Global Industrial Electronics Packaging Market – Industry Trends and Forecast to 2029

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Global Industrial Electronics Packaging Market – Industry Trends and Forecast to 2029

  • Materials & Packaging
  • Upcoming Report
  • Jul 2022
  • Global
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

Global Industrial Electronics Packaging Market

Market Size in USD Billion

CAGR :  % Diagram

Diagram Forecast Period
2022 –2029
Diagram Market Size (Base Year)
USD 1.82 Billion
Diagram Market Size (Forecast Year)
USD 2.52 Billion
Diagram CAGR
%
Diagram Major Markets Players
  • DS Smith
  • Mondi
  • International Paper
  • Sonoco Products Company
  • Sealed Air

Global Industrial Electronics Packaging Market, By Product (Testing and Measuring Equipment, Process Control Equipment, Industrial Controls, Power Electronics, Industrial Automation Equipment, Others), Material (Plastic, Paper and Paperboard), Packaging Type (Rigid, Flexible), Application (Semiconductor and Integrated Circuit, Printed Circuit Board, Others), End User (Consumer Electronics, Aerospace and Defence, Automotive, Telecommunication, Others) – Industry Trends and Forecast to 2029

Industrial Electronics Packaging Market

Market Analysis and Size

The technology relates to establishing electrical interconnections and appropriate housing for electrical circuitry. The industrial electronic packages provide four major functions: distribution of electrical energy (that is, power) for circuit function, interconnection of electrical signals, mechanical protection of circuits, and dissipation of heat generated by circuit function. Industrial electronics packaging is widely used to prevent the product from radio frequency noise emission, cooling, mechanical damage, electrostatic discharge and physical damage.

Data Bridge Market Research analyses that the industrial electronics packaging market was valued at USD 1.82 billion in 2021 and is expected to reach USD 2.52 billion by 2029, registering a CAGR of 4.13 % during the forecast period of 2022 to 2029. In addition to the market insights such as market value, growth rate, market segments, geographical coverage, market players, and market scenario, the market report curated by the Data Bridge Market Research team includes in-depth expert analysis, import/export analysis, pricing analysis, production consumption analysis, patent analysis and technological advancements.     

Report Scope and Market Segmentation

Report Metric

Details

Forecast Period

2022 to 2029

Base Year

2021

Historic Years

2020 (Customizable to 2014 - 2019)

Quantitative Units

Revenue in USD Billion, Volumes in Units, Pricing in USD

Segments Covered

Product (Testing and Measuring Equipment, Process Control Equipment, Industrial Controls, Power Electronics, Industrial Automation Equipment, Others), Material (Plastic, Paper and Paperboard), Packaging Type (Rigid, Flexible), Application (Semiconductor and Integrated Circuit, Printed Circuit Board, Others), End User (Consumer Electronics, Aerospace and Defence, Automotive, Telecommunication, Others)

Countries Covered

U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia and New Zealand, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, United Arab Emirate, Saudi Arabia, Egypt, Israel, South Africa, Rest of Middle East and Africa

Market Players Covered

DS Smith (U.K.), Mondi (U.K.), International Paper (U.S.), Sonoco Products Company(U.S.), Sealed Air (U.S.), Huhtamaki (Finland), Smurfit Kappa (Ireland), WestRock Company (U.S.), UFP Technologies Inc. (U.S.), Stora Enso (Finland), Pregis LLC (U.S.), Shenzhen Hoichow Packing Manufacturing Ltd. (China), Dordan Manufacturing Company (U.S.), Hangzhou Xunda Packaging Co. (China), Dunapack Packaging Group (Austria), Universal Protective Packaging Inc. (U.S.), Parksons Packaging Ltd. (India), Neenah Paper and Packaging (U.S.), Plastic Ingenuity (U.S.), JJX Packaging (U.S.)

Market Opportunities

  • Technological advancement
  • Photonics development
  • Rise in strategic collaborations

Market Definition

Industrial electronic packaging refers to the production and design of enclosures for electronic devices ranging from specific semiconductor devices to complete systems such as a mainframe computer. An electronic system's packaging must consider radio frequency noise emission, mechanical damage, cooling, and electrostatic discharge. Industrial electronic equipment made in small quantities may use standardized commercially available enclosures such as prefabricated boxes or card cages.

Industrial Electronics Packaging Market Dynamics

Drivers

  • Rise the demand of paper and paperboard packaging

Paper and paperboard is a material which is extensively used for the packaging of computer and mobile phones. Computers and Mobile phones are electronic products that are breakable in nature, so they require packaging that offers complete safety for the product. Paper and paperboard offer both strength and rigidity for the product. Other features of paper and paperboard such as soft superb printability, and polished finish make it more popular among electronics appliances companies.

  • Growing digitalization

The increasing digitization is growing the demand for Internet of Things (IOT) in the market, which is driving the global need for effective packaging and industrial electronics product. The global industrial electronic market needs for electronics packaging which are increased by the rising adoption of smart computing devices such as smart computing, tablets, laptops mobile phones e-readers and smartphones in several developed and underdeveloped economies which are anticipated to increase the growth of the industrial  electronics packaging market.

  • Demand of sustainable packaging

Many e-commerce industries are aiming to use the sustainable packaging solutions such as paper based packaging to decrease the use of the plastic wastes and moving towards the use of paper-based packaging for the packaging of electronic products. This trend is also projected to hit the industrial  electronics packaging market, which is sensitive to exterior impacts with better designing to make packaging more stronger.

Opportunities

  • Technological advancement

Technology development is embedded into packages, making a convincing business case for industrial electronics products with the potential to increase profits and reduce costs. Technological advancement in electronics packaging are forcing to electronic packaging industries because the electronics packaging design is evolving at a speedy rate. As technology increases, the demands of the electronic packaging also goes up and changes accordingly, creating beneficial opportunity for the revenue growth of thw market.

  • Photonics development

Photonics development is automatically integrated with the multiple levels of media interconnections which has connected to custom electronic packaging. This is the major factor which is pushing electronic product major companies to alter and adapt electronic packaging’s functions with packaging designs.

Restraints/ Challenges

However, the industrial sector is anticipated to witness large manufacturing disruptions. This disruptions in the manufacturing sector are anticipated to lead the brand reputation and losses in the market share of the manufactured electronics products. A shift in dynamics in the economics of production, customized demand of products and value chain can lead to disruptions in manufacturing which will act as a market restraint that will obstruct the market's growth rate

Moreover, lack of skilled professionals with high cost of technology and equipment will likely obstruct the growth of the industrial electronics packaging market during the forecast period. Also, the Harmful effects of plastic will become the major challenge for the market's growth.

This industrial electronics packaging market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the industrial electronics packaging market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.

COVID-19 Impact on Industrial Electronics Packaging Market

The outbreak of Covid-19 pandemic had an adverse impact on the sales of packaging industries globally, along with industrial electronics packaging. The computer, mobile phones and other electronic sector drive the demand for the industrial electronics packaging. Even during this epidemic, the product production in these industries did not considerably affect the market. This is slightly affected due to a disruptions in supply chains, close in production and a scarcity of raw materials.

Moreover, strict lockdowns and shutdowns overall affected the initial demands for the electronic devices. Also, the Schools started to operate in online mode and Offices started working from home so, these factors are significantly increased the demand for electronics devices which giving stimulus to the industrial electronic packaging solutions. On a broader level, during the peak of Covid-19 pandemic the sales and demand of industrial electronics packaging increases considerably.

Recent Development

  • In May 2020, KLA Corporation has declared its new business group which will be totally focused on its packaging, electronics and components (EPC) businesses. With the development of technologies such as machine learning, IoT, and others, this new business aims to cater to the changing landscape of the electronics industry.
  • In October 2020, Smurfit Kappa Group of company has announced that it had accomplished the acquisition of Verzuolo for a cost of € 360 Mn. in Northern Italy, This new acquisition adds a 600,000-tonne containerboard mill group’s assets, and is anticipated to contribute to the sustainability aims of the company.

Global Industrial Electronics Packaging Market Scope

The industrial electronics packaging market is segmented on the basis of products, material, packaging type, application and end-user. The growth amongst these segments will help you analyze meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

Product

  • Testing and Measuring Equipment
  • Process Control Equipment
  • Industrial Controls
  • Power Electronics
  • Industrial Automation Equipment
  • Others

Material

  • Plastic
  • Paper and Paperboard

Packaging Type

  • Rigid
  • Flexible

 Application

  • Semiconductor and Integrated Circuit
  • Printed Circuit Board
  • Others

End User

  • Consumer Electronics
  • Aerospace and Defence
  • Automotive
  • Telecommunication
  • Others

Industrial Electronics Packaging Market Regional Analysis/Insights

The industrial electronics packaging market is analysed and market size insights and trends are provided by country, products, material, packaging type, application and end-user as referenced above.

The countries covered in the industrial electronics packaging market report are U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia and New Zealand, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, United Arab Emirate, Saudi Arabia, Egypt, Israel, South Africa, Rest of Middle East and Africa.

North America dominates the industrial electronics packaging market in terms of market share during the forecast period. This is due to the growing demand for industrial electronics packaging in this region. North America region leads the industrial electronics packaging market, with U.S leading the way in terms of growing production of the electronics product along with increasing demand of cost efficient, durable and impact resistant.

During the estimated period, Asia-Pacific is expected to be the fastest developing region due to the growth of the electronics industry in this region.

The country section of the report also provides individual market impacting factors and changes in market regulation that impact the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.   

Competitive Landscape and Industrial Electronics Packaging Market Share Analysis

The industrial electronics packaging market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to industrial electronics packaging market.

Some of the major players operating in the industrial electronics packaging market are:

  • DS Smith (U.K.)
  • Mondi (U.K.)
  • International Paper (U.S.)
  • Sonoco Products Company (U.S.)
  • Sealed Air (U.S.)
  • Huhtamaki (Finland)
  • Smurfit Kappa (Ireland)
  • WestRock Company (U.S.)
  • UFP Technologies Inc. (U.S.)
  • Stora Enso (Finland)
  • Pregis LLC (U.S.)
  • Shenzhen Hoichow Packing Manufacturing Ltd. (China)
  • Dordan Manufacturing Company (U.S.)
  • Hangzhou Xunda Packaging Co. (China)
  • Dunapack Packaging Group (Austria)
  • Universal Protective Packaging Inc. (U.S.)
  • Parksons Packaging Ltd. (India)
  • Neenah Paper and Packaging (U.S.)
  • Plastic Ingenuity (U.S.)
  • JJX Packaging (U.S.)


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Research Methodology

Data collection and base year analysis are done using data collection modules with large sample sizes. The stage includes obtaining market information or related data through various sources and strategies. It includes examining and planning all the data acquired from the past in advance. It likewise envelops the examination of information inconsistencies seen across different information sources. The market data is analysed and estimated using market statistical and coherent models. Also, market share analysis and key trend analysis are the major success factors in the market report. To know more, please request an analyst call or drop down your inquiry.

The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market and primary (industry expert) validation. Data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Patent Analysis, Pricing Analysis, Company Market Share Analysis, Standards of Measurement, Global versus Regional and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.

Customization Available

Data Bridge Market Research is a leader in advanced formative research. We take pride in servicing our existing and new customers with data and analysis that match and suits their goal. The report can be customized to include price trend analysis of target brands understanding the market for additional countries (ask for the list of countries), clinical trial results data, literature review, refurbished market and product base analysis. Market analysis of target competitors can be analyzed from technology-based analysis to market portfolio strategies. We can add as many competitors that you require data about in the format and data style you are looking for. Our team of analysts can also provide you data in crude raw excel files pivot tables (Fact book) or can assist you in creating presentations from the data sets available in the report.

Frequently Asked Questions

The market is segmented based on , By Product (Testing and Measuring Equipment, Process Control Equipment, Industrial Controls, Power Electronics, Industrial Automation Equipment, Others), Material (Plastic, Paper and Paperboard), Packaging Type (Rigid, Flexible), Application (Semiconductor and Integrated Circuit, Printed Circuit Board, Others), End User (Consumer Electronics, Aerospace and Defence, Automotive, Telecommunication, Others) – Industry Trends and Forecast to 2029 .
The Global Industrial Electronics Packaging Market size was valued at USD 1.82 USD Billion in 2021.
The Global Industrial Electronics Packaging Market is projected to grow at a CAGR of 4.13% during the forecast period of 2022 to 2029.
The major players operating in the market include DS Smith, Mondi, International Paper, Sonoco Products Company, Sealed Air, Huhtamaki, Smurfit Kappa, WestRock Company, UFP Technologies , Stora Enso, Pregis LLC, Shenzhen Hoichow Packing Manufacturing , Dordan Manufacturing Company, Hangzhou Xunda Packaging Co., Dunapack Packaging Group, Universal Protective Packaging , Parksons Packaging , Neenah Paper and Packaging, Plastic Ingenuity, JJX Packaging.
The market report covers data from the U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia and New Zealand, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, United Arab Emirate, Saudi Arabia, Egypt, Israel, South Africa, Rest of Middle East and Africa.