Frequently Asked Questions
The market is segmented based on Global Sputtering Targets and Evaporation Materials Market, By Type (Sputtering Targets, Evaporation Materials), Sputtering Method (DC Sputtering, Reactive Sputtering, RF Sputtering, Ion Assisted Sputtering, Magnetron Sputtering, Gas Flow Sputtering, Others), Components – Vacuum Pump Vacuum Gauge, Process Gas Monitor, Leak Detector, Thin Film Measurement/Deposition Controller, Optical Process Monitor, Vacuum Valve, Parts of Ultra-High-Vacuum, Transfer Robot, Others), Evaporation Method (Thermal Evaporation, Electron-beam Evaporation, Vacuum Evaporation, Reactive Evaporation, Others), Material Type – Pure Metals, Isotope, Alloys, Compounds, Others), Sputtering Targets (Metallic and Elemental Sputtering Targets, Oxide Sputtering Targets, Alloy Sputtering Targets, Compound Sputtering Targets, Others), Application (Aerospace and Defense, Dentistry, Fine Art Materials, Agriculture, Electronics, Industrial, Energy, Optics, Others) – Industry Trends and Forecast to 2029.
.
The Global Sputtering Targets And Evaporation Materials Market size was valued at USD 2.88 USD Billion in 2021.
The Global Sputtering Targets And Evaporation Materials Market is projected to grow at a CAGR of 5.5% during the forecast period of 2022 to 2029.
The major players operating in the market include Materion Corporation, SCI Engineered Materials, Hitachi Metals Ltd, Ulvac, Treibachner industrie AG, mds.umicore, Kurt J. Lesker Company, PLANSEE SE, Furuya Metal Co., ABLE TARGET LIMITED, Sino Santech Materials Technology Co. Ltd, Nichia Corporation, Grinm Advanced Materials Co., Soleras.
The market report covers data from the U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, U.A.E, Saudi Arabia, Egypt, South Africa, Israel, Rest of Middle East and Africa.
