Global Die Bonder Equipment Market, By Type (Manual Die Bonders, Semiautomatic Die Bonders, Fully Automatic Die Bonders), Bonding Technique (Epoxy, Eutectic, Soft Solder, Others), Supply Chain Participant (Osat Companies, IDM Firms), Application (Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace and Defence), Device (Optoelectronics, MEMS and MOEMs, Power Devices) - Industry Trends and Forecast to 2031.
Die Bonder Equipment Market Analysis and Size
The rising adoption of hybrid laptops, high-definition television, and rising urbanization will emerge as the major factors driving market growth. The various growth determinants, such as the Introduction of stacked die technology in Internet of Things-enabled devices, surging demand for 3D semiconductor assembly and packaging, and increasing demand for semiconductor integrated circuits, are estimated to boost the overall growth.
Data Bridge Market Research analyzes that the global die bonder equipment market, which was USD 856.80 million in 2023, is expected to reach USD 1,128.2 by 2031 and is expected to undergo a CAGR of 3.5% during the forecast period 2023-2031. Consumer electronics, such as smartphones, tablets, laptops, and smart TVs, are ubiquitous and in high demand globally. As technology continues to advance, consumers expect more powerful, energy-efficient, and compact electronic devices. This drives the need for smaller and more densely integrated semiconductor packages, which require advanced die-bonding equipment. In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.
Die Bonder Equipment Market Scope and Segmentation
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Report Metric
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Details
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Forecast Period
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2024 to 2031
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Base Year
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2023
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Historic Years
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2022 (Customizable to 2016-2021)
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Quantitative Units
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Revenue in USD Million, Pricing in USD
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Segments Covered
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By Type (Manual Die Bonders, Semiautomatic Die Bonders, Fully Automatic Die Bonders), Bonding Technique (Epoxy, Eutectic, Soft Solder, Others), Supply Chain Participant (Osat Companies, IDM Firms), Application (Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace and Defence), Device (Optoelectronics, MEMS and MOEMs, Power Devices)
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Countries Covered
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U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, U.A.E., Saudi Arabia, Egypt, South Africa, Israel, Rest of Middle East and Africa
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Market Players Covered
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Besi (Netherlands), ASM Pacific Technology (Hong Kong), Kulicke & Soffa Industries, Inc. (United States), Mycronic (Sweden), Palomar Technologies (United States), West·Bond, Inc. (United States), MicroAssembly Technologies, Ltd. (United Kingdom), Finetech GmbH & Co. KG (Germany), TRESKY GmbH (Germany), SET Corporation SA (Switzerland), Hybond Inc. (South Korea), SHIBUYA CORPORATION (Japan), Paroteq GmbH (Germany), Tresky GmbH (Germany), diasautomation (Switzerland), SHINKAWA Electric Co., Ltd. (Japan), FOUR TECHNOS (Japan), FASFORD TECHNOLOGY CO., LTD. (Taiwan), UniTemp GmbH (Germany)
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Market Opportunities
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Market Definition
A die bonder is basically a system that aids in the placement of a semiconductor device, and die bonder equipment is a type of assemble equipment and semiconductor packaging used to fabricate semiconductor devices. The primary function of a die bonder is to remove the die from the wafer and attach it to a substrate. It is widely used across the various applications such as the consumer electronics, automotive, industrial, telecommunications, healthcare, aerospace and defense.
Global Die Bonder Equipment Market Dynamics
Driver
- Technological advancements
Continuous technological advancements in semiconductor packaging and assembly techniques are a significant driver of the die bonder equipment market. As the semiconductor industry strives to create smaller, more powerful, and energy-efficient devices, die bonders must keep pace by offering higher precision, greater flexibility, and improved throughput.
- Growing demand for consumer electronics
The increasing demand for consumer electronics, such as smartphones, tablets, and other portable devices, is a major driver of the market. These products require densely packed semiconductor packages, and die bonders play a critical role in achieving the necessary miniaturization and integration.
Opportunity
- Emerging applications in automotive
The automotive industry is witnessing a significant transformation with the rise of electric vehicles (EVs) and advanced driver assistance systems (ADAS). These technologies require advanced semiconductor packaging, presenting an opportunity for die bonder equipment manufacturers to expand their presence in this sector
Restraint/Challenge
- Cost and capital intensity
Die bonder equipment is often capital-intensive, making it challenging for some semiconductor manufacturers, particularly smaller companies or startups, to invest in this technology. The high initial investment can be a restraint, limiting market access for certain players and potentially slowing market growth in some regions.
Recent Development
- In October 2022, Kulicke and Soffa secured substantial customer orders for its thermo-compression solution and efficiently delivered its inaugural Fluxless Thermo-Compression Bonder (TCB) to a key customer, solidifying its stronghold in advanced LED Assembly
Global Die Bonder Equipment Market Scope
The die bonder equipment market is segmented on the basis of type, bonding technique, supply chain participant, application and device. The growth among segments helps you analyze niche pockets of growth and strategies to approach the market and determine your core application areas and the difference in your target markets.
Type
- Manual Die Bonders
- Semiautomatic Die Bonders
- Fully Automatic Die Bonders
Bonding Technique
- Epoxy
- Eutectic
- Soft Solder
- Others
Supply Chain Participant
- Osat Companies
- IDM Firms
Application
- Consumer Electronics
- Automotive
- Industrial
- Telecommunications
- Healthcare
- Aerospace and Defence
Device
- Optoelectronics
- MEMS and MOEMs
- Power Devices
Global Die Bonder Equipment Market Region Analysis/Insights
The die bonder equipment market is analyzed and market size, volume information is provided by country, type, bonding technique, supply chain participant, application, and device as referenced above.
The countries covered in the market report are U.S., Canada, Mexico, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, Saudi Arabia, U.A.E., Israel, Egypt, South Africa, rest of Middle East and Africa, Brazil, Argentina and rest of South America.
North America is expected to dominate and fastest growing region in the market due to factors such as high demand for advanced semiconductor devices in various industries, such as automotive, aerospace, medical, and consumer electronics. North America is also home to some of the leading players in the die bonder market, such as Kulicke & Soffa, ASM Pacific Technology, and Palomar Technologies, which offer innovative solutions and services to their customers.
The country section of the report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Global Die Bonder Equipment Market Share Analysis
The die bonder equipment market competitive landscape provides details of competitors. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, and application dominance. The above data points provided are only related to the companies' focus related to the die bonder equipment market.
Some of the major players operating in the die bonder equipment market are:
- DIC Corporation (Japan)
- Flint Group (Luxembourg)
- Hubergroup (Germany)
- Sakata Inx Corporation (Japan)
- Siegwerk Druckfarben AG & Co. KGaA (Germany)
- T&K TOKA Co. Ltd. (Japan)
- Toyo Ink SC Holdings Co., Ltd. (Japan)
- Fujifilm Holdings Corporation (Japan)
- American Inks & Technology (U.S.)
- Wikoff Color Corporation (U.S.)
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