Global Molded Interconnect Device Market - Industry Trends and Forecast to 2029

Market Analysis and Insights Global Molded Interconnect Device Market

Data Bridge Market Research analyses the molded interconnect device market will exhibit a CAGR of 13.7% for the forecast period of 2022-2029 and is likely to reach the USD 3.50 billion by 2029.

Injection-molded thermoplastic parts with integrated electrical circuits are known as molded interconnect devices (MID). These three-dimensional electromechanical components are molded with circuits utilizing high-temperature thermoplastics and structured metallization, giving the electronics industry a fresh perspective on carrier circuit design. These molded components are used in the consumer electronics industry to replace the stub on the internal antenna of cellphones. The use of an inside antenna as part of the phone's interior fittings saves volume by maximizing space efficiency.

The upsurge in the demand for miniaturization in consumer electronics industry will act as a key element driving market expansion. The molded interconnect device market is also being driven by factor such as growing use of molded interconnect devices (MID) in medical devices. In addition to this, the molded interconnect devices are simple to operate, install, and configure. Growing requirement to decrease e-waste and technological development are the factors that will expand the molded interconnect device market. Furthermore, favourable regulatory scenario for the electronic waste reduction and growing demand for equipment from various end-use industries such as automotive and semiconductors will act as major factors influencing the growth of molded interconnect device market.  Another significant factor that will cushion the molded interconnect device market’s growth rate is the proliferation of wearable devices.

Moreover, growing adoption of IoT devices will create beneficial opportunities for the growth of the market. Additionally, the development in technologies, increasing demand for smartphones and untapped potential in molded interconnect devices market will act as market driver and further boost new opportunities in the forecast period mentioned above.

However, the high tooling cost and incompatibility with electronic packages will hamper the market’s growth rate. Also, fluctuating prices of raw materials will further pose a challenge to the market. Other factors such as impact of COVID-19 on supply chain and the technological monopoly of Lds equipment manufacturer will obstruct the market’s growth.

This molded interconnect device market report provides details of new recent developments, trade regulations, import export analysis, production analysis, value chain optimization, market share, impact of domestic and localised market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographical expansions, technological innovations in the market. To gain more info on molded interconnect device market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.

Global Molded Interconnect Device Market Scope and Market Size

The molded interconnect device market is segmented on the basis of process, product type and end user. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target market.

• On the basis of process, the molded interconnect device market has been segmented as laser direct structuring (LDS), 2-shot molding and film techniques.
• Based on product type, the molded interconnect device market has been segmented into antenna and connectivity modules, connectors and switches, sensors, lighting and others.
• Molded interconnect device market has also been segmented on the basis of end user into automotive, consumer products, healthcare, industrial, military and aerospace and telecommunication and computing.

Molded Interconnect Device Market Country Level Analysis

The molded interconnect device market is analysed and market size, volume information is provided by country, process, product type and end user as referenced above.

The countries covered in the molded interconnect device market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, Israel, Egypt, South Africa, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.

North America dominates the molded interconnect device market during the forecast period of 2022-2029 and will continue to flourish its trend of dominance during the forecast period due to the surging adoption of smart devices by consumers and presence of technological giants such as Apple, Google and Microsoft in this region. Asia-Pacific is expected to grow during the forecast period of 2022-2029 due to the growing utilization of consumer electronics, easy procurement of raw materials and availability of cheap labour in this region.

The country section of the molded interconnect device market report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as consumption volumes, production sites and volumes, import export analysis, price trend analysis, cost of raw materials, down-stream and upstream value chain analysis are some of the major pointers used to forecast the market scenario for individual countries. Also, presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.

Competitive Landscape and Global Molded Interconnect Device Market Share Analysis

The molded interconnect device market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to molded interconnect device market.

Some of the major players operating in the molded interconnect device market are GALTRONICS, HARTING Technology Group, MacDermid, Inc., LPKF Laser & Electronics AG, Cicor Management AG, YOMURA, RTP Company, S2P smart plastic product, SelectConnect Technologies, Suzhou Cicor Technology Co. Ltd, TE Connectivity, Teprosa GmbH, Tongda Group, BASF SE, EMS-CHEMIE HOLDING AG, DSM, Ensinger, Evonik Industries AG, LANXESS, MITSUBISHI GAS CHEMICAL COMPANY, INC., PTS (TQM) Ltd., and ZEON CORPORATION, among others.

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