Global Chip Scale Electronics Packaging Market – Industry Trends and Forecast to 2029

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Global Chip Scale Electronics Packaging Market – Industry Trends and Forecast to 2029

  • Semiconductors and Electronics
  • Oct 2022
  • Global
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

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Global Chip Scale Electronics Packaging Market

Market Size in USD Billion

CAGR :  % Diagram

Bar chart comparing the Global Chip Scale Electronics Packaging Market size in 2021 - 28.49 and 2029 - 102.81, highlighting the projected market growth. USD 28.49 Billion USD 102.81 Billion 2021 2029
Diagram Forecast Period
2022 –2029
Diagram Market Size (Base Year)
USD 28.49 Billion
Diagram Market Size (Forecast Year)
USD 102.81 Billion
Diagram CAGR
%
Diagram Major Markets Players
  • ASE Technology Holding Co.Ltd. Amkor Technology JCET Global Siliconware Precision Industries Co.Ltd. Powertech Technology Inc. TongFu Microelectronics Co.Ltd. Lingsen Precision Industries Ltd. Sigurd Corporation OSE CORP. Tianshui Huatian Technology Co.Ltd UTAC. King Yuan ELECTRONICS CO.Ltd. ChipMOS TECHNOLOGIES INC. Formosa Advanced Technologies Co.Ltd.

Global Chip Scale Electronics Packaging Market, By Material (Plastic, Metal, Glass, Others), End User (Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, Others) – Industry Trends and Forecast to 2029.

Chip Scale Electronics Packaging Market 

Chip Scale Electronics Packaging Market Analysis and Size

Semiconductor packaging technology adds value to semiconductor products by preserving overall performance while lowering package costs. The use of semiconductor packaging for high-performance chips used in virtual products is growing. Personal and laptop computers have become necessities for today's technology-driven young consumers. Furthermore, the advancement and innovation in the electronics industry are expected to drive semiconductor packaging sales over the next decade.

Data Bridge Market Research analyses that the chip scale electronics packaging market which was growing at a value of 28.49 billion in 2021 and is expected to reach the value of USD 102.81 billion by 2029, at a CAGR of 17.40% during the forecast period of 2022-2029. In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.

Chip Scale Electronics Packaging Market Scope and Segmentation

Report Metric

Details

Forecast Period

2022 to 2029

Base Year

2021

Historic Years

2020 (Customizable to 2014 - 2019)

Quantitative Units

Revenue in USD billion, Volumes in Units, Pricing in USD

Segments Covered

Material (Plastic, Metal, Glass, Others), End User (Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, Others)

Countries Covered

U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa

Market Players Covered

ASE Technology Holding Co., Ltd. (China), Amkor Technology (U.S.), JCET Global (China), Siliconware Precision Industries Co., Ltd. (China), Powertech Technology Inc. (China), TongFu Microelectronics Co.,Ltd. (China), Lingsen Precision Industries , LTD. (China), Sigurd Corporation (China), OSE CORP. (China), Tianshui Huatian Technology Co.,Ltd (China), UTAC. (Singapore), King Yuan ELECTRONICS CO., LTD. (China), ChipMOS TECHNOLOGIES INC. (China), Formosa Advanced Technologies Co., Ltd. (Taiwan)

Opportunities

  • The surge in device miniaturization
  • Government investment in developing semiconductor manufacturing plants
  • Widespread product adoption in the aerospace industry

Market Definition

The design and manufacturing of electronic equipments ranging from single semiconductors to entire systems such as mainframe computers are called electronic packaging. This protects against mechanical damage, cooling, radio frequency noise emission, and electrostatic discharge. Efficient electrical and semiconductor packaging is used throughout the manufacturing of consumer electronic goods to protect against electrostatic discharge, water, harsh weather conditions, corrosion, and dust. As it allows for reduced board area, weight, and PCB routing complexity, it is used in various army and aerospace facilities that contain semiconductor devices.

Global Chip Scale Electronics Packaging Market Dynamics

Drivers

  • High adoption of consumer electronic devices

One of the key factors driving market growth is the widespread use of products in the consumer electronics industry. Semiconductors are widely used in devices that are lightweight, small, and portable, such as smartphones, tablets, smartwatches, fitness bands, and communication devices. Furthermore, significant growth in the automotive industry is boosting market growth. Semiconductor integrated circuits (ICs) are widely used in many products, including anti-lock braking systems (ABS), infotainment, airbag control, collision detection technology, and windows.

  • Rapid utilisation of technological integrated industrial devices

The growing use of AI and Internet of Things (IoT)-integrated industrial devices with high power requirements is also increasing demand for chip scale electronics packaging. In line with this, rising environmental consciousness among the general public and the growing need to reduce electronic waste are positively impacting market growth. Other factors expected to drive market growth include widespread product adoption in the aerospace industry to improve the thermal performance of aircraft components and rising demand for semiconductor packaging in medical devices such as ultrasound devices, mobile X-ray systems, and patient monitors.

Opportunities

  • Device miniaturization

The surge in device miniaturization is assisting the chip scale electronics packaging market in regaining demand. Furthermore, heavy government investment in developing semiconductor manufacturing plants, particularly in developing countries, is expected to fuel market growth.

Restraints

  • High cost

However, concerns about heat dissipation and the initial high cost of electronic packaging will act as restraints and may impede the growth of the chip scale electronics packaging market during the forecasted period.

This chip scale electronics packaging market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the chip scale electronics packaging market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.

Impact and Current Market Scenario of Raw Material Shortage and Shipping Delays

Data Bridge Market Research offers a high-level analysis of the market and delivers information by keeping in account the impact and current market environment of raw material shortage and shipping delays. This translates into assessing strategic possibilities, creating effective action plans, and assisting businesses in making important decisions.

Apart from the standard report, we also offer in-depth analysis of the procurement level from forecasted shipping delays, distributor mapping by region, commodity analysis, production analysis, price mapping trends, sourcing, category performance analysis, supply chain risk management solutions, advanced benchmarking, and other services for procurement and strategic support.

COVID-19 Impact on Chip Scale Electronics Packaging Market

The COVID-19 epidemic has reduced demand for electronic packaging. Gadget production has ceased as a result of the lockdown. As a result, the entire supply chain of the global chip scale electronics packaging has been disrupted. In contrast, the chip scale electronics packaging sees an opportunity in the current crisis as companies begin to work from home and end-users consume more information on digital platforms, increasing the demand for storage and memory solutions for data centres, laptops, and other devices. The use of medical devices with integrated electronic packaging for bio-imaging and clinical diagnostics is currently driving the chip scale electronics packaging industry. Companies that manufacture ICs and semiconductor devices are expected to update production planning, sourcing strategy, and change industry dynamics to drive growth, thereby increasing the chip scale electronics packaging size and chip scale electronics packaging market share.

Expected Impact of Economic Slowdown on the Pricing and Availability of Products

When economic activity slows, industries begin to suffer. The forecasted effects of the economic downturn on the pricing and accessibility of the products are taken into account in the market insight reports and intelligence services provided by DBMR. With this, our clients can typically keep one step ahead of their competitors, project their sales and revenue, and estimate their profit and loss expenditures.

Recent Development

  • In June 2022 Advanced Semiconductor Engineering, Inc. (ASE) will introduce VI PackTM, an advanced packaging platform designed to enable vertically integrated package solutions. VI PackTM is the next generation of ASE's 3D heterogeneous integration architecture, which extends design rules while achieving ultra-high density and performance.
  • In June 2022 Tera View will release the EOTPR 4500, a purpose-built integrated circuit package inspection machine. The EOTPR 4500 auto prober technology was developed to meet the demands of modern IC packaging technology, accepting substrate sizes up to 150mmx150mm while maintaining probe tip placement precision of +/- 0.5m.

Global Chip Scale Electronics Packaging Market Scope

The chip scale electronics packaging market is segmented on the basis of material and end user. The growth amongst these segments will help you analyse meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

Material

  • Plastic
  • Metal
  • Glass
  • Others

End use

  • Consumer Electronics
  • Aerospace & Defense
  • Automotive
  • Telecommunication
  • Others

Chip Scale Electronics Packaging Market Regional Analysis/Insights

The chip scale electronics packaging market is analysed and market size insights and trends are provided by country, material and end user as referenced above.

The countries covered in the chip scale electronics packaging market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.

Asia-Pacific dominates the advanced packaging market during the forecast period. It is due to the presence of major market players in this region, as well as the rapid growth in demand for semiconductors across various industry verticals such as automotive, consumer electronics, aerospace, defence, and many others, as well as the government's heavy investment in building semiconductor manufacturing plants, particularly in developing countries.

North America is expected to grow at the highest rate over the forecast period, owing to the development of several advanced packaging technologies such as copper hybrid bonding and wafer level packaging (WPL) and the increasing demand for IoT-connected devices such as wearables.

The country section of the report also provides individual market impacting factors and changes in market regulation that impact the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of Global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.   

Competitive Landscape and Chip Scale Electronics Packaging Market Share Analysis

The chip scale electronics packaging market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, Global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to chip scale electronics packaging market.

Some of the major players operating in the chip scale electronics packaging market are:

  • ASE Technology Holding Co., Ltd. (China)
  • Amkor Technology (US)
  • JCET Global (China)
  • Siliconware Precision Industries Co., Ltd. (China)
  • Powertech Technology Inc. (China)
  • TongFu Microelectronics Co.,Ltd. (China)
  • Lingsen Precision Industries , LTD. (China)
  • Sigurd Corporation (China)
  • OSE CORP. (China)
  • Tianshui Huatian Technology Co.,Ltd (China)
  • UTAC. (Singapore)
  • King Yuan ELECTRONICS CO., LTD. (China)
  • ChipMOS TECHNOLOGIES INC. (China)
  • Formosa Advanced Technologies Co., Ltd. (Taiwan)

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Table of Content

1 INTRODUCTION

1.1 OBJECTIVES OF THE STUDY

1.2 MARKET DEFINITION

1.3 OVERVIEW OF GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET

1.4 CURRENCY AND PRICING

1.5 LIMITATION

1.6 MARKETS COVERED

2 MARKET SEGMENTATION

2.1 KEY TAKEAWAYS

2.2 ARRIVING AT THE GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET

2.2.1 VENDOR POSITIONING GRID

2.2.2 TECHNOLOGY LIFE LINE CURVE

2.2.3 MARKET GUIDE

2.2.4 COMPANY POSITIONING GRID

2.2.5 COMAPANY MARKET SHARE ANALYSIS

2.2.6 MULTIVARIATE MODELLING

2.2.7 TOP TO BOTTOM ANALYSIS

2.2.8 STANDARDS OF MEASUREMENT

2.2.9 VENDOR SHARE ANALYSIS

2.2.10 DATA POINTS FROM KEY PRIMARY INTERVIEWS

2.2.11 DATA POINTS FROM KEY SECONDARY DATABASES

2.3 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET: RESEARCH SNAPSHOT

2.4 ASSUMPTIONS

3 MARKET OVERVIEW

3.1 DRIVERS

3.2 RESTRAINTS

3.3 OPPORTUNITIES

3.4 CHALLENGES

4 EXECUTIVE SUMMARY

5 PREMIUM INSIGHT

5.1 PORTERS FIVE FORCES

5.2 REGULATORY STANDARDS

5.3 TECHNOLOGICAL TRENDS

5.4 CASE STUDY

5.5 VALUE CHAIN ANALYSIS

5.6 PRICING ANALYSIS

5.7 COMPANY COMPARITIVE ANALYSIS

6 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, BY TYPE

6.1 OVERVIEW

6.2 WAFER LEVEL CSP

6.2.1 BY TECHNOLOGY

6.2.1.1. FAN-IN

6.2.1.2. FAN-OUT

6.3 FLIP CHIP CSP

6.4 LEAD FRAME CSP

6.5 WIRE BOND CSP

6.6 BALL GRID ARRAY CSP

6.7 OTHERS

7 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, BY MATERIAL

7.1 OVERVIEW

7.2 PLASTIC

7.3 GLASS

7.4 METAL

7.5 OTHERS

8 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, BY CHIP SIZE

8.1 OVERVIEW

8.2 UPTO 5 MM

8.3 5 – 10MM

8.4 10 – 20 MM

8.5 ABOVE 20 MM

9 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, BY APPLICATION

9.1 OVERVIEW

9.2 MEMORY CARD

9.3 FLASH

9.4 CONTROLLER

9.5 RADIO COMMUNICATION

9.6 POWER MANAGEMENT IC

9.7 RADIO FREQUENCY

9.8 OPTOELECTRONIC DEVICE

9.9 CELLULAR PHONE

9.1 OTHERS

10 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, BY END USER

10.1 OVERVIEW

10.2 ELECTRONICS & SEMICONDUCTOR

10.2.1 BY TYPE

10.2.1.1. WAFER LEVEL CSP

10.2.1.2. FLIP CHIP CSP

10.2.1.3. LEAD FRAME CSP

10.2.1.4. WIRE BOND CSP

10.2.1.5. BALL GRID ARRAY CSP

10.2.1.6. OTHERS

10.2.2 BY APPLICATION

10.2.2.1. MEMORY CARD

10.2.2.2. FLASH

10.2.2.3. CONTROLLER

10.2.2.4. RADIO COMMUNICATION

10.2.2.5. POWER MANAGEMENT IC

10.2.2.6. RADIO FREQUENCY

10.2.2.7. OPTOELECTRONIC DEVICE

10.2.2.8. CELLULAR PHONE

10.2.2.9. OTHERS

10.3 AUTOMOTIVE

10.3.1 BY TYPE

10.3.1.1. WAFER LEVEL CSP

10.3.1.2. FLIP CHIP CSP

10.3.1.3. LEAD FRAME CSP

10.3.1.4. WIRE BOND CSP

10.3.1.5. BALL GRID ARRAY CSP

10.3.1.6. OTHERS

10.3.2 BY APPLICATION

10.3.2.1. MEMORY CARD

10.3.2.2. FLASH

10.3.2.3. CONTROLLER

10.3.2.4. RADIO COMMUNICATION

10.3.2.5. POWER MANAGEMENT IC

10.3.2.6. RADIO FREQUENCY

10.3.2.7. OPTOELECTRONIC DEVICE

10.3.2.8. CELLULAR PHONE

10.3.2.9. OTHERS

10.4 IT & TELECOM

10.4.1 BY TYPE

10.4.1.1. WAFER LEVEL CSP

10.4.1.2. FLIP CHIP CSP

10.4.1.3. LEAD FRAME CSP

10.4.1.4. WIRE BOND CSP

10.4.1.5. BALL GRID ARRAY CSP

10.4.1.6. OTHERS

10.4.2 BY APPLICATION

10.4.2.1. MEMORY CARD

10.4.2.2. FLASH

10.4.2.3. CONTROLLER

10.4.2.4. RADIO COMMUNICATION

10.4.2.5. POWER MANAGEMENT IC

10.4.2.6. RADIO FREQUENCY

10.4.2.7. OPTOELECTRONIC DEVICE

10.4.2.8. CELLULAR PHONE

10.4.2.9. OTHERS

10.5 AEROSPACE & DEFENCE

10.5.1 BY TYPE

10.5.1.1. WAFER LEVEL CSP

10.5.1.2. FLIP CHIP CSP

10.5.1.3. LEAD FRAME CSP

10.5.1.4. WIRE BOND CSP

10.5.1.5. BALL GRID ARRAY CSP

10.5.1.6. OTHERS

10.5.2 BY APPLICATION

10.5.2.1. MEMORY CARD

10.5.2.2. FLASH

10.5.2.3. CONTROLLER

10.5.2.4. RADIO COMMUNICATION

10.5.2.5. POWER MANAGEMENT IC

10.5.2.6. RADIO FREQUENCY

10.5.2.7. OPTOELECTRONIC DEVICE

10.5.2.8. CELLULAR PHONE

10.5.2.9. OTHERS

10.6 OTHERS

11 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, BY GEOGRAPHY

11.1 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, (ALL SEGMENTATION PROVIDED ABOVE IS REPRESENTED IN THIS CHAPTER BY COUNTRY)

11.1.1 NORTH AMERICA

11.1.1.1. U.S.

11.1.1.2. CANADA

11.1.1.3. MEXICO

11.1.2 EUROPE

11.1.2.1. GERMANY

11.1.2.2. FRANCE

11.1.2.3. U.K.

11.1.2.4. ITALY

11.1.2.5. SPAIN

11.1.2.6. RUSSIA

11.1.2.7. TURKEY

11.1.2.8. BELGIUM

11.1.2.9. NETHERLANDS

11.1.2.10. NORWAY

11.1.2.11. FINLAND

11.1.2.12. SWITZERLAND

11.1.2.13. DENMARK

11.1.2.14. SWEDEN

11.1.2.15. POLAND

11.1.2.16. REST OF EUROPE

11.1.3 ASIA PACIFIC

11.1.3.1. JAPAN

11.1.3.2. CHINA

11.1.3.3. SOUTH KOREA

11.1.3.4. INDIA

11.1.3.5. AUSTRALIA

11.1.3.6. NEW ZEALAND

11.1.3.7. SINGAPORE

11.1.3.8. THAILAND

11.1.3.9. MALAYSIA

11.1.3.10. INDONESIA

11.1.3.11. PHILIPPINES

11.1.3.12. TAIWAN

11.1.3.13. VIETNAM

11.1.3.14. REST OF ASIA PACIFIC

11.1.4 SOUTH AMERICA

11.1.4.1. BRAZIL

11.1.4.2. ARGENTINA

11.1.4.3. REST OF SOUTH AMERICA

11.1.5 MIDDLE EAST AND AFRICA

11.1.5.1. SOUTH AFRICA

11.1.5.2. EGYPT

11.1.5.3. SAUDI ARABIA

11.1.5.4. U.A.E

11.1.5.5. OMAN

11.1.5.6. BAHRAIN

11.1.5.7. ISRAEL

11.1.5.8. KUWAIT

11.1.5.9. QATAR

11.1.5.10. REST OF MIDDLE EAST AND AFRICA

11.2 KEY PRIMARY INSIGHTS: BY MAJOR COUNTRIES

12 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, COMPANY LANDSCAPE

12.1 COMPANY SHARE ANALYSIS: GLOBAL

12.2 COMPANY SHARE ANALYSIS: NORTH AMERICA

12.3 COMPANY SHARE ANALYSIS: EUROPE

12.4 COMPANY SHARE ANALYSIS: ASIA PACIFIC

12.5 MERGERS & ACQUISITIONS

12.6 NEW PRODUCT DEVELOPMENT AND APPROVALS

12.7 EXPANSIONS

12.8 REGULATORY CHANGES

12.9 PARTNERSHIP AND OTHER STRATEGIC DEVELOPMENTS

13 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, SWOT & DBMR ANALYSIS

14 GLOBAL CHIP SCALE ELECTRONICS PACKAGING MARKET, COMPANY PROFILE

14.1 QUALCOMM TECHNOLOGIES, INC.

14.1.1 COMPANY SNAPSHOT

14.1.2 REVENUE ANALYSIS

14.1.3 PRODUCT PORTFOLIO

14.1.4 RECENT DEVELOPMENT

14.2 AMKOR TECHNOLOGY

14.2.1 COMPANY SNAPSHOT

14.2.2 REVENUE ANALYSIS

14.2.3 PRODUCT PORTFOLIO

14.2.4 RECENT DEVELOPMENT

14.3 SAMSUNG ELECTRO-MECHANICS

14.3.1 COMPANY SNAPSHOT

14.3.2 REVENUE ANALYSIS

14.3.3 PRODUCT PORTFOLIO

14.3.4 RECENT DEVELOPMENT

14.4 DECA TECHNOLOGIES

14.4.1 COMPANY SNAPSHOT

14.4.2 REVENUE ANALYSIS

14.4.3 PRODUCT PORTFOLIO

14.4.4 RECENT DEVELOPMENT

14.5 FRAUNHOFER ISIT

14.5.1 COMPANY SNAPSHOT

14.5.2 REVENUE ANALYSIS

14.5.3 PRODUCT PORTFOLIO

14.5.4 RECENT DEVELOPMENT

14.6 FUJITSU

14.6.1 COMPANY SNAPSHOT

14.6.2 REVENUE ANALYSIS

14.6.3 PRODUCT PORTFOLIO

14.6.4 RECENT DEVELOPMENT

14.7 CHINA WAFER LEVEL CSP CO., LTD

14.7.1 COMPANY SNAPSHOT

14.7.2 REVENUE ANALYSIS

14.7.3 PRODUCT PORTFOLIO

14.7.4 RECENT DEVELOPMENT

14.8 MICROSS

14.8.1 COMPANY SNAPSHOT

14.8.2 REVENUE ANALYSIS

14.8.3 PRODUCT PORTFOLIO

14.8.4 RECENT DEVELOPMENT

14.9 MADPCB

14.9.1 COMPANY SNAPSHOT

14.9.2 REVENUE ANALYSIS

14.9.3 PRODUCT PORTFOLIO

14.9.4 RECENT DEVELOPMENT

14.1 ASE

14.10.1 COMPANY SNAPSHOT

14.10.2 REVENUE ANALYSIS

14.10.3 PRODUCT PORTFOLIO

14.10.4 RECENT DEVELOPMENT

14.11 JCET GROUP

14.11.1 COMPANY SNAPSHOT

14.11.2 REVENUE ANALYSIS

14.11.3 PRODUCT PORTFOLIO

14.11.4 RECENT DEVELOPMENT

14.12 SILICONWARE PRECISION INDUSTRIES CO., LTD

14.12.1 COMPANY SNAPSHOT

14.12.2 REVENUE ANALYSIS

14.12.3 PRODUCT PORTFOLIO

14.12.4 RECENT DEVELOPMENT

14.13 POWERTECH TECHNOLOGY INC.

14.13.1 COMPANY SNAPSHOT

14.13.2 REVENUE ANALYSIS

14.13.3 PRODUCT PORTFOLIO

14.13.4 RECENT DEVELOPMENT

14.14 UNISEM

14.14.1 COMPANY SNAPSHOT

14.14.2 REVENUE ANALYSIS

14.14.3 PRODUCT PORTFOLIO

14.14.4 RECENT DEVELOPMENT

14.15 UTAC

14.15.1 COMPANY SNAPSHOT

14.15.2 REVENUE ANALYSIS

14.15.3 PRODUCT PORTFOLIO

14.15.4 RECENT DEVELOPMENT

14.16 KING YUAN ELECTRONICS CO., LTD.

14.16.1 COMPANY SNAPSHOT

14.16.2 REVENUE ANALYSIS

14.16.3 PRODUCT PORTFOLIO

14.16.4 RECENT DEVELOPMENT

14.17 CHIPMOS TECHNOLOGIES INC.

14.17.1 COMPANY SNAPSHOT

14.17.2 REVENUE ANALYSIS

14.17.3 PRODUCT PORTFOLIO

14.17.4 RECENT DEVELOPMENT

14.18 ECI TECHNOLOGY

14.18.1 COMPANY SNAPSHOT

14.18.2 REVENUE ANALYSIS

14.18.3 PRODUCT PORTFOLIO

14.18.4 RECENT DEVELOPMENT

14.19 ANALOG DEVICES, INC.

14.19.1 COMPANY SNAPSHOT

14.19.2 REVENUE ANALYSIS

14.19.3 PRODUCT PORTFOLIO

14.19.4 RECENT DEVELOPMENT

14.2 KLA CORPORATION.

14.20.1 COMPANY SNAPSHOT

14.20.2 REVENUE ANALYSIS

14.20.3 PRODUCT PORTFOLIO

14.20.4 RECENT DEVELOPMENT

14.21 BREWER SCIENCE, INC

14.21.1 COMPANY SNAPSHOT

14.21.2 REVENUE ANALYSIS

14.21.3 PRODUCT PORTFOLIO

14.21.4 RECENT DEVELOPMENT

14.22 CHIPBOND TECHNOLOGY CORPORATION

14.22.1 COMPANY SNAPSHOT

14.22.2 REVENUE ANALYSIS

14.22.3 PRODUCT PORTFOLIO

14.22.4 RECENT DEVELOPMENT

NOTE: THE COMPANIES PROFILED IS NOT EXHAUSTIVE LIST AND IS AS PER OUR PREVIOUS CLIENT REQUIREMENT. WE PROFILE MORE THAN 100 COMPANIES IN OUR STUDY AND HENCE THE LIST OF COMPANIES CAN BE MODIFIED OR REPLACED ON REQUEST

15 CONCLUSION

16 QUESTIONNAIRE

17 RELATED REPORTS

18 ABOUT DATA BRIDGE MARKET RESEARCH

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Global Chip Scale Electronics Packaging Market, Supply Chain Analysis and Ecosystem Framework

To support market growth and help clients navigate the impact of geopolitical shifts, DBMR has integrated in-depth supply chain analysis into its Global Chip Scale Electronics Packaging Market research reports. This addition empowers clients to respond effectively to global changes affecting their industries. The supply chain analysis section includes detailed insights such as Global Chip Scale Electronics Packaging Market consumption and production by country, price trend analysis, the impact of tariffs and geopolitical developments, and import and export trends by country and HSN code. It also highlights major suppliers with data on production capacity and company profiles, as well as key importers and exporters. In addition to research, DBMR offers specialized supply chain consulting services backed by over a decade of experience, providing solutions like supplier discovery, supplier risk assessment, price trend analysis, impact evaluation of inflation and trade route changes, and comprehensive market trend analysis.

Research Methodology

Data collection and base year analysis are done using data collection modules with large sample sizes. The stage includes obtaining market information or related data through various sources and strategies. It includes examining and planning all the data acquired from the past in advance. It likewise envelops the examination of information inconsistencies seen across different information sources. The market data is analysed and estimated using market statistical and coherent models. Also, market share analysis and key trend analysis are the major success factors in the market report. To know more, please request an analyst call or drop down your inquiry.

The key research methodology used by DBMR research team is data triangulation which involves data mining, analysis of the impact of data variables on the market and primary (industry expert) validation. Data models include Vendor Positioning Grid, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Patent Analysis, Pricing Analysis, Company Market Share Analysis, Standards of Measurement, Global versus Regional and Vendor Share Analysis. To know more about the research methodology, drop in an inquiry to speak to our industry experts.

Customization Available

Data Bridge Market Research is a leader in advanced formative research. We take pride in servicing our existing and new customers with data and analysis that match and suits their goal. The report can be customized to include price trend analysis of target brands understanding the market for additional countries (ask for the list of countries), clinical trial results data, literature review, refurbished market and product base analysis. Market analysis of target competitors can be analyzed from technology-based analysis to market portfolio strategies. We can add as many competitors that you require data about in the format and data style you are looking for. Our team of analysts can also provide you data in crude raw excel files pivot tables (Fact book) or can assist you in creating presentations from the data sets available in the report.

Frequently Asked Questions

The current market value is USD 28.49 billion in 2021.
The market is expected to grow at a rate of market is 17.40% during the forecast period of 2022 to 2029.
The segments covered are Material & End User.
North America is expected to grow at the highest rate over the forecast period, owing to the development of several advanced packaging technologies such as copper hybrid bonding and wafer level packaging (WPL) and the increasing demand for IoT-connected devices such as wearables.
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