hosts a significant number of manufacturing companies specializing in electronics, driving demand for through-hole mounting packaging solutions. Additionally, rising disposable incomes across Asia-Pacific's growing population enhance consumer spending on electronics goods, further stimulating market growth. These factors create a robust environment for through-hole mounting electronics packaging, supported by a thriving manufacturing sector and increasing consumer demand for electronic products in the region.

Europe is expected for substantial growth in the market due to the expansion of the automobile sector, coupled with increasing consumer demand for electronics, particularly in sectors such as automotive electronics and consumer gadgets, which will stimulate economic activity. Additionally, Europe's focus on enhancing semiconductor production capacity is crucial, aligning with global trends toward digitalization and technological advancement. These factors collectively contribute to fostering a favorable business environment, attracting investments, and driving growth across these industries in the region.

The country section of the report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.

Competitive Landscape and Through Hole Mounting Electronics Packaging Market Share Analysis

The market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to market.

Some of the major players operating in the market are

• AMETEK.Inc. (U.S.)
• Dordan Manufacturing Company, Incorporated (U.S.)
• DuPont (U.S.)
• The Plastiform Company (U.S.)
• Kiva Container (U.S.)
• Primex Plastics Corporation. (Canada)
• Quality Foam Packaging, Inc. (U.S.)
• Ameson Packaging (U.S.)
• Lithoflex, Inc. (U.S.)
• UFP Technologies, Inc. (U.S.)
• Intel Corporation (U.S.)
• STMicroelectronics (Switzerland)
• Advanced Micro Devices, Inc (U.S.)
• SAMSUNG (South Korea)
• ams-OSRAM AG (Austria)
• GY Packaging (South Carolina)
• Taiwan Semiconductor (Taiwan)

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