Frequently Asked Questions
The market is segmented based on , By Configuration (Multilayer Ceramic Packages, Metal Can Packages and Pressed Ceramic Packages), Type (Passivation Glass, Glass–Metal Sealing, Reed Glass, Transponder Glass and Ceramic Metal Sealing), Application (Sensors, Photodiodes, Transistors, Lasers, Airbag Ignitors, MEMS Switches and Oscillating Crystals), End User (Military and Defence, Aeronautics and Space, Automotive, Energy and Nuclear Safety, Healthcare, Telecom and Others) – Industry Trends and Forecast to 2030.
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The Global Hermetic Packaging Market size was valued at USD 3.70 USD Billion in 2022.
The Global Hermetic Packaging Market is projected to grow at a CAGR of 6.9% during the forecast period of 2023 to 2030.
The major players operating in the market include Teledyne Technologies, SCHOTT, Amkor Technology, KYOCERA Corporation, Materion Corporation, Egide, SGA Technologies, Complete Hermetics, Special Hermetic Products , Coat-X SA, Hermetics Solutions Group, StratEdge, Mackin Technologies, Palomar Technologies, CeramTec Gmbh, Electronic Products , NGK Insulators , Remtec
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The market report covers data from the U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.
