Global System in Package (SIP) Market, By Packaging Technology (2D IC Packaging Technology, 2.5D IC Packaging Technology, 3D IC Packaging Technology), Package Type (Ball Grid Array (BGA), Surface Mount Package, Pin Grid Array (PGA), Flat Package (FP), Small Outline Package), Packaging Method (Wire Bond and Die Attach, Flip Chip, Fan-Out Wafer Level Packaging (FOWLP)), Device (Power Management Integrated Circuit (PMIC), Microelectromechanical Systems (MEMS), RF Front-End, RF Power Amplifier, Baseband Processor, Application Processor, Others), Application (Consumer Electronics, Industrial, Automotive and Transportation, Aerospace and Defence, Healthcare, Emerging, Others) – Industry Trends and Forecast to 2030.
System In Package (SIP) Market Analysis and Size
System in Package (SiP) is a technique for integrating several passive parts and integrated circuits (ICs) into a single package so that they can all function as a single unit. In contrast, a System on Chip (SoC) has all of its components integrated onto a single die. A System in Package is comparable to a System-on-a-Chip but is constructed using many semiconductor dies and is less securely integrated. A typical SiP system might employ a variety of packaging techniques, including flip chips, wire bonding, wafer-level packaging, etc.
Data Bridge Market Research analyses that the global system in package (SIP) market which was USD 25.83 billion in 2022, is expected to reach USD 54.75 billion by 2030, and is expected to undergo a CAGR of 9.85% during the forecast period 2023-2030. “2.5D IC Packaging Technology” is dominating the market owing to its ultra-high routing density, Ultra high I/O density & I/O pitch scalability. In addition to the market insights such as market value, growth rate, market segments, geographical coverage, market players, and market scenario, the market report curated by the Data Bridge Market Research team includes in-depth expert analysis, import/export analysis, pricing analysis, production consumption analysis, and pestle analysis.
System in Package (SIP) Market Scope and Segmentation
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Report Metric
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Details
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Forecast Period
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2023 to 2030
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Base Year
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2022
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Historic Years
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2021 (Customisable to 2015-2020)
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Quantitative Units
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Revenue in USD Billion, Pricing in USD
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Segments Covered
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Packaging Technology (2D IC Packaging Technology, 2.5D IC Packaging Technology, 3D IC Packaging Technology), Package Type (Ball Grid Array (BGA), Surface Mount Package, Pin Grid Array (PGA), Flat Package (FP), Small Outline Package), Packaging Method (Wire Bond and Die Attach, Flip Chip, Fan-Out Wafer Level Packaging (FOWLP)), Device (Power Management Integrated Circuit (PMIC), Microelectromechanical Systems (MEMS), RF Front-End, RF Power Amplifier, Baseband Processor, Application Processor, Others), Application (Consumer Electronics, Industrial, Automotive and Transportation, Aerospace and Defence, Healthcare, Emerging, Others)
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Countries Covered
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U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America
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Market Players Covered
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SAMSUNG (South Korea), Amkor Technology (U.S.), ASE Group (Taiwan), ChipMOS TECHNOLOGIES INC. (Taiwan), JCET Group Co., Ltd. (China), Texas Instruments Incorporated. (U.S.), Unisem (Malaysia), UTAC (Singapore), Renesas Electronics Corporation (Japan), Intel Corporation (U.S.), FUJITSU (Japan), TOSHIBA ELECTRONICS EUROPE GMBH (Germany), Amkor Technology (U.S.), SPIL (Taiwan), Powertech Technology (Taiwan)
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Market Opportunities
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Market Definition
System in package (SIP) is a packaging method that allows numerous die to be included in a single module. It's a combination of multiple integrated circuits in a small package, lowering the cost of developing and assembling a printed circuit board even more (PCB). SIP dies can be stacked vertically or tiled horizontally with typical off-chip wire bonds or solder bumps. Because of its increased efficiency and durability, SIP is widely used in various industries, including consumer electronics, automotive, and telecommunications.
Global System in Package (SIP) Market Dynamics
Driver
- Rise in the Demand for Miniaturization of Electronic Devices
The market is predicted to develop due to an increase in the demand for miniaturization of electronic devices. The demand for reliable and small electronic equipment has grown as a result of rapid R&D and technical advancements. As a result, the need for smaller electrical devices is increasing.
Furthermore, increasing disposable income and growing popularity of the internet of things (IoT) will drive market value growth. Other significant factors influencing the market's growth rate include the increase in the adoption of SiP technology in graphic cards and real-world gaming processors.
Opportunity
- Rise in the Use of RF Components in Developing Advanced 5G Infrastructure
Rise in the use of RF components in developing advanced 5G infrastructure will enhance the market growth. Wireless networks might suffer considerable congestion in the next five years due to the availability of equipment that supports high bandwidth. This would accelerate the transition to 5G from present 3G and 4G LTE technology. The aggregate data rates supported by 5G technology are predicted to be much quicker than the currently available 3G and 4G data rates.
Moreover, rise in strategic collaborations and emerging new markets will act as market drivers and further boost beneficial opportunities for the market's growth rate. The surging technological advancement will boost new market opportunities for the market's growth rate.
Restraint/ Challenge
- Supply Chain Management for the SIP Market
On the other hand, supply chain management for the SIP market using a "one size fits all" approach is expected to bring significant hurdles to the global market for system-in-package (SIP) die technology. The market demand is set in stone and is constrained by well-defined supply constraints.
This global system in package (SIP) market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the global system in package (SIP) market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Recent Development
- In March 2023, Octavo Systems announced new product family of system in chip (SiP) named as OSD62x that helps to expand the performance of edge and small form factor embedded processing into next generation applications. The OSD62x family is based on the Texas Instruments (TI) AM623 and AM625 processors. Delivering the smallest AM62x module form factor, the OSD62x SiP family integrates high-speed memory, power management, passive components, and much more into a single BGA package.
Global System in Package (SIP) Market Scope
The global system in package (SIP) market is segmented on the basis of packaging technology, package type, packaging method, application and device. The growth amongst these segments will help you analyze meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.
Packaging Technology
- 2D IC Packaging Technology
- 2.5D IC Packaging Technology
- 3D IC Packaging Technology
Package Type
- Ball Grid Array (BGA)
- Surface Mount Package
- Pin Grid Array (PGA)
- Flat Package (FP)
- Small Outline Package
Packaging Method
- Wire Bond and Die Attach
- Flip Chip
- Fan-Out Wafer Level Packaging (FOWLP)
Application
- Consumer Electronics
- Industrial
- Automotive and Transportation
- Aerospace and Defence
- Healthcare
- Emerging
- Others
Device
- Power Management Integrated Circuit (PMIC)
- Microelectromechanical Systems (MEMS)
- RF Front-End
- RF Power Amplifier
- Baseband Processor
- Application Processor
- Others
Global System in Package (SIP) Market Regional Analysis/Insights
The global system in package (SIP) market is analysed and market size insights and trends are provided by country, packaging technology, package type, packaging method, application and device as referenced above.
The countries covered in the global system in package (SIP) market report are U.S., Canada, Mexico, Germany, France, U.K., Italy, Spain, Switzerland, Netherlands, Russia, Turkey, Belgium, Rest of Europe, Japan, China, South Korea, India, Australia & New Zealand, Singapore, Thailand, Malaysia, Indonesia, Philippines, Rest of Asia-Pacific, South Africa, Israel, U.A.E., Saudi Arabia, Egypt, Rest of Middle East and Africa, Brazil, Argentina and Rest of South America.
Asia-Pacific dominates the global system in package (SIP) market in terms of market share and market revenue and will continue to flourish its dominance with highest CAGR during the forecast period. This is due to the rising technology applications from the consumer electronics sector and the growing prevalence of various companies in this region.
The country section of the report also provides individual market-impacting factors and changes in regulation in the market domestically that impact the current and future trends of the market. Data points like downstream and upstream value chain analysis, technical trends, and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of Global brands and the challenges faced due to large or scarce competition from local and domestic brands, the impact of domestic tariffs, and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Global System in Package (SIP) Market Share Analysis
The global system in package (SIP) market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to global system in package (SIP) market.
Some of the major players operating in the global system in package (SIP) market are:
- SAMSUNG (South Korea)
- Amkor Technology (U.S.)
- ASE Group (Taiwan)
- ChipMOS TECHNOLOGIES INC. (Taiwan)
- JCET Group Co., Ltd. (China)
- Texas Instruments Incorporated. (U.S.)
- Unisem (Malaysia)
- UTAC (Singapore)
- Renesas Electronics Corporation (Japan)
- Intel Corporation (U.S.)
- FUJITSU (Japan)
- TOSHIBA ELECTRONICS EUROPE GMBH (Germany)
- Amkor Technology (U.S.)
- SPIL (Taiwan)
- Powertech Technology (Taiwan)
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