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Global Advanced Packaging Technologies Market – Industry Trends and Forecast to 2028

Materials & Packaging | Upcoming Report | May 2021 | Global | 350 Pages | No of Tables: 220 | No of Figures: 60

Report Description

Global Advanced Packaging Technologies Market, By Technology (Active Packaging, Smart and Intelligent Packaging), End- User (Food, Beverages, Alcoholic Beverages, Non-Alcoholic Beverages, Pharmaceuticals, Industrial & Chemicals, Cosmetics & Personal Care, Agriculture, Others), Type (3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Fan Out Silicon in Package, Fan Out Wafer Lever Package, Wafer Level Chip Scale Package, Flip Chip, Others), Industry Vertical (Consumer Electronics, IT & Telecommunication, Industrial, Automotive & Transport, Healthcare, Aerospace & Defense, Others), Country (U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, U.A.E, Saudi Arabia, Egypt, South Africa, Israel, Rest of Middle East and Africa) Industry Trends and Forecast to 2028.


Market Analysis and Insights : Global Advanced Packaging Technologies Market

The advanced packaging technologies market will grow at a rate of 7.62% for the forecast period of 2021 to 2028. Rise in the awareness about its advantages over conventional packaging technologies drives the advanced packaging technologies market swiftly.

Advanced packaging is specially designed to improve the device performance by using integrated circuits which protect the metallic part from damaging. 3D integrated circuits, 2.5D integrated circuits among others are some of the common types of advanced packaging technologies. Different types of integrated circuits are manufactured as per the need of the packaging. They are extensively used in industries such as healthcare, automotive, aerospace, defense and others.

Rise in the research and development activities is the major factor escalating the market growth, also increase in the demand of these packaging from food and beverage industry, rise in the technological advancement and development in packaging technologies, rise in the demand for miniaturization of devices and increase in the improved system performances and optimization of advanced packaging are the major factors among others propelling the growth of advanced packaging technologies market. Moreover, rise in the emerging trends of fan-out wafer level packaging, and rise in the growth in packaged food industry in emerging economies will further create new opportunities for the advanced packaging technologies market in the in the forecast period of 2021- 2028.

However, rise in the problem related to the heating in devices and increase in the dearth of standardization are the major factors among others restraining the market growth, and will further challenge the growth of advanced packaging technologies market.

This advanced packaging technologies market report provides details of new recent developments, trade regulations, import export analysis, production analysis, value chain optimization, market share, impact of domestic and localised market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographical expansions, technological innovations in the market. To gain more info on the advanced packaging technologies market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.

Advanced Packaging Technologies Market Scope and Market Size

The advanced packaging technologies market is segmented on the basis of technology, end-user, type and industry vertical. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target markets.

  • On the basis of technology, the advanced packaging technologies market is segmented into active packaging and smart and intelligent packaging.
  • Based on end-user, the advanced packaging technologies market is segmented into food, beverages, alcoholic beverages, non-alcoholic beverages, pharmaceuticals, industrial & chemicals, cosmetics & personal care, agriculture and others.
  • Based on type, the advanced packaging technologies market is segmented into 3D integrated circuit, 2D integrated circuit, 2.5D integrated circuit, fan out silicon in package, fan out wafer lever package, wafer level chip scale package, flip chip and others.
  • The advanced packaging technologies market is also segmented on the basis of industry vertical into consumer electronics, IT & telecommunication, industrial, automotive & transport, healthcare, aerospace & defense and others.

Advanced Packaging Technologies Market Country Level Analysis

The advanced packaging technologies market is analysed and market size, volume information is provided by technology, end-user, type and industry vertical as referenced above.

The countries covered in the advanced packaging technologies market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, Israel, Egypt, South Africa, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.

North America dominates the advanced packaging technologies market due to rise in the government initiatives to propel the electronics & semiconductor manufacturing industry, increase in the demand of these packaging from food and beverage industry and rise in the technological advancement and development in packaging technologies in this region.

The country section of the advanced packaging technologies market report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as consumption volumes, production sites and volumes, import export analysis, price trend analysis, cost of raw materials, down-stream and upstream value chain analysis are some of the major pointers used to forecast the market scenario for individual countries. Also, presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.

Competitive Landscape and Advanced Packaging Technologies Market Share Analysis

The advanced packaging technologies market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to advanced packaging technologies market.

The major players covered in the advanced packaging technologies market report are ASE Group., Amkor Technology, Brewer Science, Inc, Siliconware Precision Industries Co., Ltd., JCET., SÜSS MICROTEC SE, IBM Corporation, COVERIS, Universal Instruments Corporation, Heidelberg Instruments, McKinsey & Company., Advanced Packaging Technology (M) Bhd, Veeco Instruments Inc., Boschman, CCL Industries., Jawla Advance Technology, ASM Pacific Technology, Orbotech Ltd., Taiwan Semiconductor Manufacturing Company Limited, ams AG and Naura-Akrion among other domestic and global players. Market share data is available for global, North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America separately. DBMR analysts understand competitive strengths and provide competitive analysis for each competitor separately.


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