Global Chip-Scale Package (CSP) LEDs Market, By Power Ranges (High-Power, Low- Power, Mid-Power), Application (Automotive Lighting, Backlighting Unit (BLU), Flash Lighting, General Lighting, Others), End-User (Residential, Industrial, Commercial), Packaging Material (Lead Frames, Substrates, Ceramic Packages) Country (U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa) Industry Trends and Forecast to 2028
Market Analysis and Insights : Global Chip-Scale Package (CSP) LEDs Market
Chip-scale package (CSP) LEDs market will grow at a CAGR of 18.45% in the forecast period of 2021 to 2028. Low cost potential due to omission of several packaging steps is an essential factor driving the chip-scale package (CSP) LEDs market.
Traditional LEDs generally undergo from the chip/die manufacturing to packaging processes where the die would be attached to an interposer such as a yielding a packaged LED, ceramic substrate or LED package. Chip-scale package (CSP) LEDs have some separate steps of having manufactured chips going through a packaging line which are eliminated because at the die-level itself the chips are cingulated and coated with phosphor.
Rising low thermal resistance and uniform current spreading is a crucial factor accelerating the market growth, also small form factor, extreme wide beam angle, increased package density, rising demand for CSP LED by the automotive industry for replacement of headlights, rising rate of product adoption in the automotive industry, rising demand of the chip-scale package (CSP) LEDs from numerous end-user industries due to its various uses are the major factors among others boosting the chip-scale package (CSP) LEDs market. Moreover, increasing adoption in general lighting applications and rising development of CSP LEDs with Gan-On-Si will further create new opportunities for chip-scale package (CSP) LEDs market in the forecast period mentioned above.
However, rising overburden on LED foundries and it is only restricted to premium products which acts as the major factors among others which will curtail the market growth, while rising heat dissipation and thermal challenges for module designers and heat dissipation and thermal challenges for module designers will further challenge the chip-scale package (CSP) LEDs market in the forecast period mentioned above.
This chip-scale package (CSP) LEDs market report provides details of new recent developments, trade regulations, import export analysis, production analysis, value chain optimization, market share, impact of domestic and localised market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on chip-scale package (CSP) LEDs market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Chip-Scale Package (CSP) LEDs Market Scope and Market Size
Chip-scale package (CSP) LEDs market is segmented on the basis of power ranges, application, end-user and packaging material. The growth among segments helps you analyse niche pockets of growth and strategies to approach the market and determine your core application areas and the difference in your target markets.
- On the basis of power ranges, the chip-scale package (CSP) LEDs market is segmented into high-power, low- power and mid-power.
- Based on application, the chip-scale package (CSP) LEDs market is segmented into automotive lighting, backlighting unit (BLU), flash lighting, general lighting and others.
- Based on end-user, the chip-scale package (CSP) LEDs market is segmented into residential, industrial and commercial.
- The chip-scale package (CSP) LEDs market is also segmented on the basis of packaging material into lead frames, substrates and ceramic packages.
Global Chip-Scale Package (CSP) LEDs Market Scope Country Level Analysis
Chip-scale package (CSP) LEDs market is analysed and market size, volume information is provided by country, power ranges, application, end-user and packaging material as referenced above.
The countries covered in the chip-scale package (CSP) LEDs market report are U.S., Canada and Mexico in North America, Brazil, Argentina and Rest of South America as part of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Rest of Europe in Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA).
Asia-pacific dominates the chip-scale package (CSP) LEDs market due to rising presence of key market players, rising demand for CSP LED by the automotive industry for replacement of headlights and increasing adoption in general lighting applications in this region.
The country section of the chip-scale package (CSP) LEDs market report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Chip-Scale Package (CSP) LEDs Market Share Analysis
Chip-scale package (CSP) LEDs market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, regional presence, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to chip-scale package (CSP) LEDs market.
The major players covered in chip-scale package (CSP) LEDs market report are Lumileds Holding B.V., SAMSUNG, Seoul Semiconductor Co., Ltd., LG INNOTEK, OSRAM GmbH, NICHIA CORPORATION, EPISTAR Corporation, Cree Inc., Genesis Photonics Inc., Modern Lighting, Lextar Electronics Corporation, Shenzhen MTC, Unistars, Dpower Opto-electronic Co.Ltd, Plessey, Cambridge Nanotherm Limited, Hongli Zhihui Group Co.LTD., Bridgelux Inc., EVERLIGHT, Flory Optoelectronic Materials Co. Ltd., Dow, TDK Corporation, and Jiangsu Bree Optronics Co. Ltd. among other domestic and global players. Market share data is available for global, North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America separately. DBMR analysts understand competitive strengths and provide competitive analysis for each competitor separately.
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