Overview
Miniaturization has significantly impacted technical advancements. The ongoing drive towards ever-smaller optical, mechanical, and electronic components is gaining popularity. Various technologies associated with semiconductor devices and circuit technology, such as electronic packaging, comprise the backbone of high performance miniaturized electronic systems. Miniaturized electronics are driving advancements in technology and business, from basic testing to satellites, celestial robots, and interplanetary exploration. As technology advanced, electric components became miniaturized and merged into single chips known as merged circuits.
Integrated circuits (ICs) have altered the world of electronics, allowing for compact, efficient, and powerful electronic devices in a variety of industries. From consumer electronics to telecommunications, automobile systems to medical equipment, integrated circuits (ICs) have transformed technology and influenced society. Understanding the history, kinds, design, and applications of ICs sheds light on their enormous promise and limitations. As integrated circuit technology advances, future trends such as SoC integration, Internet of Things, and quantum computing defines the next generation of electronic products, paving the way for exciting improvements in the digital age. The SoC is the pinnacle of this evolution, combining not just transistors but full functional systems such as processors (CPUs), memory, input/output systems, and occasionally even complete network interfaces on a single chip. This integration is analogous to fitting a full computer system onto a chip the size of a thumbnail. The goal was miniaturization and also increased efficiency, lower power consumption, and overall performance of electronic systems. This tale revolves around the progress of electrical components, specifically how they are integrated and interrelated.
Figure 1: Benefits of Miniaturization in Electronic Technology
Source: DBMR Analysis
Advantages of Miniaturization
Miniaturized electronic technology offers numerous advantages. Some of these include the following:
- Small Size: Small, handheld, wearable, and portable electronic devices have been competing in areas including aerospace, media, consumer electronics, and the stringent medical industry for decades. Miniaturizing electronic subassemblies allows for larger batteries without increasing device size, which is appealing to customers across industries. Smaller modules provide designers with more freedom to create stylish products that appeal to consumers. Additionally, smaller modules have shorter signal paths with less stray inductance and capacitance, resulting in improved signal integrity and faster operating speeds
- Speed: Miniaturization’s advantage in speed distinguishes it from other processes in the modern world. Miniaturization increases density, resulting in shorter pathways. Smaller circuits allow for higher frequencies and clock rates, leading to faster performance and smoother operation compared to previous versions. Higher frequencies have a wider range
- High Efficiency and Less Power Consumption- Miniaturized gadgets consume less power and are more efficient due to their compact size. Power consumption is proportional to load, capacitance, and the square of the operating voltage. Because everything is so little, the capacitance is likewise quite low
- Cost: Cost is always an important consideration in every field. Eliminating components such as resistors, capacitors, and inductors reduces prices and space requirements. However, design-in, assembly, and visual and functional inspection of solder points can be costly, sometimes exceeding the cost of the components. Micro-/nano-electronics is the most significant technological advancement since the introduction of electronics
- Portability: Handheld and portable devices are becoming increasingly popular as people expect real-time access to data, news, and information. Handheld or portable gadgets allow owners to access their jobs or facilities from anywhere. As a result, portability makes it easier to obtain information, complete tasks, or use a device at any time and from any location
Limits of Miniaturization
Several advancements will undoubtedly continue to propel the miniaturization trend forward in the coming years. However, there are limits to what is practically, commercially, and environmentally feasible.
The most important issues revolve around thermal impacts. As semiconductor geometries shrink, the SoC supply voltage decreases, but transistor efficiency increases, resulting in more computing power per Watt. On the other hand, thermal package capabilities for certain form factors do not increase significantly, so overall power dissipation must be carefully managed. Thermal pads, thermal vias, heat pipes, and so on are techniques to try to alleviate thermal difficulties. However, there are applications with power dissipation that will require active cooling.
Thermal management is a significant concern for both current and future electronics. New technologies need to extract heat more sustainably. Using microfluidics is an important and effective method. Monolithically integrated manifold microchannel cooling structures are highly efficient. It has high potential to reduce the temperature of electronic gadgets. Bringing coolant into direct touch with the chip increases efficiency. Microfluidic cooling systems are cost-effective and compatible with electronic components.
The Development of Logic and System-on-Chip Technology
To follow the growth of logic and chip technology, it is critical to comprehend the fundamental change from traditional Integrated Circuits (ICs) to the more modern System-on-a-Chip (SoC). This transition is more than just cramming more transistors onto silicon; it is a paradigm shift in how we approach design, functionality, and the whole ethos of electronic integration.
- Functionality: ICs were originally designed to perform certain purposes such as signal amplification, switching, and basic logic operations. SoCs combine CPUs, GPUs, RAM, storage, and other specialized components on a single silicon die. They represent an entire electronic subsystem
- Scale and Complexity: Traditional integrated circuits (ICs) began with the integration of a few transistors to execute fundamental functions, which was known as Small-Scale Integration. As technology advanced, we achieved Medium-Scale Integration (MSI) and later Large-Scale Integration (LSI), which could accommodate thousands of transistors. SoCs, on the other hand, stand for Very-Large-Scale Integration (VLSI), with millions to billions of transistors covering complete systems on a single chip
- Customization: Unlike integrated circuits, which are mostly standardized, SoCs can be adapted to specific applications or devices. This customization addresses the power, performance, and functionality requirements of specialized sectors, such as cellphones, medical devices, and automotive applications
Market Trends in Relation with System-on-Chip Technology
System-on-Chip (SoC) technology is evolving to enhance capabilities and set new industry standards.
Figure 2: Market Trends of System-on-Chip (SoC)
Source: DBMR Analysis
Miniaturization
- Nanometre Technologies: Manufacturers are developing SoCs using technologies as refined as 5nm and 3nm. The route to these scales has been one of cramming more transistors onto processors in order to gain improved performance and efficiency
- 3D Stacking: As horizontal space becomes more valuable, the business is looking vertically. 3D stacking includes stacking silicon wafers or dies on top of each other and connecting them with Through-Silicon Vias (TSVs). This saves space and also improves performance
Energy Efficiency and Green Computing
- Adaptive Voltage Scaling: Allowing the SoC to dynamically modify its voltage in response to computing demands can greatly cut power usage.
- Heterogeneous Computing: Using several types of CPU cores optimized for specific tasks guarantees that just the necessary cores are active, hence conserving energy
Power Efficient (SWaP)
- Capability Enhancement: (SoC) devices help to meet difficult SWaP-C targets without sacrificing functionality or performance. While SiP devices may not offer all SWaP-C solutions, they can help in adding electronic capabilities to a growing variety of applications meant for smaller sizes, such as portable mission-critical communications and unmanned aerial system (UAS) applications
Integrating AI and Machine Learning Cores
- Dedicated Neural Processing Units (NPU): NPUs are increasingly being used in modern SoCs, particularly in smartphones and data centers, to improve the efficiency of AI and ML activities
- Edge Computing: AI cores built-in SoCs allow devices to process data locally (on the "edge") rather than transferring it to a central server. This minimizes latency and bandwidth utilization, while also improving privacy and security
Artificial intelligence (AI) and machine learning (ML) are revolutionizing many industries, including SoC development. SoC designers are building AI and ML capabilities right into their chips to enable on-device processing, minimizing the requirement for cloud computing. This trend enables faster and more effective processing of AI algorithms, allowing activities such as image identification, natural language processing, and voice recognition to be performed directly on the device itself
Global artificial intelligence (AI) chipset market has witnessed a substantial owing to the surge in edge computing, driven by demands for real-time processing and reduced latency, is fueling the demand for specialized AI chipsets. Moreover, more technological advancement in varied industries, including autonomous driving, smart devices, medical devices and others is leading the artificial intelligence (AI) chip market to see extraordinary growth in the forecast period. According to Data Bridge Market Research analysis, the market for global artificial intelligence (AI) chipset market is projected to grow at a compound annual growth rate (CAGR) of 37.00% from 2024- 2031.
To learn more about the study, visit: https://www.databridgemarketresearch.com/jp/reports/global-artificial-intelligence-ai-chipset-market
Changes in Manufacturing Processes and Materials
- Alternative Semiconductor Materials: Silicon, the traditional material for semiconductors, is facing competition. Materials such as gallium nitride (GaN) and silicon carbide (SiC) are being investigated for possible performance and efficiency benefits
- EUV Lithography: Extreme Ultraviolet (EUV) lithography is a cutting-edge chip manufacturing technique that allows even smaller features to be etched into chips, enabling the aforementioned nanometer-scale operations.
Enhanced Connectivity Options Include 5G, Wi-Fi 6
- On-board modems: The integration of sophisticated modems directly onto SoCs ensures that devices are ready for the latest communication standards, such as 5G cellular networks or Wi-Fi 6 and 6E, which improves speed and connectivity
- IoT and Beyond: As the Internet of Things (IoT) expands, so does the demand for SoCs with a wide range of connectivity options, paving the door for a truly connected world. SoCs play a crucial role in powering IoT devices, providing the necessary processing capabilities and connectivity options. By integrating microcontrollers, sensors, wireless modules, and other components onto a single chip, SoCs enable cost-effective and energy-efficient IoT solutions.
For example, the ESP32 SoC developed by Espressif Systems is widely used in IoT applications, offering Wi-Fi and Bluetooth connectivity, as well as sufficient computing power for edge computing tasks
Global IoT chips market is witnessing substantial growth in recent years owing to increasing inclination towards 5g and AI technology. Adding to this, rising smart cities initiatives, growing flexible SoC design and utilization of more connected devices supplement the growth of the overall IoT market in the forecast period. According to Data Bridge Market Research analysis, the market for global IoT chips market is projected to grow at a compound annual growth rate (CAGR) of 11.40% from 2021-2028.
To learn more about the study, visit: https://www.databridgemarketresearch.com/jp/reports/global-iot-chip-market
Applications of System-on-Chip (SoC) in Varied Industries
System-on-chip (SoC) technology has transformed many industries by combining multiple components on a single chip. SoCs have formed the foundation of modern technological breakthroughs, spanning mobile devices, IoT applications, automotive systems, and wearables.
Figure 3: Application of System-on-Chip (SoC)
Source: DBMR Analysis
Below is the list of the few industries where SoCs are being utilized:
Healthcare: With the rise of telemedicine and remote diagnostics, SoCs can power wearable health monitors, smart implants, and personalized drug delivery systems.
- In July 2023, Ambiq, a technological company in ultra-low power semiconductor products and solutions, added the Apollo4 Lite and Apollo4 Blue Lite SoCs to its growing line of SoCs for IoT endpoint devices, particularly remote monitoring products in the healthcare sector. The Apollo4 Lite and Blue Lite product lines are the newest generation system processor solutions based on Ambiq's unique Subthreshold Power-Optimized Technology (SPOT) platform, allowing for additional functionality while reducing total system power consumption and extending battery life. Both SoCs include an ultra-low power Cortex-M4 core that can run at up to 192 MHz with turboSPOT, an audio subsystem, a GPU, and plenty of MRAM and SRAM. With bright graphics and long battery life, these latest additions to our Apollo4 SoC family make cutting-edge health tracking more inexpensive and accessible
- In January 2022, Onera Health launched the first Onera Biomedical-Lab-on-Chip at CES 2022 in Las Vegas. The biomedical sensor system-on-chip collects and processes several biosignals and is intended for a wide range of wearable health applications and devices, providing numerous solutions and opportunities for innovation in the medical, wellness, and fitness sectors
The Global System-on-Chip (SoC) market has witnessed substantial growth owing to the increasing demand for SoC in multiple applications, including smart devices, autonomous vehicles, portable medical devices and others. Adding to this, rising investment by different government bodies towards setting up manufacturing and production facilities supplements the growth in the forecast period. According to Data Bridge Market Research analysis, the market for the global System-on-Chip (SoC) market is projected to grow at a compound annual growth rate (CAGR) of 8.55% from 2022 to 2029.
To learn more about the study, visit: https://www.databridgemarketresearch.com/jp/reports/global-system-on-chip-soc-market
Automotive: Future autonomous vehicles will rely significantly on sophisticated SoCs for real-time data processing, sensor integration, and decision-making.
- In June 2024, Intel introduced the OLEA U310 system-on-chip (SoC). This next-generation technology is expected to considerably increase the overall performance of electric cars (EVs), expedite design and manufacturing processes, and expand SoC services to enable seamless operation across many EV station platforms. The new SoC is the industry's first full solution that combines hardware and software in one, and it is designed to meet the need for powertrain domain control in electrical designs with distributed software. The new solution also adds to Intel Automotive's existing family of AI-enhanced software-defined vehicle (SDV) SoCs, which will collectively accelerate the industry's transition to an all-electric, software-defined future
- In December 2023, 12 businesses from the automotive, electrical component, and semiconductor industries formed the "Advanced SoC Research for Automotive" (ASRA) to research and develop high-performance digital semiconductors (System on Chip, SoC) for automotive applications.
- Automotive Manufacturers: Toyota Motor Corporation, Honda Motor Co., Ltd., Nissan Motor Corporation, Mazda Motor Corporation, and SUBARU Corporation
- Semiconductor Companies: Renesas Electronics Corporation, Cadence Design Systems, Synopsys, MIRISE Technologies Corporation, and Socionext Inc.
- Electrical Component Manufacturers: DENSO CORPORATION, Panasonic Automotive Systems Co., Ltd.
ASRA plans to use chip technology to produce SoCs for autos, which will be installed in mass-production vehicles starting in 2030. ASRA wants to use in-vehicle chiplet technology by 2028 and SoCs in mass-produced automobiles beginning in 2030. ASRA aims to be a leading in technology research by leveraging Japan's expertise in automotive, electrical components, and semiconductors. The organization will collaborate with industry, government, and academia.
- In November 2023, Renesas Electronics Corporation, one of the provider of advanced semiconductor solutions, The company revealed details on its fifth-generation R-Car SoC for high-performance applications, which features superior in-package chiplet integration technology and will provide automotive engineers more freedom to customize their designs. Until the fourth generation, R-Car SoCs were tailored to certain use cases, such as ADAS/Autonomous Driving, which demands high AI performance, and gateway solutions with improved communication capabilities. Renesas' fifth-generation R-Car SoC will leverage chiplet technology to build a versatile platform that can be tailored to meet the specific needs of each use case. Thus, this outlay will assist the company to achieve this aim by deploying more scalable embedded processors, and by expanding their extensive network of development tools
Aerospace and Defense: SoCs can enable small but powerful onboard systems for satellites, drones, and modern defense equipment. System on Chip (SoC) enables different military applications, namely soldier worn electronics, micro air vehicles and battlefield networking that rely on weight, small size and power consumption (SWaP).
- In April 2024, Advanced Micro Devices AMD expanded its Versal adaptive system on chip (SoC) portfolio with the release of the new Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 adaptive SoCs. These devices combine preprocessing, AI inference, and post-processing capabilities into a single device, delivering end-to-end acceleration for AI-powered embedded systems. The advancements aim to balance performance, power, area, and functional safety and security features, with the Gen 2 solutions enabling the design of high-performance, edge-optimized products for the automotive, aerospace and defense, industrial, vision, healthcare, broadcast, and pro AV markets
- In June 2022, Microchip continued this trend, announcing that its RISC-V-based PolarFire SoC FPGA had reached mass production. As customers continue to use PolarFire SoC FPGA at a rapid rate, Microchip Technology Inc. announced the production certification of MPFS250T and the previously disclosed MPFS025T. Microchip also says that its Mi-V ecosystem is helping to streamline RISC-V adoption while allowing a new class of smaller, more power-efficient, and less expensive industrial, IoT, and edge-computing solutions
Entertainment and Gaming: Augmented Reality (AR) and Virtual Reality (VR) will continue to rise, necessitating SoCs with strong graphics performance and low power consumption.
- In August 2023, Qualcomm Technologies, Inc. joined Microsoft's steering council. Qualcomm Technologies has also previously collaborated with Microsoft on AR initiatives, including providing the System-on-Chip (SoC) technology utilized in HoloLens 2. Moreover, Qualcomm Technologies added support for MRTK3 to the Snapdragon Spaces XR Developer Platform. This allows developers to use MRTK UI frameworks and input systems to create immersive volumetric experiences for space-based augmented Reality glasses and Virtual Reality headsets.
Other Applications of System-on-Chip (SoC) Incorporate:
- Agriculture: From smart irrigation systems to drone-based crop monitoring, SoCs have the potential to transform precision farming and sustainable agricultural practices. Chiplets are modular and smaller units to create powerful SoC architecture. The limitation of traditional chips can be overcome by leveraging chiplets. This will not only enable the UAVs development with excellent performance but will enhance the energy efficiency along with adaptabilities
- Mobile Devices: One of the most common uses for System-on-Chip (SoC) technology is in mobile devices such as smartphones and tablets. SoCs are used to combine many components, such as processors, memory, graphics, and wireless communication modules, on a single chip. This integration enables manufacturers to design compact and power-efficient gadgets without sacrificing performance.
For instance, the Apple A-series SoCs featured in iPhones and iPads combine strong processors, graphics units, and specialized neural engines to provide seamless user experiences and advanced capabilities such as augmented reality
- Wearable Devices: Advancements in SoC technology have contributed significantly to the rise of wearable technology. SoCs enable the miniaturization of components such as CPUs, sensors, and wireless modules, allowing them to be seamlessly integrated into wearable devices such as smartwatches, fitness trackers, and intelligent eyewear. These little devices may handle a variety of tasks, including health monitoring, activity tracking, notifications, and wireless connectivity.
For instance, the Qualcomm Snapdragon Wear series of SoCs drives a wide range of wearable devices, providing efficient processing power and networking options designed specifically for wearable applications.
Conclusion
System-on-Chip (SoC) technology exemplifies human inventiveness in the field of electronics and computers. SoCs evolved from mere notions to ubiquitous components that power a wide range of current electronics, driven by the goal of increased efficiency, miniaturization, and integration. SoCs power everything from smartphones and wearables to self-driving cars and smart home devices.
Recent trends in SoC development, such as the integration of quantum computing parts, the pursuit of power efficiency, and the role of SoCs in edge computing, demonstrate the technology's versatility and adaptability. The industry's consistent push towards smaller manufacturing processes, improved performance measurements, and integration into varied industries suggests a trend that promises to impact future electronics.
