아시아 태평양 SiC 전력 반도체 시장 – 2030년까지의 산업 동향 및 예측

아시아 태평양 SiC 전력 반도체 시장 분석 및 규모

SiC 전력 반도체는 가장 널리 사용되는 반도체이며 전자 제품에 가장 적합한 선택으로 간주됩니다. 이러한 SiC 전력 반도체는 가정, 상업 및 산업 분야와 다양한 다른 분야에 적용됩니다. SiC 전력 반도체는 SiC 이산 장치와 SiC 베어 다이와 같은 두 가지 유형의 장치로 제공됩니다. 기술의 발전으로 인해 SiC 이산 장치의 보급이 더 빠르게 증가하고 있습니다. SiC 전력 반도체의 중요한 특성은 전기를 효율적으로 사용하는 다양한 다른 특성과 함께 높은 열 전도성입니다. SiC 전력 반도체는 통신, 에너지 및 전력, 재생 에너지 생산 및 여러 다른 곳에서 사용됩니다. SiC 전력 반도체는 전력 전자 제품에 사용되어 개인 사이에서 보급도가 높아지고 있습니다. 아시아 태평양 SiC 전력 반도체 시장에서 SiC 전력 반도체에 대한 수요가 더 빠른 속도로 증가하고 있습니다. 이를 위해 다양한 시장 참여자가 신제품을 출시하고 파트너십을 형성하여 아시아 태평양 SiC 전력 반도체 시장에서 사업을 확장하고 있습니다.

Data Bridge Market Research는 아시아 태평양 SiC 전력 반도체 시장이 2030년까지 4,058,305.08천 달러에 도달할 것으로 예상하며, 예측 기간 동안 CAGR은 25.9%가 될 것으로 분석했습니다. 아시아 태평양 SiC 전력 반도체 시장 보고서는 또한 가격 분석, 특허 분석 및 기술 발전을 포괄적으로 다룹니다.

Market Definition

SiC power semiconductor refers to the type of semiconductor that contains carbon and silicon and operates at very high voltage and temperature. SiC power semiconductors can be used in producing a strong as well as a very hard material. SiC power semiconductors can be implemented in various sectors such as telecommunication, energy and power, automotive, renewable power generation, and in different other areas. They are basically considered due to higher maximum thermal conductive properties that have widened the area of application. SiC power semiconductors are devices that are considered high-frequency power devices that are majorly applicable in wireless communications. SiC semiconductor offers ten times the dielectric breakdown field strength, three times the thermal conductivity, and three times the bandgap as compared to a silicon semiconductor. The SiC semiconductor has taken over the market because of its high performance and efficiency. The SiC power semiconductor offers to work at high voltage and current and offers low on-resistance in addition to being efficient at high temperatures. The combination of silicon carbide has thus proved to be a better and optimum choice of semiconductor.

Asia-Pacific SiC Power Semiconductor Market Dynamics

This section deals with understanding the market drivers, advantages, opportunities, restraints, and challenges. All of this is discussed in detail below:

Drivers

• Advent Of SiC Power Semiconductors

There are very useful properties of SiC as a semiconductor material. In applications such as inverters, motor drives, and battery chargers, silicon carbide (SiC) devices offer many advantages, such as improved power density, reduced cooling requirements, and reduced overall system cost. These advantages are enough to make SiC power semiconductors at the high efficient stage.

The energy lost by SiC during the reverse recovery phase is only 1% of the energy lost by silicon which creates a huge difference in the efficiency of the material. The virtual absence of a tail current allows a faster turn‑off, and it makes lower losses. Since there is less energy to dissipate, a SiC device able to switch at higher frequencies and improve efficiency. The more efficient, small size, and lower weight of SiC as compared to other materials can create a higher-rated solution or a smaller design with reduced cooling requirements. Thus, the advent of SiC power semiconductors is a major factor expected to drive the growth of the Asia-Pacific SiC power semiconductor market.

• Rising Penetration of Electronic Vehicles

The world is changing so fast, and it is turning towards renewable energy. All sectors, market players, and government institutes are making more focus to build electric vehicle infrastructure and generate more demand for electric vehicles.

As per the information from International Energy Agency (IEA), 16.5 million electric cars were on the road in 2021, a tripling in just three years, and this is a big number as compared to 2020. Electric car sales increased and doubled in China, continued to increase in Europe, and picked up in the U.S.  in 2021. This data shows that there is a tremendous increase in the penetration of EVs in the market, which may positively affect the environment as well as the Asia-Pacific SiC power semiconductor market. SiC is highly efficient at high voltages, enabling fast battery charging times that are comparable to filling the tank of conventional vehicles. Silicon carbide power electronics are enabling a surge in 800-volt drive systems, paving the way for lighter EVs with greater range.

Opportunity

• Strategic Partnership and Acquisition by SiC Manufacturers

There are various organizations and market players which are creating strategic partnerships and acquisitions. This partnership creates a huge positive impact on the growth of the Asia-Pacific SiC power semiconductor market. This collaboration results in cooperation, becoming a low-cost route for new competitors to gain technology and market access.

 A joint venture involves two or more businesses pooling their resources and expertise to achieve a particular goal. There are many organizations that collaborate with each other's and create a positive impact on the growth of the Asia-Pacific SiC power semiconductor market.

Restraint/Challenge

• Issues Related With SiC Wafer Manufacturing

A SiC wafer is a semiconductor material that has excellent electrical and thermal properties. It is a high-performance semiconductor that is ideal for a wide variety of applications. In addition to its high thermal resistance, it also features a very high level of hardness. There is a lot of fabrication challenge faced by SiC wafer manufacturers. The main defects that can occur during the manufacturing of SiC substrates are crystalline stacking faults, micro pipes, pits, scratches, stains, and surface particles. These factors are adversely affecting the performance of SiC devices which have been detected more frequently on 150-mm wafers than on 100-mm wafers. This is because SiC is the third-hardest composite material in the world and is also very fragile, and its production poses complex challenges related to cycle time, cost, and dicing performance. It is effective to predict that even switching to 200-mm wafers will entail significant issues. In fact, it will be necessary to guarantee the same quality of the substrate, facing an inevitably higher density of defects.

Post-COVID-19 Impact on Asia-Pacific SiC Power Semiconductor Market

The SiC power semiconductor industry noted a gradual decrease in demand due to the lockdown and COVID-19 governmental laws, as manufacturing facilities and services were closed. Even private and public development was called off. Moreover, the industry was also affected by the halt of the supply chain, especially of raw materials used in the manufacturing process of SiC power semiconductors. Stringent government regulations for different industries and restrictions on trade & transportation were some of the top factors that caused a dent in the growth of the market for SiC power semiconductors around the world in 2020 and in the first two quarters of 2021. As the SiC power semiconductor production slowed down owing to the restrictions by governments across the globe, the production was not meeting the demand in the first three quarters of 2020. Moreover, high demand/requirement for SiC power semiconductor products in the automotive and defense industry, in the medical sector, and in hydraulics applications has been witnessed. The resumption of production of the oil and gas industry and automotive; further fuelled the rising demand for SiC power semiconductors across the globe. Thus, this not only led to a hike in demand but also increased the cost of the product.

Recent Developments

• In December 2022, STMicroelectronics and Soitec (Euronext Paris), in designing and manufacturing innovative semiconductor materials, announced the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec's SiC substrate technology by ST planned over the next 18 months. The goal of this cooperation is the adoption by ST of Soitec's SmartSiC technology for its future 200mm substrate manufacturing, feeding its devices and modules manufacturing business, with volume production expected in the midterm. This collaboration will help the company to boost its financials as well as the growth of the Asia-Pacific SiC power semiconductor market.
• In July 2022, Semikron Danfoss and the Kyoto-based company ROHM Semiconductor have been collaborating for more than ten years with regard to the implementation of silicon carbide (SiC) inside power modules. Recently, ROHM's latest 4th generation of SiC MOSFETs has been fully qualified in SEMIKRON's eMPack modules for automotive use. Hence, both companies serve worldwide customers' needs. This collaboration enhanced the company's financials and made a positive impact on the growth of the Asia-Pacific SiC power semiconductor market.

Asia-Pacific SiC Power Semiconductor Market Scope

The Asia-Pacific SiC power semiconductor market is segmented on the basis of type, voltage range, wafer size, wafer type, application, and vertical. The growth amongst these segments will help you analyze meager growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

By Type

• MOSFETS
• Hybrid Modules
• Schottky Barrier Diodes (SBDS)
• IGBT
• Bipolar Junction Transistor (BJT)
• Pin Diode
• Junction FET (JFET)
• Others

On the basis of type, the Asia-Pacific SiC power semiconductor market is segmented into MOSFETS, Hybrid Modules, Schottky Barrier Diodes (SBDS), IGBT, Bipolar Junction Transistor (BJT), Pin Diode, Junction FET (JFET) and others.

By Voltage Range

• 301-900 V
• 901-1700 V
• Above 1701 V

On the basis of voltage range, the Asia-Pacific SiC power semiconductor market is segmented into 301-900 V, 901-1700 V, and above 1701 V.

By Wafer Size

• 6 Inch
• 4 Inch
• 2 Inch
• Above 6 Inch

On the basis of wafer size, the Asia-Pacific SiC power semiconductor market is segmented into 6 Inch, 4 Inch, 2 Inch, and above 6 Inch.

By Wafer Type

• SiC epitaxial wafers
• Blank SiC wafers

On the basis of the wafer type, the Asia-Pacific SiC power semiconductor market is segmented into SiC epitaxial wafers and blank SiC wafers.

By Application

• Electric Vehicles (EV)
• Photovoltaics
• Power supplies
• Industrial motor drives
• EV charging infrastructure
• RF Devices
• Others

On the basis of the application, the Asia-Pacific sic power semiconductor market is segmented into electric vehicles (EV), photovoltaics, power supplies, industrial motor drives, EV charging infrastructure, RF devices, and others.

By Vertical

• Automotive
• Utilities and energy
• 산업
• 운송
• IT 및 통신
• 가전제품
• 항공우주 및 방위
• 광고
• 기타

아시아 태평양 SiC 전력 반도체 시장은 수직적 구조를 기준으로 자동차, 공익사업 및 에너지, 산업, 운송, IT 및 통신, 가전제품, 항공우주 및 방위, 상업 및 기타로 구분됩니다.

아시아 태평양 SiC 전력 반도체 시장 지역 분석/통찰력

아시아 태평양 SiC 전력 반도체 시장을 분석하고, 위에 참조된 대로 지역, 유형, 전압 범위, 웨이퍼 크기, 웨이퍼 유형, 응용 분야 및 수직별로 시장 규모에 대한 통찰력과 추세를 제공합니다.

아시아 태평양 SiC 전력 반도체 시장 보고서에서 다루는 국가는 일본, 중국, 한국, 인도, 호주 및 뉴질랜드, 홍콩, 대만, 싱가포르, 태국, 인도네시아, 말레이시아, 필리핀, 베트남, 그리고 기타 아시아 태평양 지역입니다.

2023년에는 중국이 국내 전자 시장 규모로 인해 아시아 태평양 SiC 전력 반도체 시장을 장악할 것으로 예상되며, 전체 산업의 생산 기지로서의 지위가 시장 성장을 견인하는 요인으로 작용할 것으로 예상됩니다.

보고서의 지역 섹션은 또한 현재 및 미래 시장 추세에 영향을 미치는 개별 시장 영향 요인과 시장 규제의 변화를 제공합니다. 하류 및 상류 가치 사슬 분석, 기술 추세, 포터의 5가지 힘 분석, 사례 연구와 같은 데이터 포인트는 개별 국가의 시장 시나리오를 예측하는 데 사용되는 몇 가지 포인터입니다. 또한 아시아 태평양 브랜드의 존재 및 가용성과 지역 및 국내 브랜드와의 대규모 또는 희소한 경쟁으로 인해 직면한 과제, 국내 관세의 영향 및 무역 경로가 지역 데이터의 예측 분석을 제공하는 동안 고려됩니다.

경쟁 환경 및 아시아 태평양 SiC 전력 반도체 시장 점유율 분석

아시아 태평양 SiC 전력 반도체 시장 경쟁 구도는 경쟁업체의 세부 정보를 제공합니다. 포함된 세부 정보는 회사 개요, 회사 재무, 창출된 수익, 시장 잠재력, 연구 개발 투자, 새로운 시장 이니셔티브, 아시아 태평양 지역 입지, 생산 현장 및 시설, 생산 용량, 회사의 강점과 약점, 제품 출시, 제품 폭과 범위, 애플리케이션 우세입니다. 위에 제공된 데이터 포인트는 아시아 태평양 SiC 전력 반도체 시장과 관련된 회사의 초점에만 관련이 있습니다.

아시아 태평양 SiC 전력 반도체 시장의 주요 기업으로는 WOLFSPEED, INC., STMicroelectronics, ROHM CO., LTD., Fuji Electric Co., Ltd., Mitsubishi Electric Corporation, Texas Instruments Incorporated, Infineon Technologies AG, Semikron Danfoss, Xiamen Powerway Advanced Material Co., Ltd., Renesas Electronics Corporation, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Microchip Technology Inc., Semiconductor Components Industries, LLC, NXP Semiconductors, UnitedSiC, SemiQ Inc., Littlefuse, Inc., Allegro MicroSystems, Inc., Hitachi Power Semiconductor Device, Ltd. (Hitachi Group의 자회사), GeneSiC Semiconductor Inc. 등이 있습니다.

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